prober-english.pdf.pdf - 第9页

HiSOL  Semi ‐ Automatic Prober Control  Software Manual  operation BIN  mapping Wafer  Map  setting Seals fe ature Supported  automatic  meas urement  softwa re KEYSIGHT  technologies ‐ EasyEXPERT ‐ Desktop  E…

・

Model HSP-200SC is for 8" wafers.

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Model HSP-300SC is for 12" wafers.

8inch 12inch

■ SEMI-AUTOMATIC PROBER

Semi‐Automatic ProberforHigh/LowTemperatureTests

Applications

‐ Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C

orfrom‐60°Cto+300°C

‐ UltralowsignalI‐Vmeasurements(fAlevel)

‐ VariousC‐Vmeasurements

(quasi‐staticC‐V,HF‐CV,andRF‐CV)[subpFlevel]

‐ 1/fnoiseevaluation

‐ RTN(random telegraphnoise)evaluation

‐ High‐frequencynoiseevaluation(upto800MHz)

‐ RFmeasurements(upto67GHz)/Sparameteracquisition

‐ Ultrahigh‐speedI‐Vmeasurements

Thisisasemi‐automaticprobesystemfornext‐generationsemiconductordevicesdesignedforlownoiseandlowleakage.

Inthissystem,ashieldedchamberstructurecontains

theprobeandchuckinatotallyEMIshieldedenvironment.

Thesystemsupportsin‐planeautomaticmeasurementssuchasultralowsignalI‐V/C‐Vmeasurementinthreshold

regions,1/fnoisemeasurement,Sparameteracquisition,RTN(randomtelegraphnoise)measurement,andhigh‐speedI‐V

measurementinatemperature

controlrangefrom‐65°Cto+300°C(or+400°Cwhenusingthespecialoption).

Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.

*TheHSP‐150SCfor6” wafersisalsoavailable.

Extended applications

‐ Probecardsupport(cansupportMultisiteWLR)

‐ Activevibrationisolatorandultrahigh‐accuracyprobingthrough

image processingpatternrecognition(accuracy:±1umorfiner)

‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor

optoelectronics(suchasLED,LD,VCSEL,andPD)

‐ Commongatepad contactsofflat‐paneldisplaydevices

‐ High‐powerdevicemeasurements

(400Apulse,±3kVtriaxial,±10kVcoaxial) *8” model

‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)

WaferSize

X‐Ytravel

X‐Yrepeatability

X‐Yaccuracy

Ztravel

Unitdimension（W×D×H）*

Weight*

Zrepeatability

HSP‐200SC HSP‐300SC

～φ200mm ～φ300 mm

X：205mm，Y：205mm X：310mm，Y：310mm

1350×1000×1450mm

1450×1150×1450mm

1050kg 1250kg

＜±3μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°

*Itemswithasteriskvarydependingonsystemconfiguration.

Model HSP-200SC / HSP-300SC

Semi‐AutomaticProber

HiSOLSemi‐Automatic Prober ControlSoftware

Manualoperation

BINmapping

WaferMapsetting

Seals feature

Supportedautomaticmeasurementsoftware

KEYSIGHTtechnologies

‐EasyEXPERT

‐DesktopEasyEXPERT

‐WaferProExpress

TFF/KEITHLEYinstruments

‐4200‐SCS KITE(KeithleyInteractiveTestEnvironment)

‐ACS

Proplus designsolution ‐Noisepro

OtherGP‐IBcommunication‐enabledsoftware

‐ User‐friendlymultifunctionalsemi‐automaticprobingsoftware.

‐ SupportsWindows8asitsoperatingsystem.(Windows7isalsosupported.)

‐ AlsoavailableasamanualproberwithasoftwareGUIorjoystickcontroller.

‐ ReceivingBINinformationfromahigher‐levelmeasuringinstrument,itispossibletodisplayBINmapping.

‐ Supportswafer

thermalexpansioncompensationfunctionforThermaltest.

‐ Possibletocontrolthesemi‐automaticproberusingtheGP‐IBcommandsentfromahigher‐levelmeasuring

instrument or PC.

‐ Possibletoprovidesoftwareformakingadatabaseofandextractingparametersofrawdataobtainedfromeach

measuring instrumentinordertoanalyzethedata.

(Optional)

‐ Theself‐developedsoftwareallowsuserstoincorporatecustomizedrequirements.

■ SEMI-AUTOMATIC PROBER

Semi‐AutomaticProber

■ PROBE SYSTEM FOR FPD

FPD

ManualProberforFlat‐PanelDisplay

Wecustom‐makemanualprobersthatsupportFPDs (flat‐paneldisplay)rangingfromsmalltolargeglasssubstrates.

Amicroscopeandprobingareawithawiderangeofmotionallowstableprobingacrossthepanelsurface.

Aheatingtype(upto+200°C)orthermaltype(‐40°Cto+200°C)can

beselectedfortherectanglepanelchuckand

ultralowcurrentmeasurementsonthefAlevelandC‐VmeasurementsonthesubpFlevelaresupportedforalltemperature

zones.

Thisproberalsosupportslightirradiationonthepanelsurface bythesolarsimulatororotherdeviceandlightirradiationon

the

bottom sideofpanel(backlight)bysuper‐highluminancewhiteLED.

Lightirradiationonthebottom sideofpanel

byultrahighluminosityLED

(upto40,000cd/cm2) *Sub‐stage

Lightirradiationonthepanelsurfaceby

thesolarsimulatororotherdevice

Built‐inlasercutter

(laserwavelength:1064,532,355,266nm)

Ultrahigh‐accuracymodelforstable

probingof

submicronpatterns

Function examples of systems for small to medium-sized panels

Model HMP-FPD series

Widerangeprobingareathatenableslayout

of FPDdevices.

ProbeSystemforFPD