IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG.pdf - 第5页
Acknowledgment Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Plating Processes Subcommittee (4-14) of the Fabrication Processes Committee (4-…
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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the Plating Processes Subcommittee (4-14) of the Fabrication Processes Committee (4-10) are shown below, it is not pos-
sible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend
their gratitude.
Fabrication Processes
Committee
Co-Chairs
George Milad
Uyemura International Corp.
Gerard A. O’Brien
Technical Liaison of the
IPC Board of Directors
Solderability Testing & Solutions, Inc.
Plating Processes
Subcommittee
Co-Chairs
George Milad
Uyemura International Corp.
Gerard A. O’Brien
Solderability Testing & Solutions, Inc.
Bob Neves
Microtek Laboratories
Dongkai Shangguan
Flextronics International
Plating Processes Subcommittee
Wallace Ables, Dell Inc.
Martin Anselm, Universal
Instruments Corporation
Craig Bachman, Molex Copper Flex
Products
Tina Barclay, TAS Consulting
Bill Barthel, Plexus Manufacturing
Solutions
Martin W. Bayes, Ph.D., Dow
Electronic Materials
Luc Beauvillier, Isola Group SARL
Elizabeth Benedetto, Hewlett-Packard
Company
Jon Bengston, Uyemura International
Corp.
Wendi Boger, Viasystems Group, Inc.
Jim Bogert, Fischer Technology Inc.
Mumtaz Y. Bora, Peregrine
Semiconductor
William C. Bowerman, OMG
Electronic Chemicals
Trevor S. Bowers, Adtran Inc.
Peter Bratin, Ph.D., ECI Technology,
Inc.
Jerry Brewer, Atotech USA Inc.
Dock Brown, Medtronic
Lee Burger, OMG Electronic
Chemicals
Matthew J. Byrne, BAE Systems
Platform Solutions
Mike V. Carano, OMG Electronic
Chemicals
Srinivas Chada, Ph.D., Power-One
Alex Chen, Celestica
Renewable Energies Inc.
Peter Chiang, MSI (Micro-Star
International Co., Inc.)
Joshua Civiello, Defense Supply
Center Columbus
Horst Clauberg, Kulicke & Soffa
Industries Inc.
Christine R. Coapman, C2 Consulting
David J. Corbett, Defense Supply
Center Columbus
G. Sidney Cox, Ph.D., DuPont
Donald Cullen, MacDermid, Inc.
Richard Davidson, Honeywell
Aerospace
Michael F. DiCicco, Northrop
Grumman Corporation
Karl H. Dietz, Ph.D., Karl Dietz
Consulting LLC
Steven Dunford, Schlumberger Well
Services
Gene Dunn, Plexus Corporation
C. Don Dupriest, Lockheed Martin
Missiles & Fire Control
Patricia S. Dupuis, Raytheon
Company
Richard M. Edgar, Tec-Line Inc.
Theodore Edwards
Steven R. Etheridge, Dell Inc.
John J. Fendrock, Raytheon Missile
Systems
Ellen Finch, Anaren Microwave Inc.
Sandra M. Fortune, Northrop
Grumman Corporation
Dennis Fritz, MacDermid, Inc.
Hiroyuki Fukuda, Shikoku Chemicals
Corporation
Lionel Fullwood, WKK Distribution
Ltd.
Gerald Gagnon, Extech Instruments
Corporation
Thomas Gahagan, Anaren Microwave
Inc.
Andrew Glendening, Northrop
Grumman ESSD
Robert Gordon, Amonix, Inc.
Michael R. Green, Lockheed Martin
Space Systems Company
Albin Gruenwald, Uyemura
International Corp.
Donald Gudeczauskas, Uyemura
International Corp.
Michael Haller, Fischer Technology
Inc.
Philip M. Henault, Raytheon
Company
David D. Hillman, Rockwell Collins
Charles Hirbour, Technic Inc.
Joanne Hohman, Lockheed Martin
Missiles & Fire Control
Helen Holder, Hewlett-Packard
Company
Michelle Hong, Wistron Corporation
Jay Huang, Wistron Corp.
Werner Huegel, Ph.D., Robert Bosch
GmbH
Jim Huff, Dell Inc.
Joseph Jacobi, Lockheed Martin
Missiles & Fire Control
January 2013 IPC-4556
iii
Kuldip Johal, Atotech USA Inc.
