Specification SIPLACE CA-Series2011版.pdf - 第5页

5 Overview of Technical Data Maximum Values Flip Chip Die Attach SMD Accuracy ± 10 µm at 3  a a) Calculated with glass die on glass plate - SIPLACE MAC test ± 10 µm at 3  a ± 41 µm at 3  b b) Calculated with the SIPLA…

SIPLACE CA-Series

Contents

Technical data 43

Siemens Signal Interface - Connector Assignment 43

Siemens Signal Interface - Signal Sequence 44

SMEMA Interface - Connector Assignment 45

SMEMA Interface - Signal Sequence 46

Electrical Ratings and Compressed Air Supply 47

Electrical Ratings, Interfaces and Compressed Air Connection 48

Dimensions and Installation Conditions 49

Dimensions and Setup Conditions - Machine Without SWS 51

Dimensions and Setup Conditions - Machine With SWS 52

Placement System’s Center of Gravity 53

SWS Center of Gravity 54

Maneuvering Radii for the Component

Changeover Tables 55

Spacing Distances for the Single Conveyor 56

Spacing Distances for the Flexible Dual Conveyor 57

Technical Data 58

Transportation and Delivery Conditions for Machine 58

Transportation and Delivery Conditions for SWS 59

Option List 60

Placement Machine 60

SWS 62

Configuration List 63

ESD Certificate 64

SIPLACE Awards 65

Notes 68

Overview of Technical Data

Maximum Values

Flip Chip Die Attach SMD

Accuracy ± 10 µm at 3

a) Calculated with glass die on glass plate - SIPLACE MAC test

± 10 µm at 3

± 41 µm at 3

b) Calculated with the SIPLACE CP20-CA head

Placement performance (IPC) 9,000 die/h 6,000 die/h 20,000 components/h

Die / component sizes

0.8 mm to 18.7

0.8 mm to 18.7 mm 01005 to 18.7 mm

Feeder module types Tape feeders, waffle pack trays, stick magazine

feeders, bulk case, dip modules, application-specific

OEM feeder modules

Supply capacity

(component trolley SIPLACE X)

160 tape feeder modules 8 mm X

Substrate size 50 mm x 50 mm to 508 mm x 610 mm

Substrate thickness 0.3 mm to 4.5 mm

c) Calculated with the SIPLACE CP20 and CP12 head. Alternative SIPLACE placement heads available for greater com-

ponent spectrum.

PLEASE NOTE: The specifications apply from soft-

ware version SR.605.03

Machine Description

Overview

General

The "die attach" or "flip chip"

process enables the

SIPLACE CA (Chip Assem-

bly) platform to place bare

dies directly from the wafer.

This provides additional sup-

port for the SMT placement

options available with

SIPLACE X series ma-

chines. The SIPLACE CA

can be used either for bare

die or SMT placement alone

or for parallel placement of

both bare dies and SMT

components, in single pass

mode during the same pro-

cess. Users benefit from a

combination of greater pro-

cess flexibility and higher

placement speeds which is

unique to the electronics pro-

duction industry.

The placement machines in

the SIPLACE CA series are

available in two variants:

• SIPLACE CA3, the place-

ment machine with 3 gan-

tries and

• SIPLACE CA4, the place-

ment machine with 4 gan-

tries.

The SIPLACE CA4 can be

configured with up to 4 SWS

IPLACE Wafer -System)

and the SIPLACE CA3 with

up to 2 SWS.

The SWS provides the place-

ment head with components

(dies) directly from the wafer

(max. 12“).

Placement machine

The placement machine

uses the Collect&Place-

method for high-speed

placement of standard com-

ponents.

The moving head picks the

components up from the

waiting SWS and places

them on the waiting printed

circuit board. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents are picked up reli-

ably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, economic effi-

ciency and reliable setups

are the guarantee for the

high level of productivity in

the SIPLACE CA series

placement systems.

Minimum down times

increase utilization and thus

help to increase productivity.

Even small 01005 compo-

nents can be processed with

the SIPLACE CA series.

SIPLACE Wafer System

SWS

Integration of the SIPLACE

Wafer System (SWS) into

the SIPLACE CA facilitates

direct placement of dies from

the wafer, using a standard

SMT placement process.

This unique placement plat-

form supports both the "flip

chip" and "die attach" pro-

cesses.

• Processes supported:

Flip Chip, Die Attach (Chip

on Board), SMT

• Hoopring handling

• Horizontal wafer system

• Automatic wafer change

• Linear Dipping Unit

• Die Attach Unit

• ALPS wafer map software

• Multi die capability