ASM-X-Spec-SX12V2-EN-DMS.pdf - 第15页

15 Placement Heads SIPLACE SX1/SX2 Standard Functions / Options SIPLACE SpeedStar (C&P20) SIPLACE MultiStar (CPP) S tandard- functions High-resolution camera, vacuum sensor , force measurement, component sensor , int…

Placement Heads SIPLACE SX1/SX2

Overview

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the board and their rota-

tion into the required place-

ment angle and position.

They are then placed gently

and accurately onto the PCB.

This principle is particularly

suitable for high-speed

placement of standard

components.

Pick&Place principle

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE TwinStar

placement head, optically

centered on the way to the

placement position and then

rotated into the required

placement angle. This princi-

ple is ideally suitable for fast

and precise placement of

special components in the

fine pitch or super fine pitch

field, plus complex and

heavy components which

may need grippers.

Mixed mode

The new SIPLACE MultiStar

uses both the Collect&Place

and the Pick&Place princi-

ple. Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Placement Heads SIPLACE SX1/SX2

Standard Functions / Options

SIPLACE SpeedStar (C&P20) SIPLACE MultiStar (CPP)

Standard-

functions

High-resolution camera, vacuum

sensor, force measurement,

component sensor, integrated

turning station per segment,

PCB warpage check, individual

image of each component

Standard-

functions

High-resolution camera, vac-

uum sensor, force measure-

ment, component sensor,

integrated turning station per

segment, PCB warpage check,

individual image of each com-

ponent

Options Nozzle changer, special nozzles Options Nozzle changer, special noz-

zles, high-resolution head cam-

era for 01005 components,

stationary fine pitch camera

SIPLACE TwinStar (TH)

Standard-

functions

Stationary fine pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB war-

page check, individual image of

each component

Options Stationary flip chip camera, spe-

cial nozzles, grippers

Placement Heads SIPLACE SX1/SX2

SIPLACE SpeedStar (C&P20)

SIPLACE SpeedStar component

camera type 23 (C&P20)

SIPLACE SpeedStar component

camera type 41 (C&P20)

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-spe-

cific standards, the component packaging tolerances and the component tolerances.

01005 to 2220, Melf, SOT, SOD 01005 to 2220, Melf, SOT, SOD,

Bare-Die, Flip-Chip

Component spec.

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

4 mm

0.25 mm

0.1 mm

0.4 mm

0.2 mm

0.4 mm x 0.2 mm

6 mm x 6 mm

1 g

4 mm

0.08 mm

0.03 mm

0.10 mm

0.05 mm

0.12 mm x 0.12 mm

6 mm x 6 mm

1 g

Programmable set-down

force

1.5 N - 4.5 N 1.5 N - 4.5 N

Nozzle types 10xx, 11xx, 12xx 10xx, 11xx, 12xx

X/Y accuracy

b) Accuracy values measured in accordance with vendor-neutral IPC standard.

± 41 µm/3

± 55 µm/4

± 41 µm/3

± 55 µm/4

Angular accuracy ± 0.5° / 3

± 0.7° / 4

± 0.5° / 3

± 0.7° / 4

Illumination levels 5 5

Possible illumination

level settings?

256