IPC 7711A.pdf - 第317页

Jumper Wire Termination Figures – Chip Components, Pads and Conductors * Jumper wires soldered into plated-through holes must be discernible on the opposite side. + Jumper wires soldered to lifted or clipped component le…

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Jumper Wire Termination Figures – Through-Hole Components
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
Figure 7
Acceptable
Wire soldered into
plated-through hole, component side. *
Figure 10
Acceptable
Wire wrapped
around component lead on solder side.
Figure 13
Acceptable
Wire soldered to
clipped lead on component side. +
Figure 16
Not Recommended
Soldered
perpendicular to component lead.
Figure 8
Acceptable
Wire soldered
parallel to lead on component side.
Figure 11
Acceptable
Wire wrapped
around lead on component side.
Figure 14
Acceptable
Wire looped and
soldered to adjacent component leads.
Figure 17
Not Recommended
Multiple
wires soldered to lead overhanging edge.
Figure 9
Acceptable
Wire soldered into
plated-through hole on solder side. *
Figure 12
Acceptable
Wire soldered to
lifted component lead. +
Figure 15
Not Recommended
Wire
soldered to lead, wire over component.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page6of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Jumper Wire Termination Figures – Chip Components, Pads and Conductors
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
Figure 18
Acceptable
Wire soldered to
pad, parallel or perpendicular to component.
Figure 21
Not Recommmended
Multiple
wires overhanging pad edge.
Figure 22
Acceptable
Wire soldered into
plated-through hole. *
Figure 25
Acceptable
Wire soldered
parallel to conductor, contact, SMT pad.
Figure 19
Acceptable
Wire soldered
parallel or perpendicular to component.
Figure 23
Acceptable
Wire soldered
across top of PTH pad.
Figure 26
Not Recommended
Wire per-
pendicular to conductor; contact, SMT pad.
Figure 20
Acceptable
Wire soldered to
component end, lifted off pad.
Figure 27
Not Recommended
Multiple
wires soldered to conductor, contact, SMT pad.
Figure 24
Not Recommended
Multiple
wires soldered to pad overhanging pad edge.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page7of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Jumper Wire Termination Figures – J Lead Components
* Jumper wires soldered into plated-through holes must be discernible on the opposite side.
+ Jumper wires soldered to lifted or clipped component leads may require insulation to prevent shorting.
Figure 28
Acceptable
Wire soldered
parallel to component lead.
Figure 31
Not Recommended
Wire
soldered to lead, over component.
Figure 34
Not Recommended
Wire sol-
dered to lifted component lead.
Figure 29
Acceptable
Wire soldered to
clipped component lead. +
Figure 32
Not Recommended
Wire
soldered perpendicular to lead.
Figure 30
Acceptable
Wire looped and
soldered to adjacent leads.
Figure 33
Not Recommended
Multiple
wires soldered to lead overhanging edge.
IPC-7721A
Number: 6.1
Revision:
Date: 11/99
Subject: Jumper Wires
Page8of10
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---