IPC 7711A.pdf - 第5页

Honyotski, Frank, Soldering T echnology International Hurst, Greg, BAE SYSTEMS Hymes, Les, The Complete Connection Icore, Bernard, Northrop Grumman Corporation Jenkins, James, Harris Corporation, GCSD Johnson, Kathryn L.…

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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Repairability Subcommittee (7-34) of the Product Assurance Committee (7-30) are shown below, it is not pos-
sible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Product Assurance
Committee
Repairability
Subcommittee
Technical Liaisons of the
IPC Board of Directors
Chair
Mel Parrish
Soldering Technology International
Co-Chairs
Jeff Ferry
Circuit Technology Center, Inc.
Daniel L. Foster
Soldering Technology International
Peggi Blakley
NSWC Crane
Nilesh S. Naik
Eagle Circuits Inc.
Sammy Yi
Flextronics International
A Special Note of Appreciation
The following core group has
volunteered much of their time and
have made significant contributions
to this document.
Blakley, Peggi, NSWC Crane
Brock, Ron, NSWC Crane
Day, Jennifer, Current Circuits
Ferry, Jeff, Circuit Technology
Center, Inc.
Foster, Daniel L., Soldering Technology
International
Moffitt, James H., Moffitt Consulting
Services
Siegel, Eric, PACE, Inc.
Repairability Subcommittee
Adams, David C., Rockwell Collins
Alter, Chris W., Honeywell Inc.
Amundsen, Becky, Northrop Grumman
Corporation
Anderson, Kari, Hughes Technical
Services Co.
Aoki, Masamitsu, UL APEX Co., Ltd.
Ashaolu, Peter, Cisco Systems Inc.
Barrett, Chris, PACE, Inc.
Bates, Timothy E., Alcatel USA
Bennett, Craig, NSWC - Crane
Bergum, Erik J., Polyclad Laminates
Blake, Gregory, Blake Consulting
Blakley, Peggi J., NSWC - Crane
Boerdner, Richard W., EJE Research
Bogert, Gerald Leslie, Bechtel Plant
Machinery, Inc.
Brock, Ronald J., NSWC - Crane
Butman, William G., AssemTech Skills
Training Corp.
Cash, Alan S., Northrop Grumman
Corporation
Chen, D. Phillip, Honeywell Canada
Cirimele, Ray, B E S T Inc.
Cross, Mark, Lockheed Martin
D’Andrade, Derek, SMTC Corporation
Daugherty, Dale, Siemens Energy &
Automation
Day, Jennifer, Current Circuits
Dehne, Rodney, OEM Worldwide
Dennehy, Charles S., Circuit
Technology Center Inc.
Dieffenbacher, William C., BAE
Systems Controls
DiFranza, Michele J., The Mitre Corp.
Dunaway, Mark E., Boeing Aircraft &
Missiles
Dutcher, Nancy, U.S. Assemblies
Hallstead Inc.
Etheridge, Thomas R., Boeing Aircraft
& Missiles
Falconbury, Gary, Raytheon Technical
Services
Ferry, Jeff, Circuit Technology Center
Inc.
Fieselman, Charles D., Solectron
Technology Inc.
Foster, Daniel L., Soldering Technology
International
Freeman, Fortunata, Solectron
Technology Inc.
Fritz, Dennis, MacDermid, Inc.
Ganster, Andrew W., NSWC - Crane
Gillespie, Alan L., Boeing Aircraft &
Missiles
Gonzalez, Constantino J., ACME, Inc.
Green, Michael R., Lockheed Martin
Space Systems Company
Greer, Brian, Cookson Electronics
Griffiths, William F., Plessey Tellumat
South Africa
Grim, Edward A., Raytheon Systems
Company
Hargreaves, Larry, DC. Scientific Inc.
Herrberg, Steven A., Raytheon
Company
Hiett, Carol E., Lockheed Martin
Astronautics
Ho, David P., Circuit Graphics Ltd.
Hoffman, Andy, Plexus Corp.
A special note of thanks is due to PACE and Circuit Technology Center
for the preparation of the illustrations in this document.
