IPC 7711A.pdf - 第128页
NOTES IPC-771 1A Number: 3.8.4 Revision: Date: 2/98 Subject: J-Lead Removal P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No reproduction or ne…
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
J-Lead removal tip
MATERIALS
Flux-cored solder
Flux
NOTES
This procedure is designed for smaller J-LEAD packages. This method is not suit-
able for J-LEAD 68 and larger, which are more safely removed using the wire wrap
methods. The heat sinking characteristics of the component and connections will
affect the choice of methods as well.
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Select the proper tip by using the manufacturer’s recommended tip selection
guides. Install tip.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Ensure that there’s good wetting all the way around the inside of the tip. If there’s
not good wetting all around, or if the inside edge of the tip is discolored, use the
manufacturer’s recommended methods and/or tools to clean the tip.
5. Tin the tip generously around the entire inside working surface. (See Figure 1.)
6. Apply flux to all the leads. (See Figure 2.)
7. Bring the tip straight down on top of the part, making full, even contact on all of
the leads. (See Figure 3.)
8. When the component leads have reflowed, slide the tip to one side just slightly,
or twist it slightly, and lift straight up. (See Figure 4.)
9. Remove the component immediately by wiping it on the sponge.
Figure 1
Figure 2 Apply Flux
Figure 3 Contact All Leads
Figure 4 Slide and Lift
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Removal
Flux & Tin Tip Only
Number: 3.8.4
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.8.4
Revision:
Date: 2/98
Subject: J-Lead Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Hot gas (air) reflow system
Correctly sized nozzle
MATERIALS
Cleaner
Flux
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install nozzle into the hot gas reflow system and raise nozzle to highest position.
Place PWB assembly onto the work platform.
3. Set system controls to required settings to optimize performance.
4. Apply flux to component leads. (See Figure 1.)
5. Position component to be removed under nozzle. (See Figure 2.)
6. Lower nozzle and check alignment and make adjustments as needed. (See Fig-
ure 3.)
7. Position nozzle to expose vacuum cup. Turn on vacuum and lower vacuum cup
until it touches component.
8. Lower nozzle to component and commence reflow cycle and observe solder melt
of all leads. (See Figure 4.)
9. Upon completion of reflow cycle, raise nozzle and allow component to cool prior
to board removal from work platform. (See Figure 5.)
Figure 1 Flux Component
Figure 2 Position Component
Figure 3 Lower Nozzle
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
J-Lead Removal
Hot Gas Reflow System
Number: 3.8.5
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---