Specification SIPLACE CA-Series2011版.pdf - 第7页

7 Machine Description SIPLACE Wafer System Description The SIPLACE W afer System (SWS) makes the compo- nents available to the place - ment head, directly from the wafer . The SWS therefore extends the component spectrum…

Machine Description

Overview

General

The "die attach" or "flip chip"

process enables the

SIPLACE CA (Chip Assem-

bly) platform to place bare

dies directly from the wafer.

This provides additional sup-

port for the SMT placement

options available with

SIPLACE X series ma-

chines. The SIPLACE CA

can be used either for bare

die or SMT placement alone

or for parallel placement of

both bare dies and SMT

components, in single pass

mode during the same pro-

cess. Users benefit from a

combination of greater pro-

cess flexibility and higher

placement speeds which is

unique to the electronics pro-

duction industry.

The placement machines in

the SIPLACE CA series are

available in two variants:

• SIPLACE CA3, the place-

ment machine with 3 gan-

tries and

• SIPLACE CA4, the place-

ment machine with 4 gan-

tries.

The SIPLACE CA4 can be

configured with up to 4 SWS

IPLACE Wafer -System)

and the SIPLACE CA3 with

up to 2 SWS.

The SWS provides the place-

ment head with components

(dies) directly from the wafer

(max. 12“).

Placement machine

The placement machine

uses the Collect&Place-

method for high-speed

placement of standard com-

ponents.

The moving head picks the

components up from the

waiting SWS and places

them on the waiting printed

circuit board. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents are picked up reli-

ably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, economic effi-

ciency and reliable setups

are the guarantee for the

high level of productivity in

the SIPLACE CA series

placement systems.

Minimum down times

increase utilization and thus

help to increase productivity.

Even small 01005 compo-

nents can be processed with

the SIPLACE CA series.

SIPLACE Wafer System

SWS

Integration of the SIPLACE

Wafer System (SWS) into

the SIPLACE CA facilitates

direct placement of dies from

the wafer, using a standard

SMT placement process.

This unique placement plat-

form supports both the "flip

chip" and "die attach" pro-

cesses.

• Processes supported:

Flip Chip, Die Attach (Chip

on Board), SMT

• Hoopring handling

• Horizontal wafer system

• Automatic wafer change

• Linear Dipping Unit

• Die Attach Unit

• ALPS wafer map software

• Multi die capability

Machine Description

SIPLACE Wafer System

Description

The SIPLACE Wafer System

(SWS) makes the compo-

nents available to the place-

ment head, directly from the

wafer. The SWS therefore

extends the component

spectrum of the established

SIPLACE X machines, by

enabling placement of bare

dies from wafers.

The wafers are supplied fully

automatically out of the wafer

cassette and the dies inside

can be processed in the

established placement pro-

cedures.

Flip chip process - func-

tion

The wafer is fully automati-

cally pulled out of the wafer

cassette and is then trans-

ported to the wafer table. The

wafer table positions the die

above the ejection system

that releases the die from the

wafer foil. After this release

procedure, the flip unit noz-

zle takes the die, rotates it by

180° and makes it available

to the placement head for

pickup.

Options

The process spectrum is

supplemented by the follow-

ing options:

– Die Attach Unit:

The die attach unit takes

the die from the flip unit

nozzle and turns it, so that

it has the same top-bottom

orientation on the board

as it had on the wafer.

– Linear Dipping Unit

The Linear Dipping Unit

distributes precise layers

of flux for the flip chip pro-

cess. After the dies have

been taken over from the

flip unit, the placement

head dips the dies into the

layer of flux.

Machine Description

Technical Data - SMT

Placement head

types

– 20 segment Collect&Place CA head (C&P20CA)

– 12 segment Collect&Place CA head (C&P12A)

– 6 segment Collect&Place CA head (C&P6)

– SIPLACE TwinHead (TH)

(only possible in a placement area without SWS).

Number of gan-

tries

CA4: 4 gantries

CA3: 3 gantries

Placement posi-

tion

6,000 / gantry for the Collect&Place heads

2,000 / gantry for the TwinHead

Component spec-

trum

a) The range of components depends on which head configuration is selected.

0.4 mm x 0.2 mm (01005), 0.6 mm x 0.3 mm (0201)

to 85 mm x 85 mm / 125 mm x 10 mm,

max. 200 mm x 125 mm (with restrictions)

Component

height

C&P20CA: 4 mm

C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm

(higher heights on request)

b) The specified component height for TwinHead might be reduced in placement areas with two gantries and a combination

of Collect&Place head and TwinHead.

Placement accu-

racy

(Standard criteria

for SMD)

C&P20CA

C&P12

C&P6

± 41 µm (3), ± 55 µm (4)

± 45 µm (3), ± 60 µm (4)

± 26 µm (3), ± 35 µm (4)

± 22 µm (3), ± 30 µm (4)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)

Placement accu-

racy

(Advanced crite-

ria for SWS)

C&P20CA

C&P12

C&P6

± 25 µm (3), ± 33 µm (4)

± 35 µm (3), ± 47 µm (4)

± 26 µm (3), ± 35 µm (4)

± 22 µm (3), ± 30 µm (4)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)

Angular accuracy C&P20CA

C&P12

C&P6

± 0.5° (3), ± 0.7° (4)

± 0.2° (3), ± 0.3° (4)

± 0.05° (3), ± 0.07° (4)

± 0.05° (3), ± 0.07° (4

)

Component camera, type 41 (6 x 6)

Component camera, type 29 (27 x 27)

Component camera, type 33 (55 x 45)

Component camera, type 25 (16 x 16)