TM1629_TM1630_TM1631.The explanation document of the parameters on simplified GUI.pdf - 第4页
SMT Software Engineering Group IM Operations Y AMAHA MOT OR CO.,L TD MDOC-SO FT50035 4/34 12. S pecial ........ ........ ........ ........ ........ ........ ............. ...... ........ ........ ........…
SMT Software Engineering Group
IM Operations
YAMAHA MOTOR CO.,LTD
MDOC-SOFT50035
3/34
Contents
1. Std. Chip ............................................................................................................................ 5
1.1. Chamfer Lead
............................................................................................................. 5
1.2. Check Lead Brightness
................................................................................................ 5
1.3. Check Direction
........................................................................................................... 6
1.4. Check Center Brightness
............................................................................................. 7
1.5. Retry Lead Center Search
............................................................................................ 7
1.6. Chip Array
................................................................................................................... 8
2. Bare Chip........................................................................................................................... 9
2.1. Size Fitting
.................................................................................................................. 9
2.2. Small Bare chip
........................................................................................................... 9
3. Simple BGA.......................................................................................................................10
3.1. Check Polarity
............................................................................................................10
3.2. Simple White BGA
......................................................................................................10
4. BGA .................................................................................................................................11
4.1. White BGA
.................................................................................................................11
4.2. CGA
...........................................................................................................................11
5. Simple Flip Chip.................................................................................................................12
5.1. Outside Bump Recognition
..........................................................................................12
6. Flip Chip ...........................................................................................................................13
6.1. Simple High Speed
.....................................................................................................13
7. 2Ends ...............................................................................................................................14
7.1. Check Direction
..........................................................................................................14
7.2. Check Upside-Down
...................................................................................................15
8. Mini-Tr/SOT.......................................................................................................................16
8.1. Check Upside-Down
...................................................................................................16
9. SOP .................................................................................................................................17
9.1. Side Lead Fitting
.........................................................................................................17
9.2. Check Upside-Down
...................................................................................................17
9.3. Check Global Lead Bend
............................................................................................18
9.4. Direction Check by Lead Width
...................................................................................18
9.5. Check Lead Position
...................................................................................................19
10. QFP................................................................................................................................20
10.1. Side Lead Fitting
.......................................................................................................20
10.2. Check Lead Length
...................................................................................................20
11. PLCC ..............................................................................................................................21
11.1. Side Lead Fitting
.......................................................................................................21
11.2. NS Base Search
.......................................................................................................22
11.3. WE Base Search
......................................................................................................22
11.4. Check Direction
........................................................................................................23
SMT Software Engineering Group
IM Operations
YAMAHA MOTOR CO.,LTD
MDOC-SOFT50035
4/34
12. Special............................................................................................................................24
12.1. Side Lead Fitting
.......................................................................................................24
12.2. Long Connector
........................................................................................................24
13. As Mark...........................................................................................................................25
13.1. Mark Line
.................................................................................................................25
13.2. 2 Objects
..................................................................................................................26
13.3. 4 Objects
..................................................................................................................27
13.4. General
....................................................................................................................28
13.5. Check Direction
........................................................................................................29
13.6. 2 Objects (Angle of Terminal)
....................................................................................30
14. Sp. Quad.........................................................................................................................31
14.1. Check Direction
........................................................................................................31
14.2. Shield Frame
............................................................................................................32
14.3. Check Upside-Down
.................................................................................................33
14.4. 4 Corner Fitting
.........................................................................................................34
SMT Software Engineering Group
IM Operations
YAMAHA MOTOR CO.,LTD
MDOC-SOFT50035
5/34
1. Std. Chip
1.1. Chamfer Lead
Suitable for chip components where part of a corner is missing.
Particular parameter
Chamfer Direction
Set a direction of the chamfering.
Check Many
Adsorption
It confirms whether excessive components exist. When the “Check” is
specified, it becomes an error if excessive edges exist around the detected
component.
*Cannot use this parameter on VGOS V2.xx and YGOS V2.xx.
1.2. Check Lead Brightness
Suitable for standard chip components.
Although recognition is the same as for "Normal", more detailed check conditions
can be specified. If the "Comp. Intensity" is specified (automatically specified at
recognition tests), the electrode area brightness is checked to determine if a
component is present or absent.
Particular parameters
Check Many
Adsorption
It confirms whether excessive components exist. When the “Check” is specified,
it becomes an error if excessive edges exist around the detected component.
Comp. Intensity The minimum luminosity of the component electrode section is specified. When
the average luminosity of an electrode section is darker than the value set up
here, it becomes an error. (It is the same function as the same name parameter
in a recognition tab at the normal algorithm.)
Check Algorithm
The prevention function of nozzle incorrect recognition is specified.
Ａ ： Lead
Brightness
Only the above-mentioned “Comp. Intensity” function is
performed.
Ａ ＆
Symmetry
The symmetry on the lengthwise direction central line of
component is evaluated.
Ａ ＆
Difference
The variation in the luminosity on the transverse direction
central line of component is evaluated.
Trapezoid
Tolerance (%)
The degree of trapezoid permissible as good is specified.
If {(difference of up-and-down electrode width) / (electrode width of the narrower
one)} is larger than the value set up here, it becomes an error. When 0 is set up,
this check is not performed.