prober-english.pdf.pdf - 第7页

■ SEMI-AUTOMATIC PROBER ・ Model HSP -200 is for 8" wafers. ・ Model HSP -300 is for 12" wafers. 8 inch 12 inch Standard  Semi ‐ Automatic  Prober  Model This  is  a  standard  semi ‐ automatic  probe  s…

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4inch 6inch
SEMI-AUTOMATIC PROBER
Model HSP-100 is for 4" wafers.
Model HSP-150 is for 6" wafers.
SemiAutomaticProbeSystemforSmallDiameterWafers
Thisisasemiautomaticprobesystemthatsupports4” or6” smalldiameterwafers.
EquippedwithahighaccuracyXYZθ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom
+20°Cto+300°C.
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
Applications
Extended applications
Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements(quasistaticCV,HFCV,andRFCV)
RFmeasurements(upto67GHz)
UltrahighspeedIVmeasurements
Probecardsupport(cansupportMultisiteWLR)
Builtinlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting)
Activevibrationisolatorandultrahighaccuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
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WaferSize
XYtravel
XYrepeatability
XYaccuracy
Ztravel
UnitdimensionW×D×H*
Weight*
Zrepeatability
HSP100 HSP150
~φ100mm ~φ150mm
X105mmY200mm X160mmY250mm
1200×900×1550mm
1250×900×1550mm
650kg 700kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-100 / HSP-150
SemiAutomaticProber
SEMI-AUTOMATIC PROBER
Model HSP-200 is for 8" wafers.
Model HSP-300 is for 12" wafers.
8inch 12inch
StandardSemiAutomaticProberModel
Thisisastandardsemiautomaticprobesystemthatsupports8” or12” wafers.
EquippedwithahighaccuracyXYZθ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom+20°
Cto+300°C.
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
Applications
Extended applications
Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements(quasistaticCV,HFCV,andRFCV)
RFmeasurements(upto67GHz)
UltrahighspeedIVmeasurements
Probecardsupport(cansupportMultisiteWLR)
Builtinlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting )
Activevibrationisolatorandultrahighaccuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
WaferSize
XYtravel
XYrepeatability
XYaccuracy
Ztravel
UnitdimensionW×D×H*
Weight*
Zrepeatability
HSP200 HSP300
~φ200mm ~φ300mm
X205mmY300mm X310mmY450mm
1300×1000×1550mm
1400×1050×1600mm
750kg 950kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-200 / HSP-300
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SemiAutomaticProber
Model HSP-200SC is for 8" wafers.
Model HSP-300SC is for 12" wafers.
8inch 12inch
SEMI-AUTOMATIC PROBER
SemiAutomatic ProberforHigh/LowTemperatureTests
Applications
Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C
orfrom‐60°Cto+300°C
UltralowsignalIVmeasurements(fAlevel)
VariousCVmeasurements
(quasistaticCV,HFCV,andRFCV)[subpFlevel]
1/fnoiseevaluation
RTN(random telegraphnoise)evaluation
Highfrequencynoiseevaluation(upto800MHz)
RFmeasurements(upto67GHz)/Sparameteracquisition
UltrahighspeedIVmeasurements
Thisisasemiautomaticprobesystemfornextgenerationsemiconductordevicesdesignedforlownoiseandlowleakage.
Inthissystem,ashieldedchamberstructurecontains
theprobeandchuckinatotallyEMIshieldedenvironment.
ThesystemsupportsinplaneautomaticmeasurementssuchasultralowsignalIV/CVmeasurementinthreshold
regions,1/fnoisemeasurement,Sparameteracquisition,RTN(randomtelegraphnoise)measurement,andhighspeedIV
measurementinatemperature
controlrangefrom‐65°Cto+300°C(or+400°Cwhenusingthespecialoption).
Thisprobesystemcanoptionallysupporthighcurrentandhighvoltagepowerdeviceapplications.
*TheHSP150SCfor6” wafersisalsoavailable.
Extended applications
Probecardsupport(cansupportMultisiteWLR)
Activevibrationisolatorandultrahighaccuracyprobingthrough
image processingpatternrecognition(accuracy:±1umorfiner)
Lightreceiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,andPD)
Commongatepad contactsofflatpaneldisplaydevices
Highpowerdevicemeasurements
(400Apulse,±3kVtriaxial,±10kVcoaxial) *8” model
Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
WaferSize
XYtravel
XYrepeatability
XYaccuracy
Ztravel
UnitdimensionW×D×H*
Weight*
Zrepeatability
HSP200SC HSP300SC
~φ200mm ~φ300 mm
X205mmY205mm X310mmY310mm
1350×1000×1450mm
1450×1150×1450mm
1050kg 1250kg
<±3μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-200SC / HSP-300SC
SemiAutomaticProber
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