prober-english.pdf.pdf - 第18页

■ APPLICATIO NS High ‐ Power  Device  Measurement Safety High  Voltage  Measurement  (  ～ 10kV) ， High Current  Measurement ( ～ 200A  pulse ) In  high ‐ power  device  evaluation  where  dangerous  high  v…

■ APPLICATIONS

Wafer‐LevelReliabilityTest

NoiseCharacterization

OrganicSemiconductorDeviceEvaluation

Atthestageofresearchanddevelopment oforganicsemiconductordevicesuchasOFET，OTFT，OEL，andOLED,itisnecessary

toperformevaluationunderhigh‐purityinertgastoavoidcharacteristicdegradationcausedbymoistureoroxygeninthe

atmosphere.Weoffersmall‐footprintmanualproberandsemi‐autoproberthat

arespeciallydesignedfortheusageinsideofa

glovebox.Theyaresuitableforoperationbyglovedhand.

Manualproberforglovebox

Semi‐automatic proberforglovebox

+300゜CHightemperaturemulti‐siteprobecard

Anoxygenmeterinsideofachamberandamass flow

controller (MFC)enable probingwithalowresidual

oxygenconcentrationoflessthan100ppm

Weofferprobesystemsthatsupportwafer‐levelreliabilitytestsuchasEM,TDDB,HCI,NBTI,BT,etc.,.

Ourprobesystemsupport

varioustasksrequiredinwafer‐levelreliabilitytestsuchashightemperatureupto+300゜C,long‐term

testingoverweeks,stablecontactunderhightemperatureenvironment,mountingmulti‐siteprobecard,anti‐oxidation

environmentbynitrogengaspurge,etc.,.

Ourprobesystemwithshieldchamber (HMP‐810SC/1210SC，HSP‐200SC/300SC)hasoptionsettingofultralowfloornoise(‐UL).

Bychoosingthis“–UL” option,itcansupporton‐wafernoisecharacterizationsuchas1/fnoise,randomtelegraph noise,(RTN),and

RFnoiseinthewidetemperaturerangefrom‐65゜Cto+200゜C.

Applications

■ APPLICATIONS

High‐PowerDeviceMeasurement

Safety

HighVoltageMeasurement(～ 10kV)，High CurrentMeasurement ( ～ 200Apulse )

Inhigh‐powerdeviceevaluationwheredangeroushighvoltageandhigh currentarerequired,safetymeasuresagainsthumanhaveto

betakeninanticipationofvariouscases.Ourprobesystemfor high‐powerdevicemeasurementisequippedwithinterlocksystemthat

isstandard.Eachinterlocksystemwillpreventfromelectricshock,aburn,

andoxygenshortage

Interlockthatinterruptsappliedhighvoltagewithsafetylight curtain.

Interlockthatpreventsoxygenshortagewith

openairoxygenmonitor.

(Appliedtoasystemwithgaspurgefunction. )

HighVoltageProbing

High CurrentProbing

Weofferprobeaccessoriesthatsupportmaximum10kV200Apulseaswellaschucksthatsupportmaximum 5kV40Apulse.

Itsupportsdevicecharacterizationinthetemperaturerangefrom‐60゜Cto+300゜Cinordertosupportoperationtestinwidetemperature

rangefordevicessuchasin‐vehicledevices.

ChucksforPowerDevices

Highvoltageprobeunit

(±3kV，‐60゜Cto+300゜C)

Insulationliquidimmersiontray

topreventelectricdischarge

High currentprobeunit

(Maximum200Apulse，‐60゜Cto+300゜C)

+300゜CHighTemperatureTest, AntioxidantEnvironment

WhenevaluatingGaN orSiC highpowerdevice,hightemperaturetestat+300゜Cisrequired.Ourproductwithshieldchambermakesit

possibletodonon‐oxidation probingwithalowresidualoxygenconcentrationoflessthan100ppmbypurgingnitrogengasintothe

chamber.

Weofferchuckunitsspeciallydesignedforhighpower

devices.

・ Roomtemperaturechuckandhightemperaturechuck

(RT ~+200゜C/+300゜C),

high/lowtemperaturechuck (‐40゜C/‐60゜C~+200゜C/+300゜C)

・ 5kV 40Apulse

・ Thinwaferhandling

Feed‐throughConnectorsandMeasurementCables

Weoffermeasurementcablesandfeed‐throughconnectorsthatconnectvarioushighpowerdevicetesterswithourprobesystem.

・ Kelvin connection

・ TAIKO processwafer

Keysighttechnologies

B1505A HV‐TRIAX

TFF/KeithleyInstruments

2600‐PCT/4200‐PCT

HV‐TRIAX

SHV connector & cable

(~10kV)

IWATSU

CS‐3000/5000

Itsupportsclosedloopcontrolbyusingoxygenmeterinsideof

achamberandmass flowcontroller(MFC ).

Applications

FailureAnalysis,FailDieMarking

Mountingalasercutter

FragileIn‐Circuitprobing

Emissionanalysis・OBIRCH/TIV A

Allofourprobesystemscanbemountedwithlasermicro cutter. Ourprobesystemwithlasermicro cuttersupportapplications

suchaspointmarkingofFIB orSEM beforeobservation,exfoliationofprotectionlayer, cutmetalcircuitpattern etc., .

Laserwavelengthcanbechosenfrom1064/532/355/266nm(Multiplewavelengthis

possible )

Pointmarking

Exfoliationofprotectionlayer

Patterncutting

TFT panelcut

Weofferoptionsandaccessoriestosupportprobingtofinepatternofsubmicronorderthatisrequiredforfailureanalysisand

testingflatpaneldisplay. Bycombiningwithmetallurgicalmicroscope,positionerwithsubmicronpositioningprecision,whisker

probeforcircuitprobing,andactivevibrationisolatingtable, itcanperformstableprobingtoa

submicronholewhoseprotective

filmisexfoliatedwithalasercutterwithoutadamagetothecircuit.

Activevibration

isolatingUnit

Activevibrationisolating Controller

metallurgical microscope

Submicronprecision

positioner

Whiskerprobe(left)

forIn‐circuitprobi ng

*Standardprobeontherig ht

Activevibrationisolatingtable

Fail diemarking(Inker )

Weofferprobestationsthatcanbemountedonemission

microscopeandOBIRCH system.

Itcanmarkdefectivediewiththeminimumdotsizerangingfrom

minimum125μmφ tomaximum2150μmφ.

Itcanbemountedonoursemi‐autoprobersHSP‐100/150/200/300.

■ APPLICATIONS

Applications

Inkerhead

InkCartridge