00197400-02_VD_SIPLACE_Pro_11.2_DE_EN.pdf - 第13页
SIPLACE Pro V11. 2 / Soft ware Ver sion Desc ription A usga be 05/2014 Edit ion 13 3.3 Supporte d Feeder T y pes The f ollowing feed ers are s upport ed by SI PLACE Pro : – 4 mm – 104 mm X - feeder – 2x8 mm X - feeder – …
SIPLACE Pro V11.2 / Software Version Description Ausgabe 05/2014 Edition
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Platform Station Software
Version
Machine Types
504 HF
503 HS50
HS50+ (optional)
HS60
S25HM
S27HM
502 HS50
S25HM
Plattform I 408 S23
F5HM
CS
CF
407 S20
S23
F4
F4-6
F5
F5HM
C-Series 408 CF
CS
101 CF
CS
SIPLACE Pro V11.2 / Software Version Description Ausgabe 05/2014 Edition
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3.3 Supported Feeder Types
The following feeders are supported by SIPLACE Pro:
– 4 mm – 104 mm X-feeder
– 2x8 mm X-feeder
– 16 mm XN-feeder
– 12 V2 X-feeder
– Surftape AX (8 mm, 12 mm, 16 mm)
– LED feeder TE
LED feeder HS
– Glue Feeder
– SIPLACE JTF-S (X-series S and SX1/SX2 V2 only)
– SIPLACE JTF-M (X-series S, X4i S micron and SX1/SX2 V2 only)
– Arbitrary Carrier X (X-series only )
– Carrier X (XTH) (X2, X3, X4 on location 2 and 4 only)
– Carrier SX (SX1/SX2 with Twin Head and CPP head only)
– FFI feeders:
Data IO RoadRunners
– IPTE Multi Stick Feeder:
IPTE multi stick 60 AX
IPTE multi stick XL80 AX
– Stick feeder with X-adapter
– Label feeder with X-adapter
– Reject conveyor with X-adapter
– Dip module for X-tables (LDU_X)
– MTC2 (X2, X3, X4 on location 2 and 4, X2 S, X3 S, X4 S on location 2)
– WPC5 / WPC6 (SX1/SX2, X-series S on location 2)
– SIPLACE Wafer Systems 12 1&2 and 12 2&4 (CA-series only)
– Splice sensor X-feeder
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4 Features of SIPLACE Pro 11.2
If not differently described, the features of the previous SIPLACE Pro versions are contained in
SIPLACE Pro 11.2. The main features of SIPLACE Pro 11.2 are listed below.
NOTICE
Detailed information about the single functions can be found in the Online Help for
SIPLACE Pro.
4.1 Twin Head / CPP Placement Heads on SIPLACE CA-Series
Additionally to the C&P20 M placement head, the CPP and Twin Head (also Twin Head HF)
placement heads are supported on the SIPLACE CA-series placement machines as of this
SIPLACE Pro version with the following restrictions:
– Stationary cameras can only be installed on the locations 1 and 3.
– The Twin Head can only be installed on location 3.
– The CPP placement head is only supported in the high position on SIPLACE Wafer Systems.
CPP placement head
The CPP placement head can be used in Pick&Place mode and on SIPLACE Wafer Systems as
well. FlipChip and DieAttach modes are supported on the SIPLACE Wafer Systems. Dip modules
may be used.
The nozzle changer for the CPP placement head has 5 magazines for 20xx nozzles with 12
garages each and 1 magazine for 28xx nozzles with 9 garages. If desired, this configuration may
be changed, e.g. 6 magazines for 20xx nozzles.
The 33 component camera type is supported for placement in Pick&Place mode and the 30
component camera type on SIPLACE Wafer Systems.
Twin Head
The Twin Head is used in Pick&Place mode only.
The nozzle changer for the Twin Head has maximum 12 magazines with 2 garages each on the
locations 1 and 3 and maximum 10 magazines with 2 garages each on the locations 2 and 4.
The 33 and 25 component camera types are supported.
Available placement head configurations on SIPLACE CA-series
4*C&P20 M
2*C&P20 M in PA1 and 2*CPP in PA2
4*CPP
2*C&P20 M in PA1 and CPP / TH in PA2
2*CPP in PA1 and CPP / TH in PA2