Specification SIPLACE CA-Series2014版.pdf - 第25页

25 PCB Warpage PCB warpage during placement PCB warpage downwards, max. 0.5 mm Use magnetic pin supports to achieve this value. When there is warpage under 2 mm, the inkspots in the center of the board a re also within t…

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PCB Warpage
PCB warpage across the direction of travel
max. 1 % of the PCB diagonal, but not
exceeding 2 mm
PCB warpage during transportation
Fixed clamped edge
Movable clamping device
PCB
Fixed clamped edge
Conveyor belt
PCB transport direction
Front board edge
Front board edge
PCB warpage in direction of travel + PCB thickness < 5.5 mm
Bending up of front board edge max. 2.5 mm
Left conveyor belt
Right conveyor belt
PCB transport direction
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PCB Warpage
PCB warpage during placement
PCB warpage downwards, max. 0.5 mm
Use magnetic pin supports to achieve this
value.
When there is warpage under 2 mm, the
inkspots in the center of the board are also
within the focus of the digital camera. When
all the tolerances are taken into account,
this value is reduced to 1.5 mm.
You should also note that the warpage also
reduces the component height.
Magnetic pin support
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Sample Configuration
Services
As an additional service,
ASM can provide complete
integration of your SIPLACE
CA machine in your produc-
tion line. With our extensive
expertise and by using the
right tools and equipment,
we can ensure that the instal-
lation process runs smoothly
and efficiently.
However, this requires that
you clarify the infrastructure
aspects in advance and
make any necessary chang-
es at your production facility.
Safety instructions
Read the operating instruc-
tions before starting to set up
and commission the place-
ment machine. The applica-
ble accident prevention
regulations concerning the
transportation of heavy
goods must be followed.
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