QLF08_LaBel.pdf - 第33页
IC and Component Selection for Space Sy stems – Presented by Kenneth A . LaBel 33 Related SOC Radiation and Reliability Considerations New Silicon -90nm CMOS -new materials New Architectures -new interconnects -new power…
IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
32
Current Radiation Hardening Considerations
Category Generic CMOS
Technology
CA SA FPGA
RH Availability
Poor Niche vendors
for RH;
Commercial
would rely on
RHBS and
RHBD
Niche vendors –
none currently
available, but
several vendors
are developing
Limited, but new
developments
underway
TID
RHBS; improving
with scaling
RHBS, RHBD,
RHBP
RHBS, RHBP,
partial RHBD
RHBS
SEE
RHBS – not;
increasing
sensitivity; SOI?
RHBS, RHBD,
RHBP
(substrate)
RHBS, RHBD
partial, RHBP
(substrate)
RHBS
Notes
IP: Limited RH IP
available;
Commercial IP?
Commercial
manufacturers
working soft error
rate (SER) issues
RH levels can be
“tuned” via
RHBD or RHBP;
Difficult for
radiation testing
Circuit tiles can
incorporate
mitigation
options
External and
internal SEE
mitigation (TMR,
scrubbing,
reconfiguration,
etc) for logic and
configuration
IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
33
Related SOC Radiation and Reliability
Considerations
New Silicon
-90nm CMOS
-new materials
New Architectures
-new interconnects
-new power distribution
-new frequencies
New Design Flows/Tools
-programming algorithms, application
-design rules, tools, simulation, layout
-hard/soft IP instantiation
New Package
-Inspection
-Lead free
New Workmanship
-inspection, lead free
-stacking, double-sided
-signal integrity
New Board Material
-thermal coefficients
-material interfaces
New Connectors
-higher-speed, lower noise
-serial/parallel
BEWARE! Support circuitry (power, memory, IO, etc) can often be
limiting factor for system reliability and radiation performance
IC and Component Selection for Space Systems – Presented by Kenneth A. LaBel
34
Summary of Generalized Features –
ASICs versus FPGAs
Category SRAM -
FPGA
OTP FPGA SA CA
NRE
Low Low Med High
Production Cost
High High Med High
Risk
Low Low Med High
Development
Span (TTM)
Low Low Med High
Electrical
Performance
Low Low Med High
Density/Capacity
Low Low Med High
Power
Consumption
High Med Med Low
Flexibility
High Med Med Low
Radiation
Performance
Low Med High High