Specification SIPLACE CA-Series2011版.pdf - 第17页

17 Placement heads 12 Segment Collect&Place CA Head for Very High Speed Placement Description The 12 segment Collect& Place head operates accord - ing to the Collect&Place prin- ciple i.e. twelve comp onents …

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16
Placement heads
20 Segment Collect&Place CA
Head for Very High Speed Placement
Description
The 20 segment Collect&
-Place head operates ac-
cording to the Collect&Place
principle i.e. twenty compo-
nents are picked up from the
placement head within a sin-
gle cycle, are optically cen-
tered on the way to the board
and are also rotated into the
required placement position.
Lastly, the component is set
down gently and accurately
on the board.
The 20 segment -Col-
lect&Place head enables you
to significantly increase the
performance of the place-
ment head and the whole
placement machine. With the
help of high-resolution com-
ponent cameras, the 20 seg-
ment Collect&Place head
can optically center and
place components of size
01005, up to 6 mm x 6 mm.
Checking and self-learning
functions
Various control and self-
learning functions enhance
the reliability of the Col-
lect&Place head.
• To increase placement ac-
curacy, the 20 segment
Collect&Place head fea-
tures a component sen-
sor. At the pickup and
placement position, it
checks that the compo-
nent is present at the noz-
zle. The sensor only
supports components up
to a thickness of 90µm.
• The digital component
camera on the placement
head determines the
package form and the pre-
cise position of each com-
ponent at the nozzle.
Deviations from the pickup
position are corrected be-
fore placement.
• A sensor registers the rel-
ative movement between
the nozzle and the seg-
ment when components
are placed and sends a
signal to the position con-
trol axes.
With this sensor stop
method, differences in
height during pickup and
any unevenness of the
PCB surface are compen-
sated during placement.
Star
rotation
Pick up compo-
nent and place it
Turn component
individually
Optically center
component
Check
vacuum
Component
sensor
Component
sensor
Star motor
Star with 20 nozzles Component
camera
17
Placement heads
12 Segment Collect&Place CA
Head for Very High Speed Placement
Description
The 12 segment Collect&
Place head operates accord-
ing to the Collect&Place prin-
ciple i.e. twelve components
are picked up from the place-
ment head within a single cy-
cle, are optically centered on
the way to the board and are
also rotated into the required
placement position. Lastly,
the air kiss sets down the
component gently and accu-
rately on the board.
Checking and self-learning
functions
Various control and self-
learning functions enhance
the reliability of the Col-
lect&Place head.
• For example, vacuum
checks at the nozzles indi-
cate whether the compo-
nent (CO) was picked up
or set down correctly.
• A digital component cam-
era on the placement head
determines the precise
position of each compo-
nent at the nozzle.
• Deviations from the pickup
position are corrected be-
fore placement.
• The package form is also
checked and the compo-
nent is not placed if the
geometric data thus deter-
mined differs from the pro-
grammed data.
The vertical axis for picking
up and placing the compo-
nent works in sensor stop
mode, This sensor stop
method compensates differ-
ences in height during pickup
and any unevenness of the
PCB surface during place-
ment. In addition to the vacu-
um check, an optional com-
ponent sensor can be used
to check the component
presence at the nozzle.
The use of a component sen-
sor is recommended in par-
ticular for placement with
small components, such as
0201.
The 12 segment Collect&
Place head is fitted with a
high-resolution component
camera as a default. With the
help of this camera, the 12
segment Collect&Place head
can optically center and
place components of size
0201, up to
18.7
mm x18.7mm
(SWS: 0.8 mm x 0.8 mm up
to 12 mm x 12 mm, larger
dies on request.
Component vision module
DP axis:
Rotate component into
placement position
Pull off or
insert sleeve
Z axis:
Pick up component
or place it
DR axis:
Star rotation
Reject
component
18
Placement heads
6 Segment Collect&Place CA
Head for High Speed IC Placement
Description
The 6 segment
Collect&Place head also
operates according to the
Collect&Place principle. With
the help of a high-resolution,
digital component camera,
the 6 segment Collect&Place
head can optically center and
place components of size
0201, up to 27 mm x 27 mm.
Checking and self-learning
functions
The control and self-learning
functions, described on page
17 for the 12 segment
Collect&Place head, also
apply to the 6 segment Col-
lect& Place head.