2023-0002-ITEC_003_Product-catalogue-Jan-2023_LR.pdf - 第10页

10 ITEC - PRODUCT PORTFOLIO Redu ce yo ur to t al co s t of o wne r ship. G ain quali t y insp ec t ion s and the e x ibilit y t o sc ale - wi tho ut comp ro mising on a ccur ac y, quali t y, o r spe ed . T he A DA T 3 …

ADAT3 XF TAGLINER - HIGH-VOLUME RFID INLAY DIE BONDER

RFIDDIE ATTACH

Curing in milliseconds versus seconds in the current

industry practice, the ADAT3 XF Tagliner is three times

faster and 30% more accurate than anything on the

market. Common systems only work with transparent

web material; this Tagliner handles a diverse range,

including paper enabling you to move away from PET

plastics for sustainability. Eliminating manual handling

through automated wafer change and qualied for

die bond of all known ICs down to 200 μm die size, the

ADAT3 XF Tagliner performs a complete inspection

without sacricing speed and productivity.

For the highest productivity

and quality standard at the

lowest cost of ownership

Key features

Performance

• 48,000 units per hour with the machine

speed up to 50.8 mm web pitch

• High-precision die-attach

• Works with both transparent and

non-transparent web material

• High-precision glue dispense system

• High-speed thermal compression curing

system. Easy maintenance, one or two

units only

• 100% high-resolution optical inspections

on glue, die, attach and cure processes -

without compromising machine speed

• Process fully qualied for major chip

suppliers at the industry’s tightest

reliability requirements: temperature,

humidity, and mechanical

• 8 to 12 inches wafer compatible with

fully automatic wafer change

• Capable to handle dies down to 200 µm

• Single-track design for easy operation

and change over

• Integrated with BW Paper systems,

winding/conversion systems,

and Voyantic readers

Specications

Speed

• 48,000 units per hour ip chip

up to a web pitch of 50.8 mm

Die Range

• Die size: 200 x 200 µm to 5 x 5 mm

• Web width: 40 - 165 mm, single row

operation

Placement accuracy

• Die position: x, y: 1 σ < 9µm

• Die rotation: φ: 1 σ < 0.67°

• Pick and place force: 0.2 - 1.5 ± 0.1 N

Dispense accuracy

• Dot size accuracy: 1 σ < 10 µm

• Dot position accuracy: 1 σ < 10 µm

• Dot diameter: >200 µm

Cure system

• 2 stitch units, thermo compression cure

• Cure temperature range: 20 … 500 ± 5 °C

• Cure force range: 0 - 20 ± 0.5 N

• Cure time range: 0 - 5000 ms

QA vision inspections

• Glue dot size and -location

• Die top-side before attach

• Die bottom-side before attach

• Glue presence before attach

• Die presence before cure

• Die placement and rotation

Wafer handling

• 8 and 12 inches

• Steel/plastic Film Frame Carrier (FFC)

• Automatic wafer change

• Wafer expansion

• Automatic barcode reader

Subsystems

• BW Paper Systems

• Winder/Unwinder

• Voyantic Reader

Machine dimensions

• Length, width, height:

5397 x 1500 x 2617 mm

• Net weight: 5230 kg

ITEC - PRODUCT PORTFOLIO

Reduce your total cost of ownership. Gain quality

inspections and the exibility to scale - without

compromising on accuracy, quality, or speed. The ADAT3

XF PiXelect Bonder is four times faster than anything on

the market - handling LED as small as 3x5 mil. The ip-chip

bin-mixing technology eliminates the sorting step and

manual wafer change. Multiple systems can be connected

- enabling you to build competitive, high-denition, and

cost-eective displays using mini-LED technology.

