德森印刷机说明书之操作手册-4d1321fc284ac850ac024234.pdf - 第27页
深圳德森精密设备有限公司 Shenzhen Desen Pre cision Machine Co., Ltd. - 27 - 0.5 ～ 2mm . The s etting scope of d emoulding leng th a llowed by t his p rinting machine i s 0 ～ 10mm . 3.3 3.3 3.3 3.3 试生产 3.3 3.3 3.3 3.3 T rial T rial T…
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 26 -
刮刀压力： 压力直接影响印刷效果，压力以保证印出的焊膏边缘清晰，表面平整，厚度
适宜为准。压力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因
此刮刀压力一般是设定为 0.5 ～ 10kg 。
Squeegee pressure: pressure has a direct bearing on the printing effect.
A
proper pressure shall
guarantee clear edges, smooth surface and appropriate thickness of solder paste.
T
oo small pressure
will result in insufficient solder paste and further cold joints; and too large pressure will lead to
solder paste connection and further bridging . G enerally speaking, squeegee pressure is set during
0.5 ～ 10kg .
注：每增加或减小 1kg 刮刀行程 ± 0.4mm
Note: for the increment or decrease of 1kg, the squeegee travel will change by ± 0.4mm.
3.2.6
3.2.6
3.2.6
3.2.6
脱模速度和脱模长度
3.2.6
3.2.6
3.2.6
3.2.6
Speed
Speed
Speed
Speed
and
and
and
and
length
length
length
length
of
of
of
of
demoulding
demoulding
demoulding
demoulding
脱模速度： 指印刷后的基板脱离模板的速度，在焊膏与范本完全脱离之前，分离速度要
慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印
刷尤其重要。一般设定为 3mm/s ，太快易破坏锡膏形状。
Speed
Speed
Speed
Speed
of
of
of
of
demoulding
demoulding
demoulding
demoulding
:
:
:
:
it
refers to the speed for the printed base board to break away from
formwork. T he speed shall be slower before the thorough separation of solder paste and sample; and
the base board can decline quickly after the thorough separation. S lower separation is in favor of the
formation of clear edges, which is quite crucial to the small space printing. G enerally speaking, the
speed is set as 3mm/s . Excessively quick speed is prone to damage the solder paste shape.
本机器允许设置范围为 0 ～ 20mm/s 。
The setting scope of demoulding speed allowed by this printing machine is 0 ～ 20mm/s .
PCB
PCB
PCB
PCB
与范本的分离时间： 即印刷后的基板以脱板速度离开模板所需要的时间。 时间过
长，
易在范本底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在 1 秒左右。
Separation time of PCB board and sample:
it
refers to the time for the printed base board to
break away from the formwork
at
the demoulding speed. E xcessively long time is prone to leave
solder paste on the sample bottom; and excessively short time results in poor standing of solder paste .
G enerally speaking, the time is controlled
at
1s or so.
本机器用脱模长度来控制此变量，一般设定为 0.5 ～ 2mm 。本机器允许设置范围为 0 ～
10mm 。
This printing machine controls this variable with demoulding length which is generally set as
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 27 -
0.5 ～ 2mm . The setting scope of demoulding length allowed by this printing machine is 0 ～ 10mm .
3.3
3.3
3.3
3.3
试生产
3.3
3.3
3.3
3.3
Trial
Trial
Trial
Trial
production
production
production
production
在以上准备工作做完以后，即可进行 PCB 板的试印刷。操作方法是：
Trial printing of PCB board can be practiced after the completion of the preparations above.
F ollowing are the operation method:
1.
单击主工具栏中的 [ 开始生产 ] 按钮并按照操作接口上对话框的提示进行操作， 完成一 块
PCB 板的自动印刷（详见第四章主工具栏的操作说明） 。
1. Click Start Production in the main tool bar and operate following the prompts in the dialog box
of operation interface to finish the automatic printing of a PCB board (see the operating
instructions in the main tool bar of Chapter IV for more details);
2.
如检测结果不符合质量要求，应重新进行编辑或输入印刷误差补偿值（详见第四章
4.4.14 “ 生产设置 ” 对话框；如检查结果满足质量要求，即可正式开始生产。
2. In the event that the inspection result dose not conform to the quality requirement,
it
is necessary
to edit or input the printing error compensation value again (see the dialog box of 4.4.14
“ Production Setting ” in Chapter IV); and in the event that the inspection result meets the quality
requirement, production can be started formally;
3.
锡膏印刷质量要求：
本机器设定锡膏厚度在 0.1 — 0.3mm 之间、 焊膏覆盖焊盘的面积在 75% 以上即满足质 量
要求。
3. Quality requirement for solder paste printing:
According to the settings, the printing machine
’
s
quality requirement can be met when the
solder paste thickness is during 0.1 — 0.3mm and the area of bonding pad covered by solder
paste is above 75%; and
4.
网板清洗品质检测：
本机器设定锡膏堵塞网板的覆盖面积超过 20% 会有报警提示，此时可单击主工具栏
中 [ 网板清洗 ] ，重新设置清洗方式或清洗的时间间隔等参数。
4. Quality inspection for the cleaning of screen:
As set, the printing machine will give alarm when the covered area of solder paste on the
screen is larger than 20%, click the Screen Cleaning in the main tool bar to reset parameters
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 28 -
such as cleaning manner or cleaning time interval.
3.4
3.4
3.4
3.4
生产流程
3.4
3.4
3.4
3.4
Production
Production
Production
Production
flow
flow
flow
flow
开启总电源开关
打开气源开关
打开机器主电源开关
进入机器主画面
机器归零
新建文件
生产编辑
打开已有文件
钢网定位
保存檔
PCB 进板
开始生产
PCB 到位
视觉校正
印刷焊膏
网板清洗
停止生产
退出主画面
关闭主电源开关
继
续
生
产
关闭气源开关
关闭总电源开关