Specification SIPLACE CA-Series2014版.pdf - 第35页

35 Vision Sensor Technology PCB Position Recognition Bad Board Recognition Ink spot criteria Methods • Synthetic fiducial recogn ition method • Mean grayscale value • Histogram method • Template matching Shapes and sizes…

Vision Sensor Technology

PCB Position Recognition

Description

Different fiducial shapes

prove to be optimal depend-

ing on the condition of the

surface. When using bare

copper surfaces with low oxi-

dation, it is advisable to take

the single cross, as the high

amount of information pro-

vided helps achieve the

greatest accuracy. Rectan-

gle, square and circle are

less "informative" but save

space and can even be used

when oxidation is at an

advanced stage. Circle or

square are advisable for tin-

plated structures as the ratio

of the fiducial dimensions to

the presolder thickness is

particularly favorable.

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X/Y position, rotation angle, mean PCB distortion

Additional: shearing, distortion separately in X and Y direc-

tion

Locate 2 fiducials

X/Y position, rotation angle without stretch

a) Option: Wafer Level Fan Out (WLFO)

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-

mond, circular, square and rectangular contours, double

cross, pattern: any

Fiducial surface:

Copper

Tin

Without oxidation and solder resist

Warpage of fiducial ≤ 1/10 of structure width, both with good

contrast to environment

Dimensions of patterns

Min. size

Max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there

is no similar fiducial structure in the search area

Dimensions of synthetic fiducials

Min. X/Y size for circle and rectangle: 0.25 mm

Min. X/Y size for annulus and rectangle: 0.3 mm

Min. X/Y size for cross: 0.3 mm

Min. X/Y size for double-cross: 0.5 mm

Min. X/Y size for rhombus: 0.35 mm

Min. frame width for annulus and rectangle: 0.1 mm

Min. bar width / bar distance for cross, double-cross: 0.1 mm

Max. X/Y size for all fiducial shapes: 3 mm

Max. bar width for cross, double-cross: 1.5 mm

Min. tolerances, general: 2% of nominal dimension

Max. tolerances, general: 20% of nominal dimension

Vision Sensor Technology

PCB Position Recognition

Bad Board Recognition

Ink spot criteria

Methods • Synthetic fiducial recognition method

• Mean grayscale value

• Histogram method

• Template matching

Shapes and sizes of fiducials/structures for

synthetic fiducials

Other methods

For dimensions of synthetic fiducials, see page

Min. 0.3 mm

Max. 5 mm

Masking material Good coverage

Recognition time Depends on the method: 20 ms - 200s

Description

In the cluster technology

each subpanel is assigned

an ink spot. If this is present

during the measurement via

the PCB vision module, the

corresponding subpanel is

populated. This function

helps prevent unnecessary

costs caused by placement

of defective panels.

Technical data board position recognition

PCB fiducials

Local fiducials

Library memory f. recognition of

bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option (Optional PCB fiducials

are output by the optimization.)

up to 2 per PCB (may be of different type)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (singular feature) based on gray-

scale values

Illumination mode Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 mm x 5.78 mm

Virtual ink spot handler (optional from station software 705)

The virtual ink spot handler enables you to import ink spots from an external system. These ink

spots can then be assigned to the relevant board.

03015/01005 Placement

In its standard version, the

SIPLACE X-Series is

designed for placement of

03015 (0.3 mm x 0.15 mm)

and 01005 components (0.4

mm x 0.2 mm).

The SIPLACE component

library already contains the

contours and dimensions of

03015 or 01005 compo-

nents. Specially developed

component nozzles of type

1005 are also available for

the SIPLACE CA-Series.

These are adjusted to the

shape and size of the 03015

or 01005 components and

have - as with all other

SIPLACE nozzles - a highly

wear-proof ceramic tip and

flexible nozzle seat. This

guarantees maximum preci-

sion and process reliability.

Optimized pickup is guaran-

teed by the ideal feeding

conditions in the SIPLACE X

feeder module. The smaller

the elements to be picked up,

the more accurate the pickup

needs to be.

Pickup is performed contact-

free to compensate minor

inaccuracies e.g. from com-

ponent or pocket tolerances

and to prevent mechanical

damage to the components.

The design of the SIPLACE

X feeder modules takes this

problem into account: new

motors and the reduced use

of fine mechanics help. Small

components can be placed

without performance loss

with minimum pitch and irre-

spective of the larger compo-

nents which are next to the

03015 or 01005 component.

This equates to true 03015

or 01005 capability. As a

rule with 03015 or 01005

placement, a finely tuned

overall process is the basic

requirement if you want to

achieve excellent results.

All the process parameters

must be optimized. The

SIPLACE team will be

pleased to advise you on

how to do this.

03015/01005 measurement

results and ambient condi-

tions

As the dpm values and

pickup rates for 03015 or

01005 placement depend

greatly on the respective

measuring conditions, it is

not advisable to specify

these without considering the

corresponding ambient con-

ditions.

The following table shows typical values for 01005 placement,

which can be achieved with a SIPLACE CA 4, provided the rel-

evant underlying conditions are fulfilled:

Machine type SIPLACE CA4

Placement head SpeedStar with component camera

type 41

Nozzle type 1005 (SpeedStar)

Feeder module type 4mm SIPLACE X feeder module

8mm SIPLACE X feeder module

2x8mm SIPLACE X feeder module

Station software From 708.0

SIPLACE Pro From 12.0

Pickup rate ≥ 99.97%

Dpm rate ≤ 5

Pad width ≥ 200 µm

Pitch ≥ 100 µm

Components (L x W x H) 400 µm x 200 µm x 200 µm (±20 µm)

Number of pixels for a

01005 component

275

Solder paste type 5

Template thickness 60 µm