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User Manual SIPLAC E CS 3 Technical data Software vers ion SR.101.xx 06/2003 US Edition 3.10 Vision modules 87 3.10 V isio n mod ules 3.10 .1 Desc riptio n Each placemen t system ha s – two componen t vision c ameras on …
3 Technical data User Manual SIPLACE CS
3.9 6-segment Collect&Place head Software version SR.101.xx06/2003 US Edition
86
3.9.1.1 Description
– The 6-segment Collect&Place head works using the "collect & place" principle, i.e. the compo-
nents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– All the components are inserted with the same cycle time. Before the component is inserted, it
is measured by the optoelectronic vision module.
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
– Defective components are rejected and are picked up again during a repair run.
3.9.1.2 Technical data
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Component range 0201 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Component specification
max. height
min. lead pitch
min. bump pitch
min. ball/bump diameter
min. dimensions
max. dimensions
max. weight
6 mm (10.7 mm available upon request)
0.5 mm
0.35 mm
0.2 mm
0.6 mm x 0.3 mm
18.7 mm x 18.7 mm
2 g
Maximum stroke of the Z-axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 10,000 comp/h
Nozzle types 9 xx
Angular accuracy ± 0,7° / 4 sigma
Placement accuracy ± 90 µm / 4 sigma
User Manual SIPLACE CS 3 Technical data
Software version SR.101.xx 06/2003 US Edition 3.10 Vision modules
87
3.10 Vision modules
3.10.1 Description
Each placement system has
– two component vision cameras on the placement heads and
– two PCB vision cameras on the underside of the X-axis gantries.
The vision analysis unit is located in the control unit for the placement system. The component
vision module is used to determine:
– the precise position of the components at the nozzle and
– the geometry of the package form.
The PCB vision camera uses fiducials on the PCBs to determine:
– the position of the PCB,
– its rotation angle
– and the PCB skew.
The PCB vision camera also uses fiducials on the feeders to determine the exact pick-up posi-
tion of components. This is particularly important for small components.
3 Technical data User Manual SIPLACE CS
3.10 Vision modules Software version SR.101.xx06/2003 US Edition
88
3.10.2 Component vision camera (standard camera) on the 6-segment
Collect&Place head
3.10.2.1 Structure
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Fig. 3.10 - 1 Component vision camera on the 6-segment Collect&Place head
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(1) Component camera, lens and illumination
(2) Camera amplifier
(3) Illumination control
3.10.2.2 Technical data
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Max. component dimensions 0.6 mm x 0.3 mm to 18.7 mm x 18.7 mm
Range of components 0201 to PLCC44
including BGA, µBGA, flip-chip, TSOP, QFP
PLCC, SO to SO32, DRAM
Min. lead pitch 0.5 mm
Minimum bump pitch 0.35 mm
Min. ball/bump diameter 0,2 mm
Field of vision 24 mm x 24 mm
Method of illumination Front-lighting (3 levels programable as required)