2023-0002-ITEC_003_Product-catalogue-Jan-2023_LR.pdf - 第8页
8 ITEC - PRODUCT PORTFOLIO T he Ree l-t o -Re el Eu t ec t ic D ie Bon der supp or t s all wa fe r map f or mat s and i s des igne d wi t h high- de ni t ion op t ic s fo r small -to - medium di scr e t e pr oduc t s a …
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ADAT3XF DS - DIE SORTER (IN-LINE)
DIE BONDER / DIE SORTERDIE ATTACH
Gain maximum productivity at the lowest costs. At 20%
faster than anything in the market, this is the die sorter
for wafer-level CSP/micro CSP applications. It handles the
smallest die with automatic wafer change. The ADAT3 XF
DS also inspects all six sides of the die without any speed
penalty, securing quality in this critical last process step -
without compromising productivity or cost.
Future-ready for
next-generation die
Key features
Performance
• Up to 60,000 units per hour
• Supports 8 to 12 inches wafer
on frame lm carrier
Tape width
• 8 - 12 mm
• Sidewall inspection
Die size
• Minimal: 0.2 x 0.4 mm
• Maximal: 5 x 5 mm
• High throughput at high-volume
manufacturing rate
• APR auto-product replace
• In-tape inspection
• Automatic reel changer: optional
• Full die traceability: tape – wafer
• Auto recipe download (MES interface)
• SECS/GEM interface with E142
Specications
Speed
• Up to 60,000 units per hour ip or non-ip
Die Range
• Length, width: 0.4 x 0.2 mm to 5 x 5 mm
• Aspect Ratio: 1:1 - 1:3
• Thickness: 50 - 400 μm
Tape handling
• Width: 8 - 12 mm
• Pitch: 2 - 8 mm
• Thickness: 0.18 - 0.5 mm
• Tape specication: embossed carrier tape
with pocket hole, punch tape, paper tape,
surf tape
• Hot sealing: maximum temp 200 °C,
maximum force 10 - 80 Newton (N)
• Auto reel change, auto tape cutter
System accuracy
• Small die (< 1 mm): XY: 1 σ xy ≤ 5 μm.
Rotation: 1 σ φ < 1˚
• Large die (> 1 mm): XY: 1 σ xy ≤ 5 μm.
Rotation: 1 σ φ < 0.3˚
Wafer handling
• Wafer size: 6 - 12 inches
• Wafer frame: 8 - 12 inches
• Steel/Plastic Film Frame Carrier (FFC)
• Foil Tension: programmable expander
(8 inches: 1 - 10 mm, 12 inches: 1 - 15 mm)
• Automatic wafer change and expander
• Automatic barcode reader
Imaging system
• Number of cameras: 5
• Resolution/Field of View (FOV) pick-up
and backside: 5.0 MP camera
(2.3 UM/pixel), FOV 5.6 x 4.7 mm
• Resolution/ Field of View (FOV)
post-bond: 5.0MP camera (4.6 UM/pixel),
FOV 11.3 x 9.4 mm
• Resolution/ Field of View (FOV)
sidewall: 12.3MP camera (2.3 UM/pixel),
FOV 9.4 x 6.9 mm
• Resolution/ Field of View (FOV)
Die ON FLIP: 5.0 MP camera (2.3 UM/pixel),
FOV 5.6 x 4.7 mm
• Resolution/ Field of View (FOV)
post-seal inspection: 1.3 MP (3.7 UM/pixel)
FOV 9.7 mm
• Post-seal inspection: seal-line , index hole,
empty, tilted, body outline, product code,
marking, chipping
• Minimal object detection:
10 micrometres (μm)
• Lighting: red ring, coaxial,
and back panel light
Inspection categories
• Program mode: fast programming
for common reject criteria
• Reject treatment: strip-tape map (E142)
and reject bin
• Inspection view: 5 cameras, (1) pre-pick,
(2) back and sidewall, (3) front/bump,
(4) post-bond, (5) post-seal
Inspection items
• Die top-related: top chipping,
backside chipping
• Damaged. Die size/die ratio. Scratch.
Cracked die
• Discoloration. Bump inspections (size/
connected/missing)
• Backside related: Die alignment (position,
size, and rotation). Backside chipping
• Surface inspection: Punch through
inspection. Laser mark inspection. Pin A1
Automation
• Wafer map SEMI E142 format,
SECS-GEM mpa exchange
• Start and reference die functionality
• Automatic product replacement
• MES Interface including auto recipe
download
• Monitoring of critical process parameters
during production
• Automatic stop function when parameter
out of control
• Servo, bond-force and vacuum auto-
diagnostics functionality to check health
status of the machine
Machine dimensions
• Length, width, height:
2200 x 2100 x 1250 mm
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• Net weight: 1850 kg
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ITEC - PRODUCT PORTFOLIO
The Reel-to-Reel Eutectic Die Bonder supports all wafer
map formats and is designed with high-denition optics
for small-to-medium discrete products at extreme
speed. With die alignment, backside chipping, die size
measurement, and optional sidewall inspection for at
collets, the ADAT3 XF DBRE guarantees to enhance your
production, product quality, and total cost of ownership.
