2023-0002-ITEC_003_Product-catalogue-Jan-2023_LR.pdf - 第6页

6 ITEC - PRODUCT PORTFOLIO T he only pr odu c t in th e mar ket o  er ing an in -lin e st r ip- to - s t rip die b ond er solu t ion . T he A DAT3 X F DB S r ec eiv es st r ips dir e c tly f r om on e machin e, pr oc es…

ADAT3 XF DBSG - STRIP GLUE DIE BONDER

DIE BONDER / DIE SORTERDIE ATTACH

Eliminate the trade-o between quality and productivity

with high-denition inspection executed on the y

without any speed penalty. At four times faster than

anything on the market, this is the industry’s leading

strip-to-strip die bonder for leaded or leadless packages

with glue or DAF/WBC applications. The ADAT3 XF DBSG

eliminates manual wafer change and speed drop, plus is

capable of handling die as small as 0.2 x 0.2 mm.

Future-ready for

next-generation dies

Key features

Performance

• Up to 60,000 units per hour

• Supports 8 to 12 inches wafer

on frame lm carrier

Strip size

• 100 x 300 mm

• Glue/DAF/WBC

Die size

• Minimal: 0.2 x 0.2 mm

• Maximum: 5 x 5 mm

• High throughput at high-volume

manufacturing rate

• 4 cassettes at output or optional

at input autoloader

• Full die traceability (strip E142 – wafer)

• Auto recipe download (MES interface)

• SECS/GEM interface with E142

• QFN, DFN, HVQFN, SOT, SO, TSSOP,

LGA leadless and leaded packages

Specications

Speed

• Up to 60,000 units per hour, depending

on die size, lead frame pitch, glue type

and selected quality inspections

Die Range

• Length, width: 0.2 x 0.2 mm to 5 x 5 mm

• Aspect Ratio: 1:1 - 1:3

• Thickness: 50 - 400 um

Lead frame size

• Minimum length, width: 100 x 40 mm

• Maximum length, width: 300 x 100 mm

• Thickness: 0.1 - 1.0 mm

System accuracy

• Small die (≤ 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ ≤ 1˚

• Large die (> 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ ≤ 0.3˚

• Pick and place force: 0.2 - 1.5 ± 0.1 N

Inspection categories

• Program mode: fast programming

for common reject criteria

• Reject treatment: strip map (E142)

and reject bin

• Inspection view: 4 cameras, (1) glue,

(2) pre-pick, (3) back, (4) post-bond

Inspection items

• Die-related: top chipping, backside chipping.

Damaged. Die size/die ratio. Scratch.

Cracked die. Discoloration

• Glue-related: Drop size. Drop shape

• Post-bond related: Die alignment

(position, size, rotation). Glue llet

Automation

• Wafer map SEMI E142 format,

SECS-GEM MPA exchange

• Start and reference die functionality

• Automatic Product Replacement

• MES Interface including auto recipe

download

• Monitoring of critical process parameters

during production. Automatic stop function

when parameter out of control

• Servo, bond-force and vacuum auto-

diagnostics functionality to check

health status of the machine

Machine dimensions

• Length, width, height:

3000 x 2100 x 1250 mm

(without magazine loader)

• Length, width, height:

3500 x 2100 x 1250 mm

(with magazine loader)

• Net weight: 3000 kg

(without magazine loader)

• Net weight: 3300 kg

(with magazine loader)

Pick up tooling

• Vespel collet

• Rubber tip

• Four-sided collet

• Push-up needle

Wafer handling

• Wafer size: 6 - 12 inches

• Wafer frame: 8 - 12 inches

• Steel/Plastic Film Frame Carrier (FFC)

• Foil Tension: programmable expander

(8 inches: 1-10 mm; 12 inches: 1 - 15 mm)

• Automatic wafer change and expander

• Automatic barcode reader

Lead frame handling

• Stack loader including paper separation

• Magazine loader/unloader: maximum

4 magazines at load and unload 20 - 40

slots per

• Magazine size: Minimum length, width,

height: 100 x 45 x 80 mm. Maximum length,

width, height: 305 x 110 x 270 mm

Dispense

• Twin cross writing module,

volumetric dispense

• Dot/Cross size, resolution: ≥ 250 um 1 σ 10 µm

• Dot/Cross position: 1 σ ≤ 20 µm

Imaging system

• Number of cameras: 4

• Resolution/Field of View (FOV) glue: 0.3 MP

camera (3.2 UM/pixel), FOV 2.1 x 1.4 mm

• Resolution/ Field of View (FOV) pick-up

and backside: 5.0 MP camera (2.3 UM/

pixel), FOV 5.6 x 4.7 mm

• Resolution/ Field of View (FOV) post-bond:

