ASM-X-Spec-SX12V2-EN-DMS.pdf - 第5页

5 Overview of Technical Data Maximum Values Placement pe rformanc e a IPC value Benchmark value Theoretical value a) Definition of performance values see page 13. 48,000 comp./h 60,000 comp./h 67,750 comp./h Component sp…

SIPLACE SX1/SX2

Content

01005 Placement 39

Machine Maintenance 40

SIPLACE Software Suite 41

General 41

Overview 42

SIPLACE Station Software 43

SIPLACE Random Setup 46

Maximum production quality 47

SIPLACE Service Options 48

Training courses 49

Technical Data SIPLACE SX1/SX2 50

SMEMA Interface 50

Siemens Signal Interface 52

Electrical Ratings, Energy Consumption and

Compressed Air Supply 54

Dimensions and Setup Conditions 56

Placement System Dimensions 57

Placement System Center of Gravity 57

Maneuvering Radii for the Component Trolleys 58

Maneuvering Radii of WPC5/WPC6 59

Spacing Distances for the Single Conveyor 60

Spacing Distances for the Flexible Dual Conveyor 61

Distances for Machine with WPC5/WPC6 62

Transport and Delivery Configuration 63

Standard List SIPLACE SX1/SX2 64

Options List SIPLACE SX1/SX2 65

Language Overview SIPLACE SX1/SX2 67

Configuration aid SIPLACE SX1/SX2 68

SR.706 68

PCB Barcode Scanner 69

Smart Pin Support 70

Compare SIPLACE 71

ESD Certificate SIPLACE SX Series 72

SIPLACE Awards 73

Notes 76

Overview of Technical Data

Maximum Values

Placement performance

IPC value

Benchmark value

Theoretical value

a) Definition of performance values see page 13.

48,000 comp./h

60,000 comp./h

67,750 comp./h

Component spectrum 01005 - 200 mm x 110 mm

Placement accuracy

angular accuracy

b) Accuracy values measured in accordance with vendor-neutral IPC standard.

± 22 µm / ± 0.05° (3),

± 30 µm / ± 0.07° (4)

Feeder module types Tape feeder modules, waffle pack tray, stick

magazine feeders, dip modules, application-

specific OEM feeder modules

Feeding capacity (component trolley) 120 8 mm X feeder modules

Board format

(length x width)

c) Longer boards available on request

850mm x 560mm

PCB thickness 0.3 - 6.5 mm

PCB weight up to 5 kg

Camera 6 illumination levels

Protective covers: Light gray

(RAL 7047)

Machine frame: Graphite black

(RAL 9011)

Covers: Pearl dark gray

(RAL 9023 )

Machine colors SIPLACE SX1/SX2

SIPLACE SX1/SX2

Machine Description

Intelligent placement solu-

tions for maximum stan-

dards

Maximum flexibility, perfor-

mance or placement quality:

the SIPLACE SX has state-

of-the-art technology to mas-

ter any challenge arising in

SMT production. It offers all

the innovations and features

to ensure efficient electronics

production today and in the

future, and provides previ-

ously unavailable ways to

increase both efficiency and

productivity. The SIPLACE

SX is the first placement

machine worldwide to sup-

port the rapid installation and

removal of gantries within

only a few minutes, using a

convenient quick-change

system. This gantry modular-

ity concept makes perfor-

mance and feeder module

capacity in the SIPLACE SX

independent of one another

and scalable in line with indi-

vidual requirements.

Maximum modularity for

every need

The compact and change-

friendly design of the

SIPLACE SX forms the ideal

basis for new, future-oriented

production concepts which

keep pace with dynamically

developing customer

requirements, without the

need for time-consuming

conversions as in traditional

SMT production lines.

The placement machines are

available in 2 variants:

• SIPLACE SX1

• SIPLACE SX2

The number specified in the

type name indicates the

number of gantries. There is

a placement head on each

gantry.

The SIPLACE SX covers the

entire range of common

components with only three

placement heads. The ideal

addition to the SIPLACE

TwinStar and the high speed

SIPLACE SpeedStar 20

segment C&P placement

head is the new SIPLACE

Multistar head. Due to the

patented CPP technology

(Collect&Pick&Place), the

SIPLACE Multistar is the

first placement head world-

wide which can not only

switch between Pick&Place

and rapid Collect&Place

placement but can also com-

bine both modes in one

placement cycle (mixed

mode). Software-controlled

changeover of placement

modes in a flash enables you

to easily and perfectly bal-

ance out your production line

in the event of rapidly chang-

ing requirements. Compared

to conventional solutions,

head changes are no longer

needed and the overall pro-

ductivity of the line increases

significantly.

During placement, the place-

ment heads pick up the com-

ponents from the waiting

supply and place these on

the board waiting.

This established SIPLACE

principle ensures reliable

pickup of even the smallest

components, prevents com-

ponents sliding on the board

and enables minimized travel

paths.

The user also benefits from

different PCB conveyors:

SIPLACE single conveyor

and flexible SIPLACE dual

conveyor.

SIPLACE MultiStar