00197400-02_VD_SIPLACE_Pro_11.2_DE_EN.pdf - 第14页

SIPLACE Pro V11. 2 / Soft ware Ver sion Desc ription A usga be 05/2014 Edit ion 14 4 Featur es of SIP L A CE Pro 11.2 If not diff erentl y described, the f eatures of the prev ious SIPLA CE Pro versions are conta ined in…

SIPLACE Pro V11.2 / Software Version Description Ausgabe 05/2014 Edition

3.3 Supported Feeder Types

The following feeders are supported by SIPLACE Pro:

– 4 mm – 104 mm X-feeder

– 2x8 mm X-feeder

– 16 mm XN-feeder

– 12 V2 X-feeder

– Surftape AX (8 mm, 12 mm, 16 mm)

– LED feeder TE

LED feeder HS

– Glue Feeder

– SIPLACE JTF-S (X-series S and SX1/SX2 V2 only)

– SIPLACE JTF-M (X-series S, X4i S micron and SX1/SX2 V2 only)

– Arbitrary Carrier X (X-series only )

– Carrier X (XTH) (X2, X3, X4 on location 2 and 4 only)

– Carrier SX (SX1/SX2 with Twin Head and CPP head only)

– FFI feeders:

Data IO RoadRunners

– IPTE Multi Stick Feeder:

IPTE multi stick 60 AX

IPTE multi stick XL80 AX

– Stick feeder with X-adapter

– Label feeder with X-adapter

– Reject conveyor with X-adapter

– Dip module for X-tables (LDU_X)

– MTC2 (X2, X3, X4 on location 2 and 4, X2 S, X3 S, X4 S on location 2)

– WPC5 / WPC6 (SX1/SX2, X-series S on location 2)

– SIPLACE Wafer Systems 12 1&2 and 12 2&4 (CA-series only)

– Splice sensor X-feeder

SIPLACE Pro V11.2 / Software Version Description Ausgabe 05/2014 Edition

4 Features of SIPLACE Pro 11.2

If not differently described, the features of the previous SIPLACE Pro versions are contained in

SIPLACE Pro 11.2. The main features of SIPLACE Pro 11.2 are listed below.

NOTICE

Detailed information about the single functions can be found in the Online Help for

SIPLACE Pro.

4.1 Twin Head / CPP Placement Heads on SIPLACE CA-Series

Additionally to the C&P20 M placement head, the CPP and Twin Head (also Twin Head HF)

placement heads are supported on the SIPLACE CA-series placement machines as of this

SIPLACE Pro version with the following restrictions:

– Stationary cameras can only be installed on the locations 1 and 3.

– The Twin Head can only be installed on location 3.

– The CPP placement head is only supported in the high position on SIPLACE Wafer Systems.

CPP placement head

The CPP placement head can be used in Pick&Place mode and on SIPLACE Wafer Systems as

well. FlipChip and DieAttach modes are supported on the SIPLACE Wafer Systems. Dip modules

may be used.

The nozzle changer for the CPP placement head has 5 magazines for 20xx nozzles with 12

garages each and 1 magazine for 28xx nozzles with 9 garages. If desired, this configuration may

be changed, e.g. 6 magazines for 20xx nozzles.

The 33 component camera type is supported for placement in Pick&Place mode and the 30

component camera type on SIPLACE Wafer Systems.

Twin Head

The Twin Head is used in Pick&Place mode only.

The nozzle changer for the Twin Head has maximum 12 magazines with 2 garages each on the

locations 1 and 3 and maximum 10 magazines with 2 garages each on the locations 2 and 4.

The 33 and 25 component camera types are supported.

Available placement head configurations on SIPLACE CA-series

4*C&P20 M

2*C&P20 M in PA1 and 2*CPP in PA2

4*CPP

2*C&P20 M in PA1 and CPP / TH in PA2

2*CPP in PA1 and CPP / TH in PA2

SIPLACE Pro V11.2 / Software Version Description Ausgabe 05/2014 Edition

4.2 C&P20 P Placement Head on SIPLACE X-Series S

The C&P20 P placement head was introduced for the SIPLACE X4i S placement machine in the

previous SIPLACE Pro version. As of the current SIPLACE Pro version, this placement head is

additionally supported on the SIPLACE X2 S, X3 S and X4 S placement machines.

The C&P20 P placement head is supported on the same locations as the C&P20 A placement

head and uses the same component camera types (23 and 41), too.

The 4xxx nozzle type is supported on all locations.

4.3 WPC5/WPC6 on SIPLACE X-Serie S

SIPLACE Pro supports the option to put a WPC5/WPC6 with the new WPC 40 X X-table on the

X2 S, X3 S and X4 S placement machines. However, the hardware will not be released for series

production in this version.

The WPC5/WPC6 and the WPC 40 X table occupy the tracks 11 – 40. Other modules, such as X-

feeders / processing feeders may be set up on the tracks 1 – 10.

The WPC 40 X can be selected and configured for location 2 in the Setup Editor. A single

WPC5/WPC6 cannot be configured without the X-table. An XFCU must have been installed.

The Twin Head and CPP placement heads and the new CPP 20xx28xx 4, CPP 20xx 4 and

TwinFlexible nozzle changers are supported for this option.

SIPLACE Smart Pin Support supports the option on the X3 S and X4 S placement machines.

4.4 SIPLACE X4i S micron – Enhancements

CPP placement head and SIPLACE JTF-M feeder

As of this SIPLACE Pro version, the CPP placement head and the SIPLACE JTF-M feeder are

supported on the SIPLACE X4i S micron placement machine.

Placement process for component type 03015

When placing components of the 03015 type, the user is guided through a similar placement

process as for the 01005 component type on the SIPLACE X4i S micron placement machine.

If the 03015 placement process is selected in the Component Shape Editor, the required process

parameters such as cameras, nozzles, travel profiles and placement forces will be set

automatically.