5.0MP camera (4.6 UM/pixel), FOV 11.3 x

9.4 mm

• Resolution/ Field of View (FOV) sidewall:

optional

• Minimal object detection:

10 micrometres (μm)

• Lighting: coaxial and ring light,

including multicolour light

ITEC - PRODUCT PORTFOLIO

The only product in the market oering an in-line strip-

to-strip die bonder solution. The ADAT3 XF DBS receives

strips directly from one machine, processes them, and

feeds them to the next - maximizing your productivity.

Handling ultra-small and medium die at unparalleled

speed, it easily connects to top and bottom screen-

print equipment. This die bonder is also equipped with

automated wafer change and high-denition optics

for on-the-y quality inspection.

A breakthrough in cost,

quality, and productivity

ADAT3 XF DBS - HIGH-SPEED IN-LINE STRIP-TO-STRIP DIE BONDER

DIE BONDER / DIE SORTERDIE ATTACH

Key features

Performance

• Up to 60,000 units per hour

• Supports 8 to 12 inches wafer

on frame lm carrier

Strip size

• 100 x 300 mm

• Solder paste/Glue

•

Die size

• Minimal: 0.2 x 0.2 mm

• Maximum: 7 x 9 mm

• High throughput at high-volume

manufacturing rate

• Belt in, belt out

• Full die traceability (strip E142 – wafer)

• Auto recipe download: Manufacturing

Execution System (MES) interface

• SECS/GEM interface with E142

• Solder paste power application, SO8,

DPAK, and SOD123/128 SOT669

Specications

Speed

• Up to 60,000 units per hour (depending on

die size, lead frame pitch, glue/solder type

and selected quality inspections)

Die Range

• Length, width: 0.2 x 0.2 mm to 7 x 9 mm

• Aspect Ratio: 1:1 - 1:3

• Thickness: 50 - 400 µm

Lead frame size

• Minimum length, width: 100 x 40 mm

• Maximum length, width: 300 x 100 mm

• Thickness: 0.1 - 1.0 mm

System accuracy

• Small die (< 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ ≤ 1˚

• Large die (> 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ ≤ 0.3˚

• Pick and place force: 0.2-1.5 ± 0.1 N

Wafer handling

• Wafer size: 6 - 12 inches

• Wafer frame: 8 - 12 inches

• Steel/Plastic Film Frame Carrier (FFC)

• Foil Tension: programmable expander

(8 inches: 1 - 10 mm, 12 inches: 1 - 15 mm)

• Automatic wafer change and expander

• Automatic barcode reader

Lead frame handling

• Conveyor belt loading and unloading

according SMEMA protocol

Pick up tooling

• Vespel collet

• Rubber tip

• Four-sided collet

• Push-up needle

Imaging system

• Number of cameras: 4

• Resolution/Filed of View (FOV) glue: 0.3 MP

camera (3.2 UM/pixel), FOV 2.1 x 1.4 mm

• Resolution/ Filed of View (FOV) pick-up and

backside: 5.0 MP camera (2.3 UM/pixel),

FOV 5.6 x 4.7 mm

• Resolution/ Filed of View (FOV) post-bond:

5.0MP camera (4.6 UM/pixel), FOV 11.3 x

9.4 mm

• Resolution/ Filed of View (FOV)

sidewall: optional

• Minimal object detection:

10 micrometres (μm)

• Lighting: coaxial and ring light,

including multicolor light

Inspection categories

• Program mode: fast programming

for common reject criteria

• Reject treatment: strip map (E142)

and reject bin

• Inspection view: 4 cameras, (1) glue, (2)

pre-pick (3) back, (4) post-bond

Inspection items

• Die-related: Top chipping, backside

chipping. Damaged. Die size/die ratio.

