Specification SIPLACE X-Series规格说明书2.pdf - 第12页

12 Placement Heads Overview Head modularity The SIPLACE X series is characteri zed by maximum flexibility in the production process. This flexibility is partly due to th e head modu- larity of the placem ent machines as …

Machine Performance

CPP_H = MultiStar CPP in high mounting position

CPP_L = MultiStar CPP in low mounting position

SIPLACE X3 placement system

For the definition of the placement performance values see the note on page 10.

Number of gantries 3

Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value

X3-A C&P20 / C&P20 C&P20 62,700 69,500 93,000

C&P20 / C&P20 CPP_L 59,200 66,500 90,000

CPP_L / CPP_L CPP_L 52,200 61,500 84,000

X3-B C&P20 / C&P20 TH 45,300 50,000 68,500

CPP_L / CPP_L TH 38,300 45,000 62,500

X3-C CPP_H / TH TH 25,200 28,600 37,500

X3-D TH / TH TH 11,300 12,500 19,500

SIPLACE X2 placement system

For the definition of the placement performance values see the note on page 10.

Number of gantries 2

Machine Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value

X2-A C&P20 C&P20 43,400 49,000 62,000

C&P20 CPP_L 39,900 46,000 59,000

CPP_L CPP_L 36,400 43,000 56,000

X2-B C&P20 TH 26,000 29,500 37,500

CPP_L TH 22,500 26,500 34,500

X2-C TH TH 8,600 10,000 13,000

Placement Heads

Overview

Head modularity

The SIPLACE X series is

characterized by maximum

flexibility in the production

process. This flexibility is

partly due to the head modu-

larity of the placement

machines as it allows differ-

ent placement head variants

to be configured to suit the

production requirements.

Collect&Place principle

The SIPLACE SpeedStar

works on the Collect & Place

principle. This means that,

within each cycle, 20 compo-

nents are picked up or “col-

lected”, are optically cen-

tered on the way to the board

and are rotated into the

required placement position.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Pick&Place principle

The high-precision SIPLACE

TwinStar, which consists of

two Pick&Place placement

modules of the same design,

works on the Pick&Place

principle. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle. This princi-

ple has proved particularly

suitable for fast and accurate

placement of special compo-

nents in the fine pitch and

super-fine pitch range, and

for complex and heavy com-

ponents that require grip-

pers, for example.

Mixed Mode

The new SIPLACE MultiStar

works with both the Collect&

Place and the Pick&Place

principle. In mixed mode, it

can combine these two

modes (which were previ-

ously kept strictly separate)

in a single placement cycle.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensors

check for the presence of

a component at the nozzle

before and after the pick-

up and placement pro-

cess.

• Digital cameras check the

position of each compo-

nent at the nozzle. Any

deviations from the

required pick-up position

are corrected before

placement takes place.

• Force sensors monitor the

specified component set-

down forces. With the sen-

sor stop method, differ-

ences in height during

pick-up and any warping

of the PCB are compen-

sated during placement.

• Vacuum sensors check

whether the component

was picked up or set down

correctly.

Placement Heads

Standard Functions / Options

SIPLACE SpeedStar (C&P20) SIPLACE MultiStar (CPP)

Standard

functions

High-resolution head camera,

vacuum sensor, force measure-

ment, component sensor, inte-

grated turning station for each

segment, PCB warpage check,

individual recording for each

component

Standard

functions

High-resolution head camera,

vacuum sensor, force measure-

ment, component sensor, inte-

grated turning station for each

segment, PCB warpage check,

individual recording for each

component

Options Nozzle changer, special nozzles Options Nozzle changer, special noz-

zles, high-resolution head cam-

era for 01005 components,

stationary fine-pitch camera

SIPLACE TwinStar (TH)

Standard

functions

Stationary fine-pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB war-

page check, individual recording

for each component

Options Stationary flip-chip camera, spe-

cial nozzles, grippers