00198612-01_VD_SIPLACE_Pro_16.0_R18-2_DE_EN.pdf - 第17页
SIPLACE Pro 16.0 (R 18 - 2) / Version Desc ription 11/2018 Edition 17 Format: <device address> | <port> | <interface I D> A ll additional int erfaces per device lane are added as addition al rows in the…

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4.2 OSC Package Option – Enhancements
Detailed information on the OSC Package features can be found in the OSC Package User Guide,
item no. [00198374-xx].
The main enhancements made for the OSC Package Option in SIPLACE Pro are listed in the
overview below.
Pin in Paste Height Check for TH and CPP Placement Head
The height check is supported for the TH and CPP placement heads. The functionality is the same
as for the existing height measurement in the Snap-In detection for the Twin VHF placement head,
but the components have centering pins instead of board locks.
The height check can be activated by enabling the new Pin in Paste height check option in the
Handling tab of the Component Shape Editor. The option may only be enabled if the Standard
placement process has been selected. If the Pin in Paste height check option has been enabled,
a value may be entered for the Z-threshold. Default value = 500 µm.
Restrictions
– Not supported on SIPLACE CA4 and CA4 V2 placement machines.
– Only supported together with station software as of version 712.0. If the line does not contain
any station with station software >=712.0, the feature is ignored, and a warning displayed.
Increased Placement Force for TH Placement Head
The placement force has been increased to maximum 30 N for the TH placement head.
Restrictions
– Not supported on SIPLACE X-Series placement machines.
4.3 "IPC-HERMES-9852" – Interface ID
SIPLACE Pro supports the new Interface ID that has been implemented in the
"IPC-HERMES-9852" protocol for Hermes 1.1. This property is used to identify additional input or
output lanes of a special device. Additional lanes may e.g. be used to transport the board back to
the previous device or as output branches for faulty boards. The additional lanes must be
configured on the device itself.
Only the default lanes can be configured in SIPLACE Pro Desk (i.e. transport board from first to
last device on lane 1 or 2) but with the additional Interface ID property.
Figure 4-1: IPC-HERMES-9852 connection configuration dialog
If configured, the Interface ID will be appended to the connection string in the configuration check
result table on the Line Control GUI.

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Format: <device address> | <port> | <interface ID>
All additional interfaces per device lane are added as additional rows in the table.
Figure 4-2: Line Control GUI – Configuration check result table
4.4 Using Placements as Fiducials for Aligning Components
Some boards do not have precise fiducials or any fiducials at all. For these boards, the accuracy of
the components relative to each other is important but not the placements relative to the board. For
this, a special process has been introduced in SIPLACE Pro:
Four components which are using component shapes that are suitable for measuring are placed at
the first stopper of the first placement area. Thereafter, the machine will treat these four
placements as fiducials. For every stopper in every placement area, these four placements will be
measured as fiducials.
In the Board Editor, the process can be selected under Use placements as fiducials.
At least one component shape that shall be placed, must have a fiducial type assigned to it in the
Component Shape Editor. By this, it can be measured as fiducial.
The optimizer will select four placements from all placements of component shapes which can be
measured as fiducial and placements of a component which is set up fixed in the first placement
area.
The component shapes of the selected placements must be taught at the station.
4.5 CPP Placement Head – Increased Placement Force and
Component Weight
The placement force has been increased to maximum 15 N for the CPP placement head. The
component weight has been increased to 20 g in Pick&Place mode.
4.6 Smart Pin Support for SIPLACE TX V2 Series
The automatic Smart Pin Support option is supported for the SIPLACE TX V2-series placement
machines with two gantries – TX2 V2 and TX2 V2i. The fixed Smart Pin Magazine occupies the
tracks 1-6 on a new table type. As default, five pins per lane are required. Optionally, an additional
pin magazine can be put on the station.
The first nozzle magazine(s) of the nozzle changer on the left side cannot be used. If Smart Pin
Support is installed, the first stopper position is set to a negative value to reach all positions on the
board.
If Smart Pin Support is already installed in the target setup, it will be removed during the copy
function and must be added back manually.
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4.7 Long Board Option (LBO) for SIPLACE TX- and TX V2-Series
SIPLACE Pro supports the Long Board Option (LBO) on the SIPLACE TX- and SIPLACE TX V2-
Series placement machines.
The LBO must be set in the line configuration and in the setup in SIPLACE Pro.
The configured default offset for the reverse stopper is at position -380 mm and can be changed.
Additionally, the first stopper position can be changed from 0.0 to -70.0 mm (default -30.0; -70.0)
without having LBO activated. Thus, the boards can be stopped in case the entire length can be
supported by support pins.
Detailed information on the Long Board Option can be found in the LBO for SX1/SX2 V2 / TX-
Series / X-Series S User Manual, item no. [00197085-xx].
4.8 Station Behavior When Using Alternative Tracks
Alternative track means that one or more feeders are set up with the same component on a feeder
table. Alternative tracks are mainly used to avoid machine stoppages caused by pickup issues on
the main track, e.g. foil torn, late splicing.
To avoid half empty reels or the mixing of components from different reels on the board, the user
can select when the machine shall switch between main and alternative track.
A new option has been introduced to control the behavior of the station if a feeder can no longer
deliver a component, but the track did not run empty. The user can select the behavior for each
component. If Do not use alternative tracks if feeder empty is enabled for a component in the
Component Editor, the machine stops, and an error message is displayed at the station.
Alternative tracks are only supported together with ASM Setup Center.
4.9 Linear Dipping Unit 2 X / Linear Dipping Unit E – Enhancements
From this SIPLACE Pro version, multiple cavity depths can be used on the same dipping plate.
Optionally, the dip module can be equipped with a flux level sensor.
Two dipping plate types are supported:
– Multiple fixed depths – dipping plate with up to five different cavity depths.
– Round plate – dipping plate with one (round) cavity depth.
The Linear Dipping Unit 2 X supports multiple fixed depths. The Linear Dipping Unit E only
supports one fixed cavity depth. The round plate is compatible to the legacy dip module with a
round plate that was supported in previous versions and can only be set up on this dip module.
The dipping plate type and the dip flux material to be used by the dip module must be selected in
the Setup tree view. Two new parameters are available to specify the dip flux material: Dip margin
and Flux level sensor is active.
Additionally, the Dipping distance can be specified in the Component Shape Editor.
The placement sequence has been optimized so that no head cycle will be interrupted by
squeegee cycles.
Detailed information on the functionality of the Linear Dipping Unit 2 X and Linear Dipping Unit E
can be found in the respective User Manuals SIPLACE Linear Dipping Unit 2 X, item no.
[00198517-xx] and SIPLACE Linear Dipping Unit E, item no. [00198521].