IPC-7721(S).pdf - 第6页
Acknowledgment Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the IPC Printed Board Repair T ask Group (7-34a) of the Product Assurance Committee …
Foreword
IPC’s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging issues.
In this regard document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0) (i.e., IPC-7710).
This standard is intended to provide information on the rework, repair and modification of printed boards and electronic
assemblies. This information must also be supplemented by a performance specification that contains the requirements for
the chosen technology. When used together, these documents should lead both manufacturer and customer to consistent
terms of acceptability.
These documents supersede the following:
IPC-7711 supersedes IPC-R-700C
IPC-7721 supersedes IPC-R-700C
As technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-
ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completion
of ‘‘Suggestions for Improvement’’ forms at the end of each document.
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the
IPC Printed Board Repair Task Group (7-34a) of the Product Assurance Committee are shown below, it is not possible to include
all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.
Product Assurance
Committee
Printed Board Repair
Task Group
Technical Liaison of the
IPC Board of Directors
Chairman
Mike Hill
Viasystems Technologies Corp.
Chairman
Jeff Ferry
Circuit Technology
Center, Inc.
Vice Chairman
Christine Miller
FORE Systems,
Inc.
Peter Murphy
Parlex Corporation
A Special Note of Appreciation
The following core group has
volunteered much of their time and
have made significant contributions
to this document.
Blakley, Peggi, NSWC Crane
Brock, Ron, NSWC Crane
Day, Jennifer, Accutek Inc.
Ferry, Jeff, Circuit Technology
Center, Inc.
Foster, Daniel L., PACE Inc.
Hersey, Ralph J., Ralph Hersey &
Associates
Hopkins, Reed, Metcal Inc.
Houghton, F.D. Bruce, Celestica
Corporation
Miller, Christine A., FORE
Systems Inc.
Moffitt, James H., EMPF
Norton, John S., Tektronix Inc.
Siegel, Eric, PACE, Inc.
Printed Board Repair Task Group
Anderson, Kari, Hughes Technical
Services Co.
Aoki, Masamitsu, Toshiba Chemical
Corp.
Bates, Timothy E., DSC
Communications Corporation
Bergum, Erik J., Polyclad Laminates
Blakley, Peggi, NSWC Crane
Boerdner, Richard W., EJE Research
Bogert, G.L., Westinghouse Electric
Brock, Ron, NSWC Crane
D’Andrade, Derek, Surface Mount
Technology Centre
Daugherty, Dale, Siemens Energy &
Automation
Day, Jennifer, IEC - Arab Alabama
Dehne, Rodney, O.E.M. Worldwide
Dutcher, Nancy, U.S. Assemblies
Hallstead Inc.
Etheridge, Thomas R., McDonnell
Douglas Aerospace
Ferry, Jeff, Circuit Repair Corporation
Fieselman, Charles D., IBM Corp.
Foster, Daniel L., Pace Inc.
Foust, Skip, Solectron Technology Inc.
Griffiths, William F., Plessey Tellumat
South Africa
Hargreaves, Larry, DC. Scientific Inc.
Herrberg, Steven A., Hughes Defense
Communications
Hersey, Ralph J., Ralph Hersey &
Associates
Hiett, Carol E., Lockheed Martin
Astronautics
Ho, David P., Circuit Graphics Ltd.
Hopkins, Reed, Metcal Inc.
Houghton, F. D. Bruce, Celestica
Hymes, Les, Les Hymes Associates
Johnson, Laurence G., General Electric
Co.
Kern, Terence, Axiom Electronics, Inc.
Konsowitz, Robert J., Glasteel
Industrial Laminates
Korth, Connie M., Hibbing Electronics
Corp.
Lambert, Leo P., EPTAC Corporation
Lee, Frederic W., Northrop Grumman
Norden Systems
MacLennan, Karen E., M/A-COM Inc.
Maher, Peter E., Kimball Electronics
Group
Malewicz, Wesley R., Siemens Medical
Systems Inc.
Mastorides, John, Lucas Aerospace
Power Systems
McCormick, Becky, EMD Associates
Inc.
Miller, Christine A., FORE Systems
Moffitt, James H., EMPF
Neumark, Yori, Hadco Corp.
Norton, John S., Tektronix Inc.
Quinn, Paul J., Lockheed Martin
Missiles & Space
Raby, Jim D., Soldering Technology
International
Rassai, David, 3COM Corporation
Robertson, David E., Hexacon Electric
Company
Rowe, Teresa M., AAI Corporation
Sanford, Kelly, Micron Custom Mfg.
Services Inc.
Sherman, Lowell, Defense Supply
Center Columbus DSCC
Siegel, Eric, PACE, Inc.
Smith, Rick, Amp Packaging Systems
Sober, Douglas J., isolaUSA
Steen, Wayne A., Rockwell
International
Tevels, John R., Harris Corp.
Torres, Steven, Corlund Electronics
Corp.
Wooldridge, James R., Rockwell
International
Xiao, Nora, Tektronix Inc.
A special note of thanks is due to Circuit Technology Center
for the preparation of the illustrations in this document.
IPC-7721 February 1998
iv
Table of Contents
General ................................................................................................................................................................................................... 1
Handling/Cleaning
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.1 Handling Electronic Assemblies R, F, C, W Intermediate High
2.2 Cleaning
R, F, C, W Intermediate High
Coating Removal
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.3.1 Coating Removal, Identification of
Conformal Coating
R, F, W, C Advanced High
2.3.2 Coating Removal, Solvent Method
R, F, W, C Advanced High
2.3.3 Coating Removal, Peeling Method
R, F, W, C Advanced High
2.3.4 Coating Removal, Thermal Method
R, F, W, C Advanced High
2.3.5 Coating Removal, Grinding/
Scraping Method
R, F, W, C Advanced High
2.3.6 Coating Removal, Micro Blasting
Method
R, F, W, C Advanced High
February 1998 IPC-7721
v