Specification SIPLACE CA-Series2011版.pdf

SIPLACE CA-Series Specification, 08/2011 Edition High volume SMD, Flip Chip and Die Bonding

SIPLACE CA-Series

Specification, 08/2011 Edition

High volume SMD, Flip Chip and Die Bonding

SIPLACE CA-Series

Contents

Overview of Technical Data 5

Maximum Values 5

Machine Description 6

Overview 6

SIPLACE Wafer System 7

Technical Data - SMT 8

Machine Performance 10

Technical Data - SWS 11

Line Concept 12

Placement Heads 13

Placement Head Configuration 13

20 Segment Collect&Place CA Head for Very High Speed Placement 16

12 Segment Collect&Place CA Head for Very High Speed Placement 17

6 Segment Collect&Place CA Head for High Speed IC Placement 18

Technical Data for C&P Heads 19

TwinHead for High-Precision IC Placement 20

Technical Data for the TwinHead 21

IC and FC Cameras on the CA4 Machines 22

IC and FC Cameras on the CA3 Machines 23

Nozzle Changer for C&P Heads 24

Nozzle Changer (TwinHead) 25

Technical Data for the Nozzle Changers 26

PCB Conveyor 27

Single Conveyor 27

Technical Data for the Single Conveyor 28

Flexible Dual Conveyor 29

Technical Data for the Dual Conveyor 30

Board Warpage 31

PCB Barcode for Product-Controlled Production (Option) 32

Sample Configuration 33

Component Supply 34

Component Trolley for SIPLACE X-Series 34

SIPLACE Wafer System 35

Tape Feeder Modules, X-Series (CA Series) 37

Dummy Feeder Modules 38

Vision Sensor Technology 40

PCB Position Recognition 40

Bad Board Recognition 42

Position Recognition of Feeder Modules 42