西门子SIPLACE HS 50-设备参数_EN.pdf - 第6页
4 Bare Board Loader SIPLACE SP-5 00 Screen Printer SIPLACE RN 26S Reflow Oven SIPLACE HS-50 SIPLACE S-25 HM Magazine Loader Example of a SIPLACE Placement Line SIPLACE HS-50 Description Flexibility and adaptabilit y char…
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Description
The SIPLACE HS-50 very high-
speed SMD placement system
combines very high placement
speed with both accuracy and
flexibility. In contrast to classic
chipshooters, a Collect & Place
procedure is applied here.
SIPLACE HS-50 machines are
equipped with four X-Y-main gan-
tries. Each gantry features a star-
shaped 12-Nozzle Collect & Place
Head. The placement heads alter-
nately pick up components from a
stationary feeder bank and place
these components on the station-
ary PCB.
This has distinct advantages:
§ Component tapes of all sizes
can be replenished by splicing a
new reel of components to the
end of a depleting reel. This eli-
minates machine stoppage due
to component replenishment.
§ Stationary, vibration-free feeders
ensure a reliable pick-up of even
the smallest components (e.g.,
0201 and 0402 chips).
§ Thanks to the flexibility of the
12-Nozzle Collect & Place Heads
– whose ideal nozzle set-up is
automatically specified – the
travel can be minimized and the
sequence of placement opti-
mally adjusted.
§ Populating a stationary PCB
also prevents components from
shifting during placement.
Speed coupled with economic ef-
ficiency and set-up reliability is the
SIPLACE HS-50´s recipe for suc-
cess. Components are pre-picked
as the PCB is transported into the
placement area. Path-optimization
ensures high performance: While
one Collect & Place Head is placing
components, the second head is
picking up the next series of com-
ponents to be placed.
The following options are available
for the SIPLACE HS-50:
§ Additional changeover tables
enables the reduction of job set-
up time increasing machine utili-
sation.
§ Dual Conveyor eliminates the
non-productive PCB loading
times thus increasing machines
operating efficiency.
§ Automatic nozzle changers for
both changeover and storage of
nozzles.
§ PCB Barcode Reader used for
product controlled production
changeover.
§ Component Bar Code Scanner
used for feeder set-up verifica-
tion.
§ To achive the best placement
quality we recommend to order
an 0201 enhance kit.
§ Ceramic Substrat Centering
Machine Description
Technical Data
Type of placement head 12-Nozzle Collect & Place Head
Number of gantries 4
Benchmark placement rate
a
50,000 cph
Component Range 0.6 x 0.3 mm
2
(0201) to 18.7 x 18.7 mm
2
Max. placement accuracy
(at 4 sigma)
a
90 µm
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm
2
to 368 x 460 mm
2
/
2" x 2" to 14.5" x 18"
(optional up to 610 mm length)
50 x 50 mm
2
to 368 x 216 mm
2
/
2" x 2" to 14.5" x 8.5"
(optional up to 610 mm length)
Feeding capacity 144 tracks, 8 mm tape
Component table Quick changeover table with integrated
wheels, reel holder and scrap bin,
Types of Feeder modules Tapes, Bulk Cases,
application-specific OEM feeders
Operating system Microsoft Windows / RMOS
Power 4 kW
Compr. air requirements 6.5 - 10 bar, 950 Nl/min, Tube ¾"
a) As defined in “Scope of Service and Delivery SIPLACE”.
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Bare
Board
Loader
SIPLACE SP-500
Screen Printer
SIPLACE RN 26S
Reflow Oven
SIPLACE HS-50
SIPLACE S-25 HM
Magazine
Loader
Example of a SIPLACE Placement Line
SIPLACE HS-50
Description
Flexibility and adaptability charac-
terize the modular SIPLACE de-
sign. Each production line can be
individually composed of similar
and different modules.
Because of the small size and ro-
bust construction of the SIPLACE
modules, they can be recombined
quickly and easily to accommodate
changes in production require-
ments.
The SIPLACE family of placement
machines offers the right product
for each purpose – from the very
high-speed placement system
SIPLACE HS-50 to the high-speed
SMD placement system SIPLACE
S-25 HM and the flexible place-
ment system SIPLACE F
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HM.
SIPLACE line-level optimization
tools generate single set-ups for
single products, single set-ups for
several products as well as several
set-ups for several products. Also,
product programs can be trans-
ferred from line to line even when
the machine configurations are dif-
ferent.
Line Design
Technical Data
System SIPLACE SMD placement lines
Modules SIPLACE HS-50 / SIPLACE S-25 HM /
SIPLACE F
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HM
Peripherals Input/output station, screen printer,
solder oven, inspection conveyor etc.,
available from Siemens
PCB conveyor Automatic width adjustment
PCB dimensions (L x W)
Single conveyor
Dual conveyor
50 x 50 mm
2
to 368 x 460 mm
2
/
2" x 2" to 14.5" x 18"
50 x 50 mm
2
to 368 x 216 mm
2
/
2" x 2" to 14.5" x 8.5"
Ceramic substrate dimensions
(L x W)
50 x 50 mm
2
to 101.6 x 177.8 mm
2
2" x 2" to 4" x 7"
Placement speed Depends on layout of modules
Space required 4 m² / SIPLACE S & F modules
6.8 m² / SIPLACE HS module
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Description
The 12-Nozzle placement head op-
erates on the Collect & Place prin-
ciple.
Each of the four X/Y-gantries
features one high-speed 12-Nozzle
Collect & Place Head.
At two gantries components are
picked up while at the other two
gantries components are placed.
Each head features an intelligent
Z-axis, Theta-axis for rotation and
vacuum monitoring.
Z-axis is learning both pick-up and
placement Z-height and thus opti-
mizes speed without compromis-
ing the programmed placement
forces.
Vacuum monitoring ensures low
component reject rates and high
quality placement.
Placement Heads
Placement Principle of SIPLACE HS-50
➀ 12-Nozzle Collect & Place Head
➁ X-/Y-Gantry System
➂ Fixed Component Supply
➃ Fixed PCB
12-Nozzle
Collect & Place
Head
12-Nozzle Collect & Place Head for Very High Speed Placement