AQ-2 spec book LR.pdf - 第39页

Standards 98/37/EC CE Machine directive 89/336/EEC CE EMC directive 73/23/EEC CE Low voltage directive SEMI S2 Safety standar d SEMI S8 Ergonomics standard SEMI E95 Human Interfaces standar d IP C 9850 Accur acy & sp…

Placement output

Component placement 0.68 sec./comp or 5300 UPH

uBGA, CSP, Flip Chip 1.02 sec./comp or 3530 UPH

IC placement 1.07 sec./comp or 3350 UPH

QFP placement 1.07 sec./comp or 3350 UPH

Odds & connectors 1.07 sec./comp or 3350 UPH

Note: AQ-2 output is calculated at best conditions. This excludes board transfer, board

alignment and badmark sense times.

Circuit boards

Board size (max) (L x W) 508 x 460 mm

Board size (min) (L x W) 50 x 50 mm

Board thickness 0.4 - 7 mm for PCB transport

0.4 - 11 mm for Auer boat transport

Pre mounted components Top side: < 25 mm

Bottom side: < 45 mm

Typical board exchange time < 1.9 sec transport;

< 1.5 sec alignment (3 fiducials)

Tolerances L/W ±0.5mm

Maximum L/W-ratio 1/3

Flatness Topside: bow max 0.6% of diagonal to max 1 mm,

bottom side: sag max 5 mm

Mass < 3 kg

Clearance 3mm free of SMD’s at two sides parallel at

direction of transportation for PCB transport

5 mm free of SMD’s at two sides parallel at

direction of transportation for Auer boat transport

4.3 Placement

output

Table 27

4.4 Circuit

boards

Table 28

Technical specifications

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Standards

98/37/EC CE Machine directive

89/336/EEC CE EMC directive

73/23/EEC CE Low voltage directive

SEMI S2 Safety standard

SEMI S8 Ergonomics standard

SEMI E95 Human Interfaces standard

IPC 9850 Accuracy & speed testing standard

Cleanroom class 1000 (1k)

CAMX / XML interface

SECS / GEM interface (if software option is installed)

SMEMA compliant

4.5 Standards

Table 29

4.6 Components

Table 30

Technical specifications

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Note: maximum component height without pre-mounted components

Components

SMD components 0201 up to QFP 45mm

Fine pitch components up to QFP 45mm (pitch > 0.3mm)

Odd components < 66 x 23mm (pitch > 0.3mm)

< 165 x 45mm

Grid arrays (BGA, MCM, etc.) up to 45mm (pitch > 0.5mm)

CSPs, uBGA, Flip Chips > 0.16mm pitch, > 0.08mm ball size,

Maximum number of balls: 3500

Component height up to 50mm

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5.0 Configuration

Figure 30

5.1 Configuration

flexibility

Table 31

5.2 AQ-2

System tree

Technical specifications

Configuration overview (top view)

For an optimal machine configuration, flexibility of module configuration is necessary.

The supported positions are listed:

For example: A AQ-2 Configuration can have a TEU on position A, LFOV on position B,

SFOV on position C and the Reject Module at position D

Figure 25 shows the AQ-2 System tree. Start at PA1251/20, the AQ-2 Basic system, and

follow the flow lines to determine the desired configuration for any specific application

and needs. Contact your Assembléon salesperson for more information.

Module Position(s) in configuration

Reject module A, C, D (one in configuration)

Component vision LFOV B, C (max. two in conf.)

Component vision SFOV B, C (max. two in conf.)

Toolbit exchange unit A, D (max. two in conf.)