Ready for next-generation

LED direct view displays

ADAT3 XF PIXELECT BONDER - HIGH-SPEED HIGH-ACCURACY MINI-LED

BONDER WITH FLIP-CHIP FUNCTION

MINI-LEDDIE ATTACH

Key features

Performance

• Bonding 70,000 units per hour

• Handles the smallest LED sizes

on the market

• Flip and non-ip conguration

at same speed

• Standard deviation XY position

better than 3 μm

• Handles sorted as well as EPI wafer

input (sorting and bonding integrated

in one step)

• 100% high-resolution optical inspections

on die, attach, and post-bond steps

without compromising on machine speed

• 8 inches Film Frame Carrier (FFC) ring

with fully automatic wafer change

• Can be congured for manual load as well

as conveyor belt interface with a series

of systems (Red/Green/Blue (RGB) line)

• Can handle R, G, B colours in single

machine with placement gap down

to 20 μm

Specications

Speed

• 70,000 units per hour ip-chip bonding

Die Range

• Length, width: 75 x 125 μm to 2.5 x 2.5 mm

• Aspect Ratio: 1:1 - 1:3

• Thickness: 50 - 400 μm

Substrate range

• Minimum: 75 x 75 x 0.1 mm

• Maximum: 250 x 250 x 0.2 mm

Placement Accuracy

• Die position: x, y: 1 σ < 3µm

• Die rotation: φ: 1 σ < 1°

• Pick and place force: 0.2…1.5 ± 0.1 N

Pick up tooling

• Vespel collet

• Rubber tip

• Four-sided collet

• Push-up needle

Substrate Handling

• Manual

• Optional conveyor belt interface with

a series of machines (RGB line)

QA Vision Inspections

• Pre-pick inspection (wafer): Die alignment.

Frontside chipping. Wafer map alignment

• Pre-pick inspection (PKG carrier):

PKG alignment

• Frontside chipping. Carrier map alignment

• Post-pick (transfer): Die present.

Die alignment

• Pre-bond inspection on substrate:

Bond pad alignment

• Post-bond inspection incl. substrate

recognition: Die placement

Wafer handling

• Handling R, G, B wafers: EPI or Sorted

• 8 inches Film Frame Carrier (FFC) ring

• Automatic wafer change

• Wafer expansion

• Automatic barcode reader

Automation

• Full die traceability (full strip mapping)

• Auto recipe download (MES interface)

• Monitoring of critical process parameters

during production. Automatic stop function

when parameter out of control

• Servo, bond-force and vacuum auto-

diagnostics functionality to check health

status of the machine

Machine dimensions

• Length, width, height:

2050 x 1280 x 2100 mm

• Net weight: 1850 kg

Eliminate power products’ lengthy test times for enhanced

output. This is the modular parameter test system for

power discrete semiconductor devices up to 12 leads.

The standard conguration has a maximum supply and

current per channel of 400V and 30A. Through its modular

architecture, this can be extended with a high voltage unit

of 2kV and a high current unit of 200A. µPARSET software

gathers data about measured devices and produces

various insights for product quality, stability, and yield

optimization.

The benchmark in analog

power testing

POWER µPARSET - DISCRETE POWER TESTER

TEST

Key features

Target segments

• Back-end nal test

• Wafer test

High performance

• Handler and prober agnostic

• 1 to 4 handlers

• Multi-site testing

• Short test times

• Pin electronics (voltage and current

measurement on all pins simultaneously)

• Maximum number of pins: (FT and AT/QT):

6 or 12 pins

• High-quality diagnostics and calibration

• High accuracy

• User-denable parameters

Test heads

• Current amplier for fast leakage

measurement

• Short and open pins close to DUT

• Dedicated test hardware

Embedded software

• User-denable parameters

• Visual ITEC: user-denable operator

interface

• Automatic multi-site expansion

• Scope function

• V and I waveforms and timing

on all channels

• Real-time diagnostics

• Curve traces

Specications

Maximum supply and current per channel

• 400 V / 30 A

Small footprint

• 600 x 665 x 1235mm

Other

• Extendable test heads for adding handlers

• Maximum: 12 leads

• Voltage: 220-240 VAC +/- 5%, 1-phase

• Current: Fused on 16 A

• Frequency: 50/60 Hz +/- 0.5 Hz

• Handler Interface: GPIB, TTL, RS232,

TCP/IP

• Optional SECS/GEM interface following

SEMI standard

Extendable software

• Equipment control for multiple test cells

• Post-processing

• Dynamic Part Average Test

• Static Part Average Test

• Moving Limits

• Nearest neighbourhood residual

Optional extension modules

• Qs: reverse recovery charge

(30 nC / 300 nC / 3 uC)

• Gate resistance and capacitance

(Rg/Cg) extension

• µPHV: high voltage test (2 kV)

• µPHC: high current unit (200 A)

• µPDI: digital interface 2 x 16 channels

fully oating

• SECS/GEM interface