SM481_Service Manual.pdf - 第29页

Advanced High Speed Flexible Mounter 6 2.3. Det ail Specifications of the Machine SECTION ITEM SPECIFICATION REMARK Genera l Tact tim e Unde r op timum condi tion 0 .095 second s/compon ent, C hip1608 (38, 000 c ph) 同时吸附…

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设备规格及名称
5
SECTION
ITEM
SPECIFICATION
REMARK
Weight
SM481
(Standard equipment)
Approx. 1,680 kg
HIGHT=900mm (Feeder 未包括)
Approx. 1,740 kg
HIGHT=950mm (Feeder 未包括)
SM481 (1Standard Feeder
base
+1Docking Option)
Approx. 1,660 kg
HIGHT=900mm (Docking cart , Feeder 未包括)
Approx. 1,720 kg
HIGHT=950mm (Docking cart , Feeder 未包括)
SM481 (Docking Option)
Approx. 1,640 kg
HIGHT=900mm (Docking cart , Feeder 未包括)
Approx. 1,710 kg
HIGHT=950mm (Docking cart , Feeder 未包括)
SM481S (Standard
equipment)
Approx. 1,630 kg
HIGHT=900mm (Feeder 未包括)
Approx. 1,690 kg
HIGHT=950mm (Feeder 未包括)
SM481S (Docking Option)
Approx. 1,600 kg
HIGHT=900mm (Docking cart , Feeder 未包括)
Approx. 1,680 kg
HIGHT=950mm (Docking cart , Feeder 未包括)
Advanced High Speed Flexible Mounter
6
2.3. Detail Specifications of the Machine
SECTION ITEM SPECIFICATION REMARK
General
Tact time
Under optimum
condition
0.095 seconds/component, Chip1608
(38,000 cph)
同时吸附基准, Flying vision
Component dump rate
1,000 ppm 以下, Chip1005 本公司选定的零件
2,000 ppm 以下, Chip0603 本公司选定的零件
SECTION
ITEM
SPECIFICATION
REMARK
General
Component
types
Flying vision
MEGA
FOV 24 mm
Chip
0402~□16 mm
□8 mm 以下: 支持所有贴装头
□8 mm 超过: 支持 H1, H3, H5, H7, H9
IC, Connector
□16 mm 以下, Lead pitch 0.4 mm 以上
BGA, CSP
□
16 mm
以下
, Ball pitch 0.4 mm
以上
Maximum height
Flying vision
10 mm
Upward vision
15 mm
SECTION
ITEM
SPECIFICATION
REMARK
General
Component
types
Upward vision
MEGA
FOV 35 mm
IC, Connector
□32 mm 以下, Lead pitch 0.3 mm 以上
□32 ~ □42 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.5 mm 以上)
□42 ~ □55 mm 분할인식
(Ball pitch 1.0 mm 以上, Lead pitch 0.65 mm 以上)
BGA, CSP
□32 mm 以下, Ball pitch 0.5 mm 以上
Upward vision
MEGA
FOV 45 mm
IC, Connector
□42 mm 以下, Lead pitch 0.4 mm 以上
BGA, CSP
□42 mm 以下, Ball pitch 1.0 mm 以上
Upward vision
FOV 35 mm
IC, Connector
□32mm 以下, Lead pitch 0.4mm 以上
□32 ~ □42 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.5 mm 以上)
□42 ~ □55 mm 分割识别
(Ball pitch 1.0 mm 以上, Lead pitch 0.65 mm 以上)
BGA, CSP
□32mm 以下, Ball pitch 0.75mm 以上
Upward vision
FOV 45 mm
IC, Connector
□42mm 以下, Lead pitch 0.5mm 以上
设备规格及名称
7
BGA, CSP
□42mm 以下, Ball pitch 1.0mm 以上
SECTION ITEM SPECIFICATION REMARK
General PlacementAccuracy
Chip 0402
X,Y : ±0.05 mm, θ : ±5.00 °, Cpk≥1.0
Chip 0603
X,Y : ±0.08 mm, θ : ±5.00 °, Cpk≥1.0,
Chip 1005
X,Y : ±0.10 mm, θ : ±5.00 °, Cpk≥1.0
Lead IC 0.4 Pitch
X,Y : ±0.05 mm, θ : ±0.30 °, Cpk≥1.0
CSP Ball 0.4 Pitch
X,Y : ±0.05 mm, θ : ±0.30 °, Cpk≥1.0
SECTION ITEM SPECIFICATION REMARK
Fiducial
vision
Function Component teaching, Fiducial inspection
Camera type Analog 640 X 480 pixel, C-mount
Configuration
1 Camera@Head FOV 7.5 mm x 1 Set 1 Camera@ 1 Head (Right side)
2 Camera@Head FOV 7.5 mm x 2 Set 2 Camera@ 1 Head
Illumination
Light source LED -
Light adjustment 16 Level
256 Level light mapping → 16 Level
Light control
Programmable, 2 种(Outer light, Coaxial light)
Flying
vision
Function Component inspection
Mega
Camera type Analog 1360 X 1040 pixel, C-mount
Configuration
FDV 24 mm × 5 个 x 2 Gantry
Illumination Light source LED