Specification SIPLACE CA-Series2011版.pdf - 第35页

35 Component supply SIPLACE Wafer System The new SIPLACE W afer System (SWS) p rovides a fully automatic wafer an d chip handling system. The SWS is completely inte- grated into the locations of the SIPLACE CA placement …

Component Supply

Component Trolley for SIPLACE X-Series

Description

The component trolleys are

independent modules, which

can be configured at an ex-

ternal set-up location with

feeder modules. Up to four

component trolleys can be

docked onto the machine. A

component changeover table

can be replaced with just a

short interruption of the pro-

duction process. The chassis

runs smoothly and is easy to

maneuver.

The changeover table has a

capacity of up to 40 locations

for 8 mm X tape feeder mod-

ules. The total capacity with

four component trolleys is

thus 160 x 8 mm

tracks.

Dummy feeder modules are

used at unassigned locations

to protect the operators.

The component feeders are

at rest during the placement

process - allowing tapes to

be spliced without stopping

the machine.

If an optional component bar-

code reader and the Setup

Center option are installed, it

is possible to read and check

the barcodes on the tape

reels thus guaranteeing that

the components are allocat-

ed to the correct tracks.

Location 1

Location 3

Location 2

Location 4

Component supply

SIPLACE Wafer System

The new SIPLACE Wafer

System (SWS) provides a

fully automatic wafer and

chip handling system.

The SWS is completely inte-

grated into the locations of

the SIPLACE CA placement

system. Each location can be

equipped with an SWS or an

X table.

The SWS functions like a

feeder for the SIPLACE sys-

tem and transports the dies

from the wafer to a single,

fixed pickup position for the

placement head.

The placement head then

picks up the die from the

SWS tool and places this on

the board, just like in SMD

handling.

The SWS is shown as a spe-

cial feeder type in

SIPLACE Pro. The

SIPLACE CA system is pro-

grammed as usual for the SI-

PLACE X series.

The die handling is pro-

grammed via the SWS GUI.

The main parameters to be

programmed are as follows:

– Wafer and die dimen-

sions

– Die recognition

– Die ejection parameters

– Wafer map system

– Link to the component

programmed in

SIPLACE Pro

SWS

Length x width 1.580 mm x 720 mm

PCB transport height 830 mm ± 15 mm (standard)

900 mm ± 15 mm (option)

930 mm ± 15 mm (option)

950 mm ± 15 mm (SMEMA option)

Weight 300 kg

Technical data

Component supply

Component trolley

Technical data

Component Trolley for SIPLACE X-Series

Length x Width 752 mm x 592 mm

Height for

830 mm PCB transport height

900 mm PCB transport height

930 mm PCB transport height

950 mm PCB transport height

820 mm

890 mm

920 mm

940 mm

PCB transport height 830 mm ± 15 mm (standard)

900 mm ± 15 mm (option)

930 mm ± 15 mm (option)

950 mm ± 15 mm (SMEMA option)

Weight

without feeder modules

with feeder module at all loca-

tions

80.4 kg

139.6 kg

Reel diameter

standard

maximum

up to 432 mm (17“)

483 mm (19“)

Locations for feeder modules max. 40

Waste container

for pieces of used tape

Component feeder table

Component trolley for SIPLACE X-series

Tape container