IPC 7525B-2011 中文版 模板设计指导(钢网设计指南).pdf - 第4页
此页留 作 空白 Copyright Association Connecting Electronics Industries Provided by IHS Markit under license with IPC Licensee=Sanmina SCI Corp - Loc 8, 14, 15, 17, 18, 20, 23,/5964569001, User=Jin, Not for Resale, 04/13/2018 2…
IPC-7525B CN
模板设计指导
本标准由 IPC 组装与连接工艺委员会（5-20）模板设计任
务组（5-21e）开发；由 IPC TGAsia 5-21eC 技术组翻译
鼓励本标准的使用者参加未来修订版的开发。
联系方式：
IPC
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Tel 847 615.7100
Fax 847 615.7105
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电话：400-621-8610
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网址：www.ipc.org.cn
上海青岛深圳北京苏州成都
取代：
IPC-7525A – 2007年2月
IPC-7525 – 2000年5月
If a conflict occurs
between the English
and translated versions
of this document, the
English version will
take precedence.
本文件的英文版本与翻
译版本如存在冲突, 以
英文版本为优先。
®
Copyright Association Connecting Electronics Industries
Provided by IHS Markit under license with IPC
Licensee=Sanmina SCI Corp - Loc 8, 14, 15, 17, 18, 20, 23,/5964569001, User=Jin,
Not for Resale, 04/13/2018 21:19:06 MDT
No reproduction or networking permitted without license from IHS
--`,`,,,,`,,`,,,,,,``,,,,,,``,``-`-`,,`,,`,`,,`---
此页留作空白
Copyright Association Connecting Electronics Industries
Provided by IHS Markit under license with IPC
Licensee=Sanmina SCI Corp - Loc 8, 14, 15, 17, 18, 20, 23,/5964569001, User=Jin,
Not for Resale, 04/13/2018 21:19:06 MDT
No reproduction or networking permitted without license from IHS
--`,`,,,,`,,`,,,,,,``,,,,,,``,``-`-`,,`,,`,`,,`---
鸣谢
任何包含复杂技术的标准都要有大量的资料来源。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面
仅列出组装与连接工艺委员会（5-20）模板设计任务组（5-21e）的主要成员。然而，我们不得不提到 IPC TGAsia
5-21eC 技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了艰苦的劳动。我们在此
一并对上述各有关组织和个人表示衷心的感谢。
组装与连接⼯艺委员会 模板设计任务组 IPC董事会技术联络员
主席
Leo Lambert
EPTAC Corporation
联合主席
William E. Coleman, Ph.D
Photo Stencil Inc.
George Oxx
Jabil Circuit, Inc. (HQ)
Dongkai Shangguan
Flextronics International
Shane Whiteside
TTM Technologies
模板设计任务组
Russell owland, Alcatel-Lucent
Christopher Sattler, AQS - All Quality
& Services, Inc.
Ricky Bennett, Assembly Process
Technologies
Jay Hinerman, BAE Systems CI Div.
Ron Tripp, Cookson Electronics
Jeff Schake, DEK International
Craig Brown, DEK USA Inc.
Richard Lieske, DEK USA Inc.
Glenn Dody, Dody Consulting
Robert Dervaes, FCT Assembly
Michael Yuen, Foxconn
CMMSG-VPD
Deepak Pai, General Dynamics
Info. Sys., Inc
Joseph Brown, Hewlett-Packard
Co- ProCurve etworking
Jan Kilen, HP Etch AB
Rongxiang Yang, Huawei
Technologies Co., Ltd.
Chris Anglin, Indium Corporation
of America
Tim Jensen, Indium Corporation
of America
William Kunkle, MET Associates Inc.
Holly Wise, MicroScreen, LLC
Robert Cass, orthrop Grumman
Amherst Systems
William May, SWC Crane
arinder Kumar, Pelco by Schneider
Electronics
Todd Woods, Photo Stencil Inc.
Dale Kratz, Plexus Corporation
Timothy Pitsch, Plexus Corporation
Robert Rowland, RadiSys Corporation
Guillermo Velazquez, Rain Bird
Corporation
David elson, Raytheon Company
Jeff Shubrooks, Raytheon Company
Mark Quealy, Schneider Automation
Inc.
Steve Sangillo, Swemco
Daan Terstegge, Thales ederland
B.v. Huizen
Richard Lathrop
Ahne Oosterhof
2011年10月 IPC-7525B-C
iii
Copyright Association Connecting Electronics Industries
Provided by IHS Markit under license with IPC
Licensee=Sanmina SCI Corp - Loc 8, 14, 15, 17, 18, 20, 23,/5964569001, User=Jin,
Not for Resale, 04/13/2018 21:19:06 MDT
No reproduction or networking permitted without license from IHS
--`,`,,,,`,,`,,,,,,``,,,,,,``,``-`-`,,`,,`,`,,`---