Specification SIPLACE CA-Series2014版.pdf - 第60页
60 Option List Placement Machine Available options CA4 Notes PCB alignment, single conveyor X PCB alignment, dual conveyor X Long board X 1D PCB barcode scanner X 2D PCB barcode scanner X PCB barcode scanner assembly kit…
59
Technical Data
Transportation and Delivery Conditions for SWS
Transport dimensions and weight
Means of transport
A fork-lift truck with the following specification will be needed
to carry the machine in its crate:
Length
Width
Height
1700 mm
1250 mm
1600 mm
Weight
SWS
Dispatch Dispatch
within Europe overseas
390 kg 473 kg
Fork length
Lifting power
Clear fork width
Min. 1800 mm
Min. 1500 kg
Min. 350 mm
Description
Within Europe, the machine
is delivered on a robust
wooden pallet. If sent over-
seas, the SWS is packaged
in a wooden crate.
Attachment point
for the fork-lift
60
Option List
Placement Machine
Available options CA4 Notes
PCB alignment, single conveyor X
PCB alignment, dual conveyor X
Long board X
1D PCB barcode scanner X
2D PCB barcode scanner X
PCB barcode scanner assembly kit X
SIPLACE SpeedStar C&P 20 M X
SIPLACE MultiStar CPP X
SIPLACE TwinStar X
Magnetic pin support X
03015/01005 components X
Component camera, type 30 X Only MultiStar CPP
Component camera, type 41 X Only SpeedStar C&P20 M
Stationary component camera, type 33 (fine
pitch)
X Only MultiStar CPP and TwinStar
With restrictions (see Configuration Over-
view on page 62.
Stationary component camera, type 25 (flip
chip)
X Only TwinStar
With restrictions (see Configuration Over-
view on page 62
Component camera, type 34 X
High Force Head X
Vision teach place X
Nozzle Changers X
Sensor for the component reject bin X
SIPLACE X-Series Component Trolley X
Splice point recognition for X feeder mod-
ules
X
Tray holder for SIPLACE X X Only SpeedStar C&P20 M
Support for an additional tape reel
SIPLACE X-series
X
X-Series feeder module adapter X
Linear Dipping Unit (LDU-X) X
Feeder module cover flap X
110/208 V conversion kit X
Vacuum pump X
Vacuum pump connection kit X
Embedded Wafer Level Ballgrid Array
(eWLB)
X On request
Wafer Level Fan Out (WLFO) - on request Incl. Chuck and Chiller on request
MTC Without stationary camera at location 2 and
location 4 on request
61
Option List
SWS
Available options SWS Notes
SIPLACE wafer transfer system (table: 1,3)
X
SIPLACE wafer transfer system (table: 2,4)
X
Adapter FF070 & FF 090 on standard frame FF 108
X
Adapter hoop ring 4" on FF 108
X
Adapter hoop ring 6" on FF 108
X
Adapter hoop ring 8" on FF 108
X
SIPLACE wafer expansion unit for 8" and 12" wafers
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 8" for standard frame (table: 1,3)
X
Wafer holder 8" for standard frame (table: 2,4)
X
Wafer holder 12" for standard frame (table: 1,3)
X
Wafer holder 12" for standard frame (table: 2,4)
X
Multi needle eject system 3.5 x 3.5 mm min. needle pitch
X
Multi needle eject system 2.0 x 2.0 mm min. needle pitch
X
Small Die Eject System On request
Component handling standard, field of view: 12 mm x 12 mm
X
Component handling small die, field of view: 5 x 5mm,
eject tool small die
On request
SIPLACE Linear Dipping Unit (LDU-X)
X
Integrated into the SWS:
Only one LDU per location.
Standard flux pot for LDU-X
X
SIPLACE CA LDU cavity plates, 20 - 400µm in 10µm steps
X
SIPLACE WS die attach unit
X
Nozzle changer C&P 20
X
One bank in row 2
Row 1 on request