Scratch. Cracked die. Discoloration

• Glue-related: Drop size. Drop shape

• Post-bond related: Die alignment

(position, size, rotation). Glue llet

Automation

• Wafer map SEMI E142 format,

SECS-GEM mpa exchange

• Start and reference die functionality

• Automatic Product Replacement

• MES Interface including auto recipe

download

• Monitoring of critical process parameters

during production. Automatic stop function

when parameter out of control

• Servo, bond-force and vacuum auto-

diagnostics functionality to check

health status of the machine

Machine dimensions

• Length, width, height:

2200 x 2100 x 1250 mm

• Net weight: 1950 kg

ADAT3XF DS - DIE SORTER (IN-LINE)

DIE BONDER / DIE SORTERDIE ATTACH

Gain maximum productivity at the lowest costs. At 20%

faster than anything in the market, this is the die sorter

for wafer-level CSP/micro CSP applications. It handles the

smallest die with automatic wafer change. The ADAT3 XF

DS also inspects all six sides of the die without any speed

penalty, securing quality in this critical last process step -

without compromising productivity or cost.

Future-ready for

next-generation die

Key features

Performance

• Up to 60,000 units per hour

• Supports 8 to 12 inches wafer

on frame lm carrier

Tape width

• 8 - 12 mm

• Sidewall inspection

Die size

• Minimal: 0.2 x 0.4 mm

• Maximal: 5 x 5 mm

• High throughput at high-volume

manufacturing rate

• APR auto-product replace

• In-tape inspection

• Automatic reel changer: optional

• Full die traceability: tape – wafer

• Auto recipe download (MES interface)

• SECS/GEM interface with E142

Specications

Speed

• Up to 60,000 units per hour ip or non-ip

Die Range

• Length, width: 0.4 x 0.2 mm to 5 x 5 mm

• Aspect Ratio: 1:1 - 1:3

• Thickness: 50 - 400 μm

Tape handling

• Width: 8 - 12 mm

• Pitch: 2 - 8 mm

• Thickness: 0.18 - 0.5 mm

• Tape specication: embossed carrier tape

with pocket hole, punch tape, paper tape,

surf tape

• Hot sealing: maximum temp 200 °C,

maximum force 10 - 80 Newton (N)

• Auto reel change, auto tape cutter

System accuracy

• Small die (< 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ < 1˚

• Large die (> 1 mm): XY: 1 σ xy ≤ 5 μm.

Rotation: 1 σ φ < 0.3˚

Wafer handling

• Wafer size: 6 - 12 inches

• Wafer frame: 8 - 12 inches

• Steel/Plastic Film Frame Carrier (FFC)

• Foil Tension: programmable expander

(8 inches: 1 - 10 mm, 12 inches: 1 - 15 mm)

• Automatic wafer change and expander

• Automatic barcode reader

Imaging system

• Number of cameras: 5

• Resolution/Field of View (FOV) pick-up

and backside: 5.0 MP camera

(2.3 UM/pixel), FOV 5.6 x 4.7 mm

• Resolution/ Field of View (FOV)

post-bond: 5.0MP camera (4.6 UM/pixel),

FOV 11.3 x 9.4 mm

• Resolution/ Field of View (FOV)

sidewall: 12.3MP camera (2.3 UM/pixel),

FOV 9.4 x 6.9 mm

• Resolution/ Field of View (FOV)

Die ON FLIP: 5.0 MP camera (2.3 UM/pixel),

FOV 5.6 x 4.7 mm

• Resolution/ Field of View (FOV)

post-seal inspection: 1.3 MP (3.7 UM/pixel)

FOV 9.7 mm

• Post-seal inspection: seal-line , index hole,

empty, tilted, body outline, product code,

marking, chipping

• Minimal object detection:

10 micrometres (μm)

• Lighting: red ring, coaxial,

and back panel light

Inspection categories

• Program mode: fast programming

for common reject criteria

• Reject treatment: strip-tape map (E142)

and reject bin

• Inspection view: 5 cameras, (1) pre-pick,

(2) back and sidewall, (3) front/bump,

(4) post-bond, (5) post-seal

Inspection items

• Die top-related: top chipping,

backside chipping

• Damaged. Die size/die ratio. Scratch.

Cracked die

• Discoloration. Bump inspections (size/

connected/missing)

• Backside related: Die alignment (position,

size, and rotation). Backside chipping

• Surface inspection: Punch through

inspection. Laser mark inspection. Pin A1

Automation

• Wafer map SEMI E142 format,

SECS-GEM mpa exchange

• Start and reference die functionality

• Automatic product replacement

• MES Interface including auto recipe

download

• Monitoring of critical process parameters

during production

• Automatic stop function when parameter

out of control

• Servo, bond-force and vacuum auto-

diagnostics functionality to check health

status of the machine

Machine dimensions

• Length, width, height:

2200 x 2100 x 1250 mm

• Net weight: 1850 kg