Specification SIPLACE CA-Series2014版.pdf - 第62页
62 Configuration Overview Head configurations Placemen t head types SIPLACE S peedS tar (C&P20 M) SIPLACE MultiS tar (CPP) SIPLACE T winS tar (TH) a a) Not with SWS Placement area 1 Placement area 2 C&P20 M C&…
61
Option List
SWS
Available options SWS Notes
SIPLACE wafer transfer system (table: 1,3)
X
SIPLACE wafer transfer system (table: 2,4)
X
Adapter FF070 & FF 090 on standard frame FF 108
X
Adapter hoop ring 4" on FF 108
X
Adapter hoop ring 6" on FF 108
X
Adapter hoop ring 8" on FF 108
X
SIPLACE wafer expansion unit for 8" and 12" wafers
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 8" for standard frame (table: 1,3)
X
Wafer holder 8" for standard frame (table: 2,4)
X
Wafer holder 12" for standard frame (table: 1,3)
X
Wafer holder 12" for standard frame (table: 2,4)
X
Multi needle eject system 3.5 x 3.5 mm min. needle pitch
X
Multi needle eject system 2.0 x 2.0 mm min. needle pitch
X
Small Die Eject System On request
Component handling standard, field of view: 12 mm x 12 mm
X
Component handling small die, field of view: 5 x 5mm,
eject tool small die
On request
SIPLACE Linear Dipping Unit (LDU-X)
X
Integrated into the SWS:
Only one LDU per location.
Standard flux pot for LDU-X
X
SIPLACE CA LDU cavity plates, 20 - 400µm in 10µm steps
X
SIPLACE WS die attach unit
X
Nozzle changer C&P 20
X
One bank in row 2
Row 1 on request
62
Configuration Overview
Head configurations
Placement head
types
SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
a
a) Not with SWS
Placement area 1 Placement area 2
C&P20 M C&P20 M C&P20 M C&P20 M
C&P20 M C&P20 M CPP CPP
CPP CPP CPP CPP
C&P20 M C&P20 M CPP TH
CPP CPP CPP TH
Configurations/options C&P20 M CPP
a
a) MultiStar CPP only in high assembly position
TwinStar
SWS Flip-Chip X X
b
b) Collect&Place mode only
--
SWS Die Attach X X
b
--
LDU on X table X X X
LDU on SWS X X
Nozzle Changers X
c
c) 6 magazines with 72 nozzle garages
XX
d
d) Max. 12 magazines for max. 24 nozzle garages, each with 2 nozzle holders at location 1 and 3
Max. 10 magazines for max. 20 nozzle garages, each with 2 nozzle holders at location 2 and 4
Stationary camera, type 25 (flip chip) -- -- X
e
e) Only at locations 1 and 3 and not with SWS
Component camera, type 30 -- X --
Component camera, type 41 X -- --
Stationary camera, type 33 (fine pitch) -- X
e
X
e
Component camera, type 34 X X X