IPC 7711A.pdf - 第170页
12. Repeat steps 6 through 9 on each row. 13. Clean, if required, and inspect. NOTES IPC-771 1A Number: 5.5.5 Revision: Date: 2/98 Subject: Gull Wing Installation P a g e2o f2 Copyright Association Connecting Electronics…
EQUIPMENT REQUIRED
Soldering system
Soldering handpiece
Hook tip
MATERIALS
Solder form wire recommended less than 0.4 mm
Flux-cored solder
Flux
NOTES
The type of vision assistance will vary with the pitch of the components to be sol-
dered and should be determined by the needs of each assembly and/or operator.
The amount of flux necessary is minimal.
PROCEDURE
1. Install tip into handpiece.
2. Start with tip temperature of approximately 315°C and change as necessary.
3. Begin by applying flux to a corner land, then place a light bump of solder evenly
across the land. This will be the first of two points that will fix the component to
the board. (See Figure 1.)
4. Align the component to the lands. Since one lead will be resting on a solder
bump, do not expect proper coplanarity at this point.
5. When the component is properly aligned, lightly flux the prepped land and the
lead over it and bring a clean tip down to the land, in front of the toe of the lead.
Do not contact the lead – heat only the land. (See Figure 2.)
6. Clean tip with damp sponge.
7. Move to the diagonally opposite corner lead from the one that was just tacked.
Reposition the component if the alignment has wandered, and lightly flux the
lead. Place a lightly tinned tip on the land in front of the lead, allow it to absorb
heat for a moment, then feed solder wire to the land at the gap between the tip
and the lead to create the second fixturing joint (See Figure 3.)
8. Lightly flux the first row of leads to be soldered. (See Figure 4.)
9. Lay the solder wire along the inside of the curve that forms the lead’s heel.
10. Tin the tip lightly to create a solder bridge that will facilitate heat transfer.
11. Skipping the tacked leads, move down the row, placing the tip on each land
consecutively, abutting the toe of lead. When the joint is properly formed, move
to the next lead until the row is completed. (See Figure 5.)
Figure 1 Start at Corners
Figure 2 Heat Only Land
Figure 3 Feed Solder into Gap
Figure 4 Flux Leads
Figure 5 Align Tip Lead
Solder Wire
Solder Bridge
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Gull Wing Installation
Hook Tip w/Wire Layover
Number: 5.5.5
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
12. Repeat steps 6 through 9 on each row.
13. Clean, if required, and inspect.
NOTES
IPC-7711A
Number: 5.5.5
Revision:
Date: 2/98
Subject: Gull Wing Installation
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system(s)
1 or 2 Soldering handpieces
Blade tip
MATERIALS
Flux-cored solder
Flux
PROCEDURE
1. Select a blade tip appropriate for the component being soldered and the clear-
ances available on the board. The tip should allow each row to be soldered in one
pass. (See Figure 1.)
2. Start with tip temperature of approximately 315°C and change as necessary.
3. Tin the tip on the beveled edge and clean the surface on the sponge. If this does
not produce a clean shiny surface use the manufacturer’s recommended meth-
ods to remove any oxidation and/or discoloration. (See Figure 2.)
4. Flux the row to be soldered. (See Figure 3.)
5. Place wire solder across the row of leads at the first bend that is in contact with
the lands. (See Figure 4.)
6. Bring the clean tip, free of any solder, bevel face down on the wire solder at the
inside bend of the joint. Hold for a moment, until the solder has wetted to the
leads and lands.
7. Keeping the bevel flat on the leads, draw the blade toward the toe and off the end
of the lead.
Figure 1 Select Tip
Figure 2 Tin Tip
Figure 3 Apply Flux
Figure 4 Place Solder
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Gull Wing Installation
Blade Tip with Wire
Number: 5.5.6
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: Medium
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---