IPC-7721(S).pdf - 第12页
Conductor Cut Procedure Description Illustration Product Class Skill Level Level of Conformance 4.3.1 Conductor Cut, Surface Conductors R, F Advanced High 4.3.2 Conductor Cut, Inner Layer Conductors R, F Advanced High 4.…
Conductor Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.2.1 Conductor Repair, Foil Jumper,
Epoxy Method
R, F, C Advanced Medium
4.2.2 Conductor Repair, Foil Jumper,
Film Adhesive Method
R, F, C Advanced High
4.2.3 Conductor Repair, Weld Method R, F, C Advanced High
4.2.4 Conductor Repair, Surface Wire
Method
R, F, C Intermediate Medium
4.2.5 Conductor Repair Through Board
Wire Method
R Advanced Medium
4.2.6 Conductor Repair/Modification,
Conductive Ink Method
R, F, C Expert Medium
4.2.7 Conductor Repair, Inner Layer
Method
R, F Expert High
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Conductor Cut
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.3.1 Conductor Cut, Surface
Conductors
R, F Advanced High
4.3.2 Conductor Cut, Inner Layer
Conductors
R, F Advanced High
4.3.3 Deleting Inner Layer Connection
at a Plated Hole, Drill Through
Method
R, F Advanced High
4.3.4 Deleting Inner Layer Connection
at a Plated Hole, Spoke Cut
Method
R, F Advanced High
Lifted Land Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.4.1 Lifted Land Repair, Epoxy Method R, F Advanced Medium
4.4.2 Lifted Land Repair, Film Adhesive
Method
R, F Advanced Medium
Land Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.5.1 Land Repair, Epoxy Method R, F Advanced Medium
4.5.2 Land Repair, Film Adhesive
Method
R, F Advanced High
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Edge Contact Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.6.1 Edge Contact Repair, Epoxy
Method
R, F, W, C Advanced Medium
4.6.2 Edge Contact Repair, Film
Adhesive Method
R, F, W, C Advanced High
4.6.3 Edge Contact Repair, Plating
Method
R, F, W, C Advanced High
Surface Mount Pad Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.7.1 Surface Mount Pad Repair, Epoxy
Method
R, F, C Advanced Medium
4.7.2 Surface Mount Pad Repair, Film
Adhesive Method
R, F, C Advanced High
Plated Hole Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
5.1 Plated Hole Repair, No Inner
Layer Connection
R, F, W Intermediate High
5.2 Plated Hole Repair, Double Wall
Method
R, F, W Advanced Medium
5.3 Plated Hole Repair, Inner Layer
Connection
R Expert Medium
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