October 2003 IPC-7711A/7721A
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Honyotski, Frank, Soldering
Technology International
Hurst, Greg, BAE SYSTEMS
Hymes, Les, The Complete Connection
Icore, Bernard, Northrop Grumman
Corporation
Jenkins, James, Harris Corporation,
GCSD
Johnson, Kathryn L., Hexacon Electric
Company
Johnson, Laurence G., LGJ
Technologies
Kennady, Richard, Bahiatech Bahia
Technologia Ltda
Kern, Terence, Axiom Electronics, Inc.
Killion, William, Hella Electronics
Corp.
Konsowitz, Robert J., Glasteel
Industrial Laminates
Korth, Connie M., Reptron
Manufacturing Services/Hibbing
Lambert, Leo P., EPTAC Corporation
Lee, Frederic W., Northrop Grumman
Norden Systems
MacLennan, Karen E., M/A-COM Inc.
Maher, Peter E., PEM Consulting
Malewicz, Wesley R., Draeger Medical
Systems, Inc.
Mastorides, John, Sypris Electronics,
LLC
May, William Dean, NSWC - Crane
McCormick, Becky, Benchmark
Electronics Inc.
McNutt, Randy, Northrop Grumman
Meeks, Jr., Stephen, White Electronic
Designs Corp.
Merrill, James I., Boeing Aircraft &
Missiles
Mijangos, Rodrigo, Rauland-Borg
Moffitt, James H., Moffitt Consulting
Services
Moir, Jim, Hewlett Packard Co.
Moore, Ken A., Omni Training Corp.
Morris, Gordon, Raytheon Technical
Services
Muller, Mary, Eldec Corporation
Neumark, Yori, Hadco Corp.
Norris, Wallace, NSWC - Crane
Northam, Riley L.,
Norton, John S., Xerox Corporation
Nunnelley, Benetta, IEC Electronics
Corp.
Nuppola, Seppo J., Nokia Networks
Oyj
Owens, Gregg, Manufacturing
Technology Training Center
Parrish, Mel, Soldering Technology
International
Pitsch, Timothy M., Plexus Corp.
Poelking, Monica, Defense Supply
Center Columbus
Pollak, Steve, Bechtel Plant Machinery,
Inc.
Preston, John, NSWC - Crane
Quinn, Paul J., Lockheed Martin
Missiles & Space
Raby, Jim D., Soldering Technology
International
Rassal, David, 3COM Corporation
Rausch, James E., Delphi Delco
Electronics Systems
Raye, John F., Defense Supply Center
Columbus
Raye, John F., Defense Supply Center
Columbus
Rowe, Teresa M., AAI Corporation
Sanford, Kelly, Micron Custom Mfg.
Services Inc.
Schuster, Martha, U.S. Army Aviation
& Missile Command
Scott, Patricia A., Soldering
Technology International
Sherman, Lowell, Defense Supply
Center Columbus
Shibata, Ph.D. , Akikazu, JPCA-Japan
Printed Circuit Association
Siegel, Eric S., PACE, Inc.
Smith, Rick B., Foxconn PCE
Technology, Inc.
Sober, Douglas J., Bakelite Epoxy
Polymers Corp.
Steele, David B., Steele Consulting
Steen, Wayne A., Rockwell
International
Talbot, Blen F., L-3 Communications
Tennant, Gail, Celestica
Tevels, John R., Harris Corp.
Thompson, Ronald E., NSWC - Crane
Torres, Steven, Corlund Electronics
Corp.
Tucker, Linda, Blackfox Training
Institute
Ventress, Sharon T., U.S. Army
Aviation & Missile Command
Walls, C.I.D.+ , Rob, PIEK
International Education Centre BV
Wang, Ge, Northrop Grumman
Westmoreland, William A.,BEST
Inc.
Whitten, Melvyn L., Whitten
Consulting, LLC
Wilkish, George, M/A-COM Inc.
Wooldridge, James R., Rockwell
International
Xiao, Nora, Tektronix Inc.
Youngblood, Don, Honeywell Inc.
Zamborsky, Edward, OK International
Inc.
