IPC-7721(S).pdf - 第5页
Foreword IPC’ s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues. In this regard document sets are used to provide the total information related to a pa…
The Principles of
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the Printed Board Repair Task
Group (7-34a) of the Institute for Interconnecting and Packaging Electronic
Circuits.
Copyright © 1998 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1998. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
Foreword
IPC’s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues.
In this regard document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0) (i.e., IPC-7710).
This standard is intended to provide information on the rework, repair and modification of printed boards and electronic
assemblies. This information must also be supplemented by a performance specification that contains the requirements for
the chosen technology. When used together, these documents should lead both manufacturer and customer to consistent
terms of acceptability.
These documents supersede the following:
IPC-7711 supersedes IPC-R-700C
IPC-7721 supersedes IPC-R-700C
As technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-
ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completion
of ‘‘Suggestions for Improvement’’ forms at the end of each document.
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the
IPC Printed Board Repair Task Group (7-34a) of the Product Assurance Committee are shown below, it is not possible to include
all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.
Product Assurance
Committee
Printed Board Repair
Task Group
Technical Liaison of the
IPC Board of Directors
Chairman
Mike Hill
Viasystems Technologies Corp.
Chairman
Jeff Ferry
Circuit Technology
Center, Inc.
Vice Chairman
Christine Miller
FORE Systems,
Inc.
Peter Murphy
Parlex Corporation
A Special Note of Appreciation
The following core group has
volunteered much of their time and
have made significant contributions
to this document.
Blakley, Peggi, NSWC Crane
Brock, Ron, NSWC Crane
Day, Jennifer, Accutek Inc.
Ferry, Jeff, Circuit Technology
Center, Inc.
Foster, Daniel L., PACE Inc.
Hersey, Ralph J., Ralph Hersey &
Associates
Hopkins, Reed, Metcal Inc.
Houghton, F.D. Bruce, Celestica
Corporation
Miller, Christine A., FORE
Systems Inc.
Moffitt, James H., EMPF
Norton, John S., Tektronix Inc.
Siegel, Eric, PACE, Inc.
Printed Board Repair Task Group
Anderson, Kari, Hughes Technical
Services Co.
Aoki, Masamitsu, Toshiba Chemical
Corp.
Bates, Timothy E., DSC
Communications Corporation
Bergum, Erik J., Polyclad Laminates
Blakley, Peggi, NSWC Crane
Boerdner, Richard W., EJE Research
Bogert, G.L., Westinghouse Electric
Brock, Ron, NSWC Crane
D’Andrade, Derek, Surface Mount
Technology Centre
Daugherty, Dale, Siemens Energy &
Automation
Day, Jennifer, IEC - Arab Alabama
Dehne, Rodney, O.E.M. Worldwide
Dutcher, Nancy, U.S. Assemblies
Hallstead Inc.
Etheridge, Thomas R., McDonnell
Douglas Aerospace
Ferry, Jeff, Circuit Repair Corporation
Fieselman, Charles D., IBM Corp.
Foster, Daniel L., Pace Inc.
Foust, Skip, Solectron Technology Inc.
Griffiths, William F., Plessey Tellumat
South Africa
Hargreaves, Larry, DC. Scientific Inc.
Herrberg, Steven A., Hughes Defense
Communications
Hersey, Ralph J., Ralph Hersey &
Associates
Hiett, Carol E., Lockheed Martin
Astronautics
Ho, David P., Circuit Graphics Ltd.
Hopkins, Reed, Metcal Inc.
Houghton, F. D. Bruce, Celestica
Hymes, Les, Les Hymes Associates
Johnson, Laurence G., General Electric
Co.
Kern, Terence, Axiom Electronics, Inc.
Konsowitz, Robert J., Glasteel
Industrial Laminates
Korth, Connie M., Hibbing Electronics
Corp.
Lambert, Leo P., EPTAC Corporation
Lee, Frederic W., Northrop Grumman
Norden Systems
MacLennan, Karen E., M/A-COM Inc.
Maher, Peter E., Kimball Electronics
Group
Malewicz, Wesley R., Siemens Medical
Systems Inc.
Mastorides, John, Lucas Aerospace
Power Systems
McCormick, Becky, EMD Associates
Inc.
Miller, Christine A., FORE Systems
Moffitt, James H., EMPF
Neumark, Yori, Hadco Corp.
Norton, John S., Tektronix Inc.
Quinn, Paul J., Lockheed Martin
Missiles & Space
Raby, Jim D., Soldering Technology
International
Rassai, David, 3COM Corporation
Robertson, David E., Hexacon Electric
Company
Rowe, Teresa M., AAI Corporation
Sanford, Kelly, Micron Custom Mfg.
Services Inc.
Sherman, Lowell, Defense Supply
Center Columbus DSCC
Siegel, Eric, PACE, Inc.
Smith, Rick, Amp Packaging Systems
Sober, Douglas J., isolaUSA
Steen, Wayne A., Rockwell
International
Tevels, John R., Harris Corp.
Torres, Steven, Corlund Electronics
Corp.
Wooldridge, James R., Rockwell
International
Xiao, Nora, Tektronix Inc.
A special note of thanks is due to Circuit Technology Center
for the preparation of the illustrations in this document.
IPC-7721 February 1998
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