IPC-7721(S).pdf - 第158页

NOTES IPC-7721 Number: 5.3 Revision: Date: 2/98 Subject: Plated Hole Repair , Inner Layer Connection P a g e4o f4

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12. Solder the eyelet to the exposed inner layer signal or plane by applying heat
from a soldering iron to barrel of the eyelet. (See Figure 3.)
13. Completely remove any solder flux residue by spray rinsing with cleaner.
14. Use a microscope and inspect the solder fillet from the eyelet to the inner con-
nection and perform electrical tests as required.
15. Mix epoxy as required.
16. Fill the milled hole with the epoxy up to, and level with, the surface of the board.
(See Figure 4.) The epoxy filler material should be free of voids and air bubbles.
17. Cure epoxy per the manufacturer’s recommendations
18. Select the proper setting tools and insert them into the eyelet press. (See Fig-
ure 5.)
19. Turn the printed wiring board over and rest the eyelet flange on the lower set-
ting tool.
20. Apply firm even pressure to form the eyelet barrel. (See Figure 6.)
21. Install the component lead and solder, if required.
22. Clean the area.
EVALUATION
1. Visual examination, dimensional requirement of pad diameter and inside diam-
eter.
2. Electrical continuity measurement.
IPC-7721
Number: 5.3
Revision:
Date: 2/98
Subject: Plated Hole Repair, Inner Layer Connection
Page3of4
NOTES
IPC-7721
Number: 5.3
Revision:
Date: 2/98
Subject: Plated Hole Repair, Inner Layer Connection
Page4of4
Standard Improvement Form IPC-7721
The purpose of this form is to provide the
Technical Committee of IPC with input
from the industry regarding usage of
the subject standard.
Individuals or companies are invited to
submit comments to IPC. All comments
will be collected and dispersed to the
appropriate committee(s).
If you can provide input, please complete
this form and return to:
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798
1. I recommend changes to the following:
Requirement, paragraph number
Test Method number , paragraph number
The referenced paragraph number has proven to be:
Unclear Too Rigid In Error
Other
2. Recommendations for correction:
3. Other suggestions for document improvement:
Submitted by:
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