prober-english.pdf.pdf - 第6页
4 inch 6 inch ■ SEMI-AUTOMATIC PROBER ・ Model HSP -100 is for 4" wafers. ・ Model HSP -150 is for 6" wafers. Semi ‐ Automatic Probe System for Small ‐ Diameter Wafers This is a semi ‐ automatic …

8inch 12inch
■ MANUAL PROBER
Model HMP-810SC / HMP-1210SC
・
Model HMP-800SC is for 8" wafers.
・
Model HMP-1200SC is for 12" wafers.
ManualProberforHigh/LowTemperatureTests
Thisisamanualprobesystemfornext‐generationsemiconductordevicesdesignedforlownoiseandlowleakage.
Inthissystem,ashieldedchamberstructurecontainstheprobeandchuckinatotallyEMIshieldedenvironment.
Thesystemsupportsmeasurementssuchasultralowsignalmeasurementinthethresholdregions,1/f
noisemeasurement,
Sparameteracquisition,andhigh‐speedI‐Vmeasurementinatemperaturecontrolrangefrom‐60°Cto+300°C
(or+400°Cwhenusingthespecialoption).
Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.
*TheHMP‐610SCfor6” wafersisalso
available.
Applications
‐ Temperaturecharacteristicstestsinrangefrom+25°Cto+300°C
orfrom‐60°Cto+300°C
‐ UltralowsignalI‐Vmeasurements(fAlevel)
‐ VariousC‐Vmeasurements
(quasi‐staticC‐V,HF‐CV,andRF‐CV)[subpFlevel]
‐ 1/fnoiseevaluation
‐ RTN(random telegraphnoise)evaluation
‐ High‐frequencynoiseevaluation(upto800MHz)
‐ RFmeasurements(upto67GHz)/Sparameteracquisition
‐ Ultrahigh‐speedI‐Vmeasurements
Extended applications
‐ Probecardsupport(cansupportMultisiteWLR)
‐ Light‐receiving/emittingcharacteristicsevaluationapplications
foroptoelectronics(suchasLED,LD,VCSEL,andPD)
‐ Commongatepad contactsofflat‐paneldisplaydevices
‐ High‐powerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)*8” model
‐ Waferlevelreliabilitytests
(suchasEM,TDDB,HCI,
NBTI,andBT)
WaferSize
X‐Ycoarsetravel
X‐Yfinetravel
θ travel
PlatenZaxisaction
Unitdimension(W×D×H)*
Weight*
PlatenZaxisadjustment
HMP‐810SC HMP‐1210SC
~φ200mm ~φ300mm
X:205mm,Y:205mm X:310mm,Y:310mm
1020×1000×1550mm
1150×1100×1550mm
750kg 1000kg
±7.5°
0/0.3mm
0~13mm
X:205mm,Y:205mm X:310mm,Y:310mm
*Itemswithasteriskvarydependingonsystemconfiguration.
5
ManualProber

4inch 6inch
■ SEMI-AUTOMATIC PROBER
・
Model HSP-100 is for 4" wafers.
・
Model HSP-150 is for 6" wafers.
Semi‐AutomaticProbeSystemforSmall‐DiameterWafers
Thisisasemi‐automaticprobesystemthatsupports4” or6” smalldiameterwafers.
Equippedwithahigh‐accuracyX‐Y‐Z‐θ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom
+20°Cto+300°C.
Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.
Applications
Extended applications
‐ Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
‐ UltralowsignalI‐Vmeasurements(fAlevel)
‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV,andRF‐CV)
‐ RFmeasurements(upto67GHz)
‐ Ultrahigh‐speedI‐Vmeasurements
‐ Probecardsupport(cansupportMultisiteWLR)
‐ Built‐inlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting)
‐ Activevibrationisolatorandultrahigh‐accuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
‐ Commongatepad contactsofflat‐paneldisplaydevices
‐ High‐powerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
6
WaferSize
X‐Ytravel
X‐Yrepeatability
X‐Yaccuracy
Ztravel
Unitdimension(W×D×H)*
Weight*
Zrepeatability
HSP‐100 HSP‐150
~φ100mm ~φ150mm
X:105mm,Y:200mm X:160mm,Y:250mm
1200×900×1550mm
1250×900×1550mm
650kg 700kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-100 / HSP-150
Semi‐AutomaticProber

■ SEMI-AUTOMATIC PROBER
・
Model HSP-200 is for 8" wafers.
・
Model HSP-300 is for 12" wafers.
8inch 12inch
StandardSemi‐AutomaticProberModel
Thisisastandardsemi‐automaticprobesystemthatsupports8” or12” wafers.
Equippedwithahigh‐accuracyX‐Y‐Z‐θ quadraxial closedloopstagehavingexcellentpositioningaccuracyandrepeatability,
thisprobesystemensuresreliableprobecontact.
Thisprobesystemcanincorporateahotchuckthatsupportsatemperaturerangefrom+20°
Cto+300°C.
Thisprobesystemcanoptionallysupporthigh‐currentandhigh‐voltagepowerdeviceapplications.
Applications
Extended applications
‐ Temperaturecharacteristicstestsinrangefrom+20°Cto+300°C
‐ UltralowsignalI‐Vmeasurements(fAlevel)
‐ VariousC‐Vmeasurements(quasi‐staticC‐V,HF‐CV,andRF‐CV)
‐ RFmeasurements(upto67GHz)
‐ Ultrahigh‐speedI‐Vmeasurements
‐ Probecardsupport(cansupportMultisiteWLR)
‐ Built‐inlasercutter
(Pointmarking,Exfoliationofprotectionlayer,Metallayercutting )
‐ Activevibrationisolatorandultrahigh‐accuracyprobingthrough
imageprocessingpatternrecognition(accuracy:± 1umorfiner)
‐ Light‐receiving/emittingcharacteristicsevaluationapplicationsfor
optoelectronics(suchasLED,LD,VCSEL,
andPD)
‐ Commongatepad contactsofflat‐paneldisplaydevices
‐ High‐powerdevicemeasurements
(200Apulse,±3kVtriaxial,±10kVcoaxial)
‐ Waferlevelreliabilitytests(suchasEM,TDDB,HCI,NBTI,and BT)
WaferSize
X‐Ytravel
X‐Yrepeatability
X‐Yaccuracy
Ztravel
Unitdimension(W×D×H)*
Weight*
Zrepeatability
HSP‐200 HSP‐300
~φ200mm ~φ300mm
X:205mm,Y:300mm X:310mm,Y:450mm
1300×1000×1550mm
1400×1050×1600mm
750kg 950kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
*Itemswithasteriskvarydependingonsystemconfiguration.
Model HSP-200 / HSP-300
7
Semi‐AutomaticProber