IPC 7711A.pdf - 第133页
EQUIPMENT REQUIRED Soldering system Heater handpiece with vacuum cup BGA removal tip MATERIALS Cleaner Flux PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides or residues. 2. …
4. Perform alignment of gas nozzle to component location.
5. Bring gas focusing nozzle into re-flow position.
6. Perform TTP re-flow cycle defined by procedural analysis.
7. Clean PWA as appropriate to customer requirements.
IPC-7711A
Number: 3.9.1
Revision:
Date: 2/98
Subject: BGA/CSP Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Heater handpiece with vacuum cup
BGA removal tip
MATERIALS
Cleaner
Flux
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install BGA removal tip and vacuum cup into dual handpiece. (See Figures1&2.)
3. Start with tip temperature of approximately 371°C and change as necessary.
4. Lower tip over component. (See Figure 3.)
NOTE: Injection of liquid flux under component may reduce cycle time.
5. Confirm solder melt of ALL joints. (See Figure 4.)
6. Actuate vacuum and lift component from PWB. (See Figure 5.)
7. Release component onto a heat resistant surface.
8. Prepare lands for component replacement.
Figure 1 Install Tip
Figure 2 Install Vacuum Cup
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
BGA Removal
Vacuum Method
Number: 3.9.2
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.9.2
Revision:
Date: 2/98
Subject: BGA Removal
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---