QLF08_LaBel.pdf - 第32页
IC and Component Selection for Space Sy stems – Presented by Kenneth A . LaBel 32 Current Radiation Hardening Considerations Category Generic CMOS T echnology CA SA FPGA RH A vailability Poor Niche vendors for RH; Commer…

IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
31
Selection Criteria: Radiation and Reliability
• While there is no “generic” answer for radiation
tolerance and reliability levels in the trade, there
are numerous considerations such as
– What is known of the process radiation tolerance?
• Was process/device radiation qualification sufficient for
planned design or application?
– Library? Cells? Speed? Etc…
• Is the process reliable and achieving good yield?
– High-volume commercial fab vs. low-volume niche fab?
• Are there lot-specific or application-specific concerns?
– Is there a specific performance requirement such as
reconfigurability or ultra-low power that forces a non-
radiation tolerant device selection?
• How does a fault-tolerant system architecture enter the
equation?
– How testable is the design/device?
• As has become more evident, trade spaces are
much more complex than “just” an IC

IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
32
Current Radiation Hardening Considerations
Category Generic CMOS
Technology
CA SA FPGA
RH Availability
Poor Niche vendors
for RH;
Commercial
would rely on
RHBS and
RHBD
Niche vendors –
none currently
available, but
several vendors
are developing
Limited, but new
developments
underway
TID
RHBS; improving
with scaling
RHBS, RHBD,
RHBP
RHBS, RHBP,
partial RHBD
RHBS
SEE
RHBS – not;
increasing
sensitivity; SOI?
RHBS, RHBD,
RHBP
(substrate)
RHBS, RHBD
partial, RHBP
(substrate)
RHBS
Notes
IP: Limited RH IP
available;
Commercial IP?
Commercial
manufacturers
working soft error
rate (SER) issues
RH levels can be
“tuned” via
RHBD or RHBP;
Difficult for
radiation testing
Circuit tiles can
incorporate
mitigation
options
External and
internal SEE
mitigation (TMR,
scrubbing,
reconfiguration,
etc) for logic and
configuration

IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
33
Related SOC Radiation and Reliability
Considerations
New Silicon
-90nm CMOS
-new materials
New Architectures
-new interconnects
-new power distribution
-new frequencies
New Design Flows/Tools
-programming algorithms, application
-design rules, tools, simulation, layout
-hard/soft IP instantiation
New Package
-Inspection
-Lead free
New Workmanship
-inspection, lead free
-stacking, double-sided
-signal integrity
New Board Material
-thermal coefficients
-material interfaces
New Connectors
-higher-speed, lower noise
-serial/parallel
BEWARE! Support circuitry (power, memory, IO, etc) can often be
limiting factor for system reliability and radiation performance