Foreword
These standards are intended to provide information on the rework, repair and modification of printed boards and electronic
assemblies. This information must also be supplemented by a performance specification that contains the requirements for
the chosen technology. When used together, these documents should lead both manufacturer and customer to consistent
terms of acceptability.
These documents supersede the following:
IPC-7711 supersedes IPC-R-700C
IPC-7721 supersedes IPC-R-700C
As technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-
ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completion
of ‘‘Suggestions for Improvement’’ forms at the end of this document.
IPC-7711A/7721A October 2003
iv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Table of Contents
PART 1 General Information and Common Procedures
1 General .............................................................................. 1
1.1 Scope ............................................................................. 1
1.2 Purpose .......................................................................... 1
1.2.1 Definition of Requirements ....................................... 1
1.2.2 Requirements Flowdown .......................................... 1
1.3 Background ................................................................... 1
1.4 Controls ......................................................................... 1
1. Modification
....................................................................... 1
2. Rework
.............................................................................. 1
3. Repair
................................................................................ 1
1.4.1 Classification .............................................................. 2
1. Class 1 – General Electronics Products
........................... 2
2. Class 2 – Dedicated Service Electronic Products
............ 2
3. Class 3 – High Performance Electronic Products
............ 2
1.4.2 Printed Board Types .................................................. 2
R. Rigid Printed Boards and Assemblies
.............................. 2
F. Flexible Printed Boards and Assemblies
.......................... 2
W. Discrete Wiring Boards and Assemblies
........................... 2
C. Ceramic Boards and Assemblies
...................................... 2
1.4.3 Level of Conformance ............................................... 2
1.4.4 Levels of Conformance ............................................. 2
L. Lowest Level
..................................................................... 2
M. Medium Level
.................................................................... 2
H. Highest Level
.................................................................... 2
1.4.5 Skill Level ................................................................... 3
1.5 Terms and Definitions .................................................. 3
1.6 Training .......................................................................... 3
1. Soldering Skills
.................................................................. 3
2. Personnel Selection
.......................................................... 3
3. Professional Training
......................................................... 3
1.7 Basic Considerations ................................................... 4
1. Appropriate Approvals
....................................................... 4
2. Singular Procedures
.......................................................... 4
3. Quality and Reliability
....................................................... 4
4. Procedure Selection
.......................................................... 4
5. Patience
............................................................................ 4
6. Heat Application
................................................................ 4
7. Removal of Coatings
......................................................... 4
1.8 Tools and Materials ...................................................... 4
1. Proper Workstations
.......................................................... 4
2. High Quality Microscope
................................................... 4
3. Lighting
.............................................................................. 4
4. Soldering Tools
................................................................. 4
5. Component Removal and Installation
............................... 4
6. Preheating (Auxiliary) Heating
.......................................... 4
7. Fume Extraction
................................................................ 4
8. Hand Held Drilling and Grinding Tool
............................... 4
9. Precision Drill/Mill System
................................................. 5
10. Replacement Conductors and Lands
............................... 5
11. Gold Plating System
......................................................... 5
12. Epoxy and Coloring Agents
.............................................. 5
13. Eyelets and Eyelet Press System
..................................... 5
14. Cleaning Station/System
................................................... 5
15. Tools and Supplies
............................................................ 5
16. Conformal Coating Area
................................................... 5
17. Materials
............................................................................ 5
1.9 Process Goals and Guidelines .................................... 5
1.9.1 Non-destructive Component Removal .................... 6
1.9.2 Surface Mount Land Preparation ............................. 6
1. Remove Old Solder
........................................................... 6
2. Clean Lands
...................................................................... 6
1.9.3 Component Installation ............................................. 6
1.9.4 Primary Heating Methods ......................................... 7
1.9.5 Preheating and Auxiliary Heating Methods ............ 8
1.9.6 Vision Systems and Surface Mount
Component Placement ......................................................... 8
1.9.7 Selecting Optimum Process for Manual
Assembly/Rework .................................................................. 9
1.9.8 BGA/CSP/Flip Chip Time Temperature
Profile TTP) ............................................................................ 9
1.9.9 Lead Free Solder ....................................................... 9
October 2003 IPC-7711A/7721A
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---