西门子SIPLACE HS 50-设备参数_EN.pdf - 第23页

21 Description The component vision module in- tegrated into the placement head signific antly c ontributes to plac e- ment precision and reliability. It dependably recognizes all package forms (= geometric dimensions of…

Description

In the cluster technology each

subpanel is assigned an ink spot.

If this is present during the meas-

urement via the PCB vision mod-

ule, the corresponding subpanel is

populated. It is also possible to ac-

complish the population of the

subpanel when the ink spot is

missing. With this function it is

possible to eliminate costs due to

unnecessary population of faulty

subpanels.

Global Ink Spot

Global Ink SpotGlobal Ink Spot

Global Ink Spot

Each bad board evaluation needs

time, so naturally the consumed

time increases with the number of

subpanels per PCB. Using a global

ink spot can result in a significant

reduction of these secondary

times.

The PCB vision module searches

at positions taught before for the

defined fiducial. In case of recogni-

tion there is no following evalua-

tion of subpanels. The system al-

lows the customer to choose also

the opposite interpretation.

Position Recognition of Feeder

Position Recognition of FeederPosition Recognition of Feeder

Position Recognition of Feeder

The pick-up position of the com-

ponents can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Bad Board Recognition

Position Recognition of Feeder

Ink Spot Criteria

Evaluationmethod

for fiducials

for structures

brightness method

contrast method

Shapes and sizes of

fiducials/structures for

brightness method

contrast method

square or circular forms

edge length/diameter 0.3 - 5 mm

rectangular forms

edge length 0.3 - 5 mm

Masking material mat dark (light-absorbing)

not recommended: white or shiny

Ink spot recognition time 0.3 s for each method

Description

The component vision module in-

tegrated into the placement head

significantly contributes to place-

ment precision and reliability. It

dependably recognizes all package

forms (= geometric dimensions of

the component) which are illumi-

nated at various angles from three

planes in the case of the 12-Nozzle

Collect & Place Head. For optimal

illumination of each component,

the brightness of the lighting of the

planes can be adjusted individually

in 256 increments.

Aside from the dimension of the

SMD module, the vision system

determines the number of leads

and their pitch (lateral IC lead bend)

as well as the offset of the place-

ment angle and the X-/Y-axis. Un-

suitable components are rejected

and automatically added later in a

repair cycle. Offsets in placement

angle and X-/Y-axis are corrected at

the turning station of the Collect &

Place Head or via the gantry axes.

From the positions of a number of

components in one track a relevant

offset in the pick-up position on

the X-/Y-axis is calculated. This off-

set is taken into account during

subsequent component pick-up

steps due to the self-learning prin-

ciple.

Prior to placement, the required

geometric dimensions of a com-

ponent type are entered into the

GF editor, creating a synthetic

model of the SMD chip. This task

is facilitated by the extensive on-

line information and help system.

The central SIPLACE vision sys-

tem, to which the other vision

modules are also connected, sub-

sequently analyzes the gray-scale

value of the component vision

module. Algorithms suitable for the

specific package form are used for

this purpose. Due to the combina-

tion of algorithms, the vision sys-

tem also functions reliably under

the most difficult conditions, e.g.,

in case of different reflection be-

havior on the part of the leads or

interference from outside.

Vision Sensor Technology:

Algorithms to Determine the X-/Y-Position and the

Placement Angle

Algorithm Component Analysis based on

Size Driven Chip the component contour (pro-

file/gradient)

Row Driven IC Several component leads (correla-

tion method)

Corner Driven IC all component leads

(correlation method)

Lead Driven Complex IC Each component lead (High-

Accuracy-Lead-Extraction method)

Grid/Ball

BGA,

µBGA,

Flip Chip

all defined balls

(gradients/ball centering)

Description

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is evalu-

ated by the central vision system.

The component rotation is then

corrected by the appropriate angle

based on the position offsets de-

termined with vision inspection.

Vision Sensor Technology:

Standard Component Vision Modules for 12-Nozzle

Collect & Place Head

Standard Component Vision Module for the 12-Nozzle C & P Head

Maximum component size 18.7 x 18.7 mm

Component Range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front lighting

(3 freely programmable planes)