IPC 7711A.pdf - 第316页

Jumper Wire Termination Figures – Through-Hole Components * Jumper wires soldered into plated-through holes must be discernible on the opposite side. + Jumper wires soldered to lifted or clipped component leads may requi…

100%1 / 344
Table 1 Jumper Wire Termination Methods
Figure Type Wire Termination Method Acceptability
7 PTH Hole Wire soldered into plated-through hole on component side. * Acceptable
8 PTH Lead Wire soldered parallel to lead on component side. Acceptable
9 PTH Hole Wire soldered into plated-through hole on solder side. * Acceptable
10 PTH Hole Wire wrapped around component lead on solder side. Acceptable
11 PTH Hole Wire wrapped around lead on component side. Acceptable
12 PTH Lead Wire soldered to lifted component lead. + Acceptable
13 PTH Lead Wire soldered to clipped lead on component side. + Acceptable
14 PTH Lead Wire looped and soldered to adjacent component leads. Acceptable
15 PTH Lead Wire soldered to lead, wire over component. Not Recommended
16 PTH Lead Soldered perpendicular to component lead. Not Recommended
17 PTH Lead Multiple wires soldered to component lead overhanging edge. Not Recommended
18 Chip Wire soldered to pad, parallel or perpendicular to component. Acceptable
19 Chip Wire soldered parallel or perpendicular to component. Acceptable
20 Chip Wire soldered to component end, lifted off pad. Acceptable
21 Chip Multiple wires overhanging pad edge. Not Recommended
22 PTH Hole Wire soldered into plated-through hole. * Acceptable
23 PTH Pad Wire soldered across top of PTH pad. Acceptable
24 PTH Pad Multiple wires soldered to pad overhanging pad edge. Not Recommended
25 Conductor Wire soldered parallel to conductor, contact, SMT pad. Acceptable
26 Conductor Wire perpendicular to conductor, contact, SMT pad. Not Recommended
27 Conductor Multiple wires soldered to conductor, contact, SMT pad. Not Recommended
28 J Lead Wire soldered parallel to component lead. Acceptable
29 J Lead Wire soldered to clipped component lead. + Acceptable
30 J Lead Wire looped and soldered to adjacent component leads. Acceptable
31 J Lead Wire soldered to component lead, wire running over component. Not Recommended
32 J Lead Wire soldered perpendicular to lead. Not Recommended
33 J Lead Multiple wires soldered to lead overhanging edge. Not Recommended
34 J Lead Wire soldered to lifted component lead. Not Recommended
35 Gull Wing Wire soldered parallel to component lead. Acceptable
36 Gull Wing Wire soldered to lifted component lead. + Acceptable
37 Gull Wing Wire soldered to clipped component lead. + Acceptable
38 Gull Wing Wire looped and soldered to adjacent component leads. Acceptable
39 Gull Wing Wire soldered to component lead, wire over component. Not Recommended
40 Gull Wing Wire soldered perpendicular to component lead. Not Recommended
41 Gull Wing Multiple wires soldered to lead overhanging edge. Not Recommended
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page5of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Jumper Wire Termination Figures – Through-Hole Components
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
Figure 7
Acceptable
Wire soldered into
plated-through hole, component side. *
Figure 10
Acceptable
Wire wrapped
around component lead on solder side.
Figure 13
Acceptable
Wire soldered to
clipped lead on component side. +
Figure 16
Not Recommended
Soldered
perpendicular to component lead.
Figure 8
Acceptable
Wire soldered
parallel to lead on component side.
Figure 11
Acceptable
Wire wrapped
around lead on component side.
Figure 14
Acceptable
Wire looped and
soldered to adjacent component leads.
Figure 17
Not Recommended
Multiple
wires soldered to lead overhanging edge.
Figure 9
Acceptable
Wire soldered into
plated-through hole on solder side. *
Figure 12
Acceptable
Wire soldered to
lifted component lead. +
Figure 15
Not Recommended
Wire
soldered to lead, wire over component.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page6of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Jumper Wire Termination Figures – Chip Components, Pads and Conductors
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
Figure 18
Acceptable
Wire soldered to
pad, parallel or perpendicular to component.
Figure 21
Not Recommmended
Multiple
wires overhanging pad edge.
Figure 22
Acceptable
Wire soldered into
plated-through hole. *
Figure 25
Acceptable
Wire soldered
parallel to conductor, contact, SMT pad.
Figure 19
Acceptable
Wire soldered
parallel or perpendicular to component.
Figure 23
Acceptable
Wire soldered
across top of PTH pad.
Figure 26
Not Recommended
Wire per-
pendicular to conductor; contact, SMT pad.
Figure 20
Acceptable
Wire soldered to
component end, lifted off pad.
Figure 27
Not Recommended
Multiple
wires soldered to conductor, contact, SMT pad.
Figure 24
Not Recommended
Multiple
wires soldered to pad overhanging pad edge.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page7of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---