ASM-X-Spec-SX12V2-EN-DMS.pdf - 第13页

13 Machine Performance SIPLACE SX1/SX2 Placement head types SIPLACE S peedS tar (C&P20) SIPLACE MultiS tar (CPP) SIPLACE T winS tar (TH) Placement performa nce The placement pe rformance is i nfluenced by the differ …

Modular machine concept SIPLACE SX1/SX2

Example of SIPLACE SX1 with WPC5/WPC6

PLEASE NOTE: For all possible head config-

urations please refer to section Machine Per-

formance SIPLACE SX1/SX2 from page 13.

COT 30 Out Component trolley with 30

tracks in the outer position

COT 60 In Component trolley with 60

tracks in the inner position

WPC Waffle Pack Changer,

type

5 or type 6

Head Placement head in acc.

with head configuration

NC Nozzle changer in acc.

with head configuration

IC Stationary camera

FC Flip chip camera

G1 Gantry 1

PA Placement area

Machine Performance SIPLACE SX1/SX2

Placement head types SIPLACE SpeedStar (C&P20)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the con-

veyor configurations. Individual options and customized applications also influence the placement performance.

On request, SIPLACE can calculate the actual performance of your product on your machine configuration.

IPC value [comp./h]

In line with the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting

Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-

tions specified

in the SIPLACE scope of service and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable conditions for each machine type

and setting, and corresponds to the theoretical conditions normally used in the industry.

SIPLACE SX2 placement

machine

Placement area IPC value Benchmark value Theoretical value

C&P20 / C&P20 48,000 60,000 67,750

CPP / CPP

a) MultiStar CPP: low installation position

38,000 46,000 56,000

CPP

/ TH

b) MultiStar CPP: high installation position

23,100 27,000 31,000

TH / TH 10,200 11,000 13,000

SIPLACE SX1 placement

machine

Placement area IPC value Benchmark value Theoretical value

C&P20 24,000 30,000 33,875

CPP

19,000 23,000 28,000

TH 5,100 5,500 6,500

Placement Heads SIPLACE SX1/SX2

Overview

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the board and their rota-

tion into the required place-

ment angle and position.

They are then placed gently

and accurately onto the PCB.

This principle is particularly

suitable for high-speed

placement of standard

components.

Pick&Place principle

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE TwinStar

placement head, optically

centered on the way to the

placement position and then

rotated into the required

placement angle. This princi-

ple is ideally suitable for fast

and precise placement of

special components in the

fine pitch or super fine pitch

field, plus complex and

heavy components which

may need grippers.

Mixed mode

The new SIPLACE MultiStar

uses both the Collect&Place

and the Pick&Place princi-

ple. Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.