IPC 7711A.pdf - 第185页
EQUIPMENT REQUIRED Solder removal system Convective reflow station Reballing fixture OPTIONAL EQUIPMENT Reflow oven Bake-out (vacuum, convection) oven MATERIALS Flux Cleaner Tissue/wipes Solder spheres NOTE Moisture sens…
3. Place the PWA in the system work piece holder.
4. Set hot gas reflow system to achieve the TTP defined by procedural analysis.
5. Perform alignment of gas nozzle to component location (use template, vision
system or x-y locator as available/appropriate).
6. Using component placement aids available (vacuum placement pick, x-y loca-
tor, etc.), place BGA onto land area while observing indexing/keying indicators
to assume proper theta orientation.
7. Bring gas focusing nozzle into reflow position and accomplish fine alignment.
8. Perform TTP reflow cycle defined by procedural analysis.
9. Perform accelerated cooling cycle if appropriate.
10. Clean PWA as appropriate to customer requirements.
11. Perform x-ray inspection of PWA if appropriate.
IPC-7711A
Number: 5.7.2
Revision:
Date: 2/98
Subject: BGA/CSP Installation Using Solder Paste to Prefill Lands
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Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Solder removal system
Convective reflow station
Reballing fixture
OPTIONAL EQUIPMENT
Reflow oven
Bake-out (vacuum, convection) oven
MATERIALS
Flux
Cleaner
Tissue/wipes
Solder spheres
NOTE
Moisture sensitive components (as classified by IPC/JEDEC J-STD-020 or equivalent
documented procedure) must be handled in a manner consistent with J-STD-033 or
an equivalent documented procedure.
CAUTION
Verify component can withstand the multiple reflow cycles.
PROCEDURE
1. Remove excess solder in accordance with procedures 4.1.2, 4.1.3, or 4.2.1
2. Clean and inspect BGA for coplanarity.
3. Apply flux to land on BGA. (Figure 1.)
4. Insert the BGA into the applicable reballing fixture and secure. (Figure 2.)
5. Carefully pour solder sphere into fixture. (Figure 3.)
6. Drain off all excess spheres. Ensure all holes in fixture have a solder sphere.
7. Reflow solder spheres using the established profile. (Figure 4.)
8. Allow BGA to cool and remove from fixture.
9. Clean (if necessary) and inspect the BGA.
Figure 1
Figure 2
Figure 3
Figure 4
7711A
Rework of
Electronic Assemblies
Revision:
Date: 5/02
BGA Reballing Procedure
Number: 5.7.3
Product Class: R, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 5.7.3
Revision:
Date: 5/02
Subject: BGA Reballing Procedure
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---