For a fully automated,
hands-o operation to increase
your uptime and output
ADAT3 XF DBRE - REEL-TO-REEL EUTECTIC DIE BONDER
DIE BONDER / DIE SORTERDIE ATTACH
Key features
Post-attach inspection
• Die present
• Lead frame alignment XY
• Black die detection
• Surface inspection as a roadmap element
Wafer handling
• Auto wafer change
• Wafer expansion
• Auto barcode reader
• Extensive wafer mapping and wafer
alignment functionality
Automation
• Wafer map formats: Market standards.
Full wafer map
• Wafer map alignment: Start and reference
die functionality.
• Auto equipment setup: via Semiconductor
Equipment Communication Standard
(SECS) / Generic Equipment Model (GEM)
• Traceability: ID input by barcode scanning
Specications
Speed
• 48,000 dies per hour with roadmap
to 60,000 dies per hour for small dies
(≤ 0.4 x 0.4 mm)
Product size
• 200 x 200 um to 5 x 5 mm
Lead frame size
• Up to 32 mm wide
Connectivity
• Connectivity via Semiconductor Equipment
Communication Standard (SECS) / Generic
Equipment Model (GEM) for automated
set-up and die traceability
• Automatic FFC wafer change for hands-o
operation (AEC-Q101 compliant)
• Flexible platform for all applications
• Fits in XF (Extended Flexibility) platform
architecture Reel-to-Reel lines
• Convertible to other XF (Extended
Flexibility) applications for leaded and
leadless to cater for product mix exibility
• Optional lead frame, anti-tarnish,
outgassing module
System accuracy
• Small die (≤ 0.4 x 0.4 mm)
• XY: 1 σ_xy ≤ 10 μm
• Rotation: 1 σ_φ < 1˚
Wafer handling
• Wafer diameter: 8 inches, 6 inches
on 8 inches Film Frame Carrier (FFC)
• Wafer frame: Steel Film Frame Carrier
(FFC) 8 inches or 12 inches
• Foil tension: 8 inches, 1 - 10 mm
• Wafer cassette: up to 25 slots
Die handling
• Process Temperature: maximum 470 °C
• Pickup force: 0.4 - 1.5 N ±0.1 N, Ultra-low
(programmable) pickup force (20 grams)
• Bond force: 0.2 - 1.5 N ±0.1 N
• Mixed gas: customer-specic
• Collet: pyramidal, at
• Ejector tool: single needle
Machine dimensions
• Machine length, width, height:
2050 x 1250 x 2200 mm
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• Net weight: 1850 kg
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ADAT3 XF TAGLINER - HIGH-VOLUME RFID INLAY DIE BONDER
RFIDDIE ATTACH
Curing in milliseconds versus seconds in the current
industry practice, the ADAT3 XF Tagliner is three times
faster and 30% more accurate than anything on the
market. Common systems only work with transparent
web material; this Tagliner handles a diverse range,
including paper enabling you to move away from PET
plastics for sustainability. Eliminating manual handling
through automated wafer change and qualied for
die bond of all known ICs down to 200 μm die size, the
ADAT3 XF Tagliner performs a complete inspection
without sacricing speed and productivity.
For the highest productivity
and quality standard at the
lowest cost of ownership
Key features
Performance
• 48,000 units per hour with the machine
speed up to 50.8 mm web pitch
• High-precision die-attach
• Works with both transparent and
non-transparent web material
• High-precision glue dispense system
• High-speed thermal compression curing
system. Easy maintenance, one or two
units only
• 100% high-resolution optical inspections
on glue, die, attach and cure processes -
without compromising machine speed
• Process fully qualied for major chip
suppliers at the industry’s tightest
reliability requirements: temperature,
humidity, and mechanical
• 8 to 12 inches wafer compatible with
fully automatic wafer change
• Capable to handle dies down to 200 µm
• Single-track design for easy operation
and change over
• Integrated with BW Paper systems,
winding/conversion systems,
and Voyantic readers
Specications
Speed
• 48,000 units per hour ip chip
up to a web pitch of 50.8 mm
Die Range
• Die size: 200 x 200 µm to 5 x 5 mm
• Web width: 40 - 165 mm, single row
operation
Placement accuracy
• Die position: x, y: 1 σ < 9µm
• Die rotation: φ: 1 σ < 0.67°
• Pick and place force: 0.2 - 1.5 ± 0.1 N
Dispense accuracy
• Dot size accuracy: 1 σ < 10 µm
• Dot position accuracy: 1 σ < 10 µm
• Dot diameter: >200 µm
Cure system
• 2 stitch units, thermo compression cure
• Cure temperature range: 20 … 500 ± 5 °C
• Cure force range: 0 - 20 ± 0.5 N
• Cure time range: 0 - 5000 ms
QA vision inspections
• Glue dot size and -location
• Die top-side before attach
• Die bottom-side before attach
• Glue presence before attach
• Die presence before cure
• Die placement and rotation
Wafer handling
• 8 and 12 inches
• Steel/plastic Film Frame Carrier (FFC)
• Automatic wafer change
• Wafer expansion
• Automatic barcode reader
Subsystems
• BW Paper Systems
• Winder/Unwinder
• Voyantic Reader
Machine dimensions
• Length, width, height:
5397 x 1500 x 2617 mm
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• Net weight: 5230 kg