William Johannes, Sandia National
Labs Albuquerque
Patrick A. Jones, Northrop Grumman
Corporation
James B. Kenny, Enthone Inc. -
Cookson Electronics
John Konrad, Endicott Interconnect
Technologies Inc.
Rajesh C. Kumar, Viasystems North
America, Inc.
Henry Lajoie, OMG Electronic
Chemicals Inc.
Joseph R. LaRoche, BAE Systems
Brigitte Lawrence, Brigitflex Inc.
Paul Lomax, Fischer Technology Inc.
Anne Lomonte, Draeger Medical
Systems, Inc.
Gary Long, Intel Corporation
Clifford R. Maddox, Boeing
Company
Brian D. Madsen, Ph.D., Continental
Automotive Systems
Chris Mahanna, Robisan Laboratory
Inc.
Guenther Mayr, AT&S Austria
Technologie & Systemtechnik AG
Martin McDaniel, NSWC Crane
Joe McGurran, Atotech USA Inc.
Coleen McKirryher, MacDermid, Inc.
Tim Mckliget, Holaday Circuits Inc.
Stephen Meeks, St. Jude Medical
Peter Menuez, L-3 Communications -
Cincinnati Electronics
Renee J. Michalkiewicz, Trace
Laboratories - Baltimore
William Miller, Panasonic
Automotive Systems Company
of America
James J. Monarchio, TTM
Technologies, Inc.
Alton Moore, Raytheon Company
Ted F. Myers, ECI Technology, Inc.
David Nelson, Adtran Inc.
Keith Newman, Hewlett-Packard
Company
Thi Nguyen, Lockheed Martin
Missile & Fire Control
Gary Nicholls, Metalor Technologies
USA
Mustafa Oezkoek, Atotech
Deutschland GmbH
Sean Oflaherty, Oxford Instruments
Patrick O’Keefe, Holaday Circuits
Inc.
Wim Ongenae, MEC Europe
Mario Orduz, Cookson Electronics
William A. Ortloff, Raytheon
Company
Michael W. Paddack, Boeing
Company
J. Lee Parker, Ph.D., JLP
Dan Parquet, Viasystems Group, Inc.
Michael Pavlov, ECI Technology, Inc.
Anders Pedersen, Harris Corporation,
GCSD
Marybeth Perrino, Endicott
Interconnect Technologies Inc.
Robert Peterson, Alternate Finishing
Inc.
Michah Pledger, Semblant Ltd.
Gnyaneshwar Ramakrishna, Cisco
Systems Inc.
Gustavo Ramos, Atotech Deutschland
GmbH
Randy R. Reed, Viasystems Group,
Inc.
Robert Reid, Technic Inc.
Henry J. Rekers, Schneider Electric
Jose A. Rios, Endicott Interconnect
Technologies Inc.
Hugh Roberts, Atotech USA Inc.
Gary C. Roper, Roper Resources, Inc.
Stan Sappington, S/G Electronics Inc.
Daryl Sato, Intel Corporation
Karl A. Sauter, Oracle America, Inc.
Thomas C. Saven, Ticer Technologies
Stefan Schmitz, Fraunhofer IZM
Branch Lab Microsystem
Engineering
Michael Schneider, ECI Technology,
Inc.
Randy Schueller, Ph.D., DfR
Solutions
Michael Schwaemmlein, Atotech
Deutschland GmbH
Martin Scionti, Raytheon Missile
Systems
Jeff Seekatz, Raytheon Company
Tom Selby, Optimum Design
Associates
Gordon Simmons, Superior
Processing
Atamjit Singh, Unitech Industries
Inc.
Polina Snugovsky, Ph.D., Celestica
David Sommervold, The Bergquist
Company, Prescott
Eric J. Stafstrom, Technic Inc.
William Starmann, Raytheon
Company
Donald Susan, Ph.D., Sandia
National Labs Albuquerque
John Swanson, MacDermid, Inc.
Jeff Taylor, IBM Corporation
Matthew Taylor, Fischer Technology
Inc.
Royce Taylor, Raytheon Company
Stephen L. Tisdale, Intel Corporation
Michael Toben, Dow Electronic
Materials
Lenora M. Toscano, MacDermid, Inc.
James Trainor, OMG Electronic
Chemicals Inc.
Kristen Troxel, Hewlett-Packard
Company
Paul Vianco, Ph.D., Sandia National
Labs Albuquerque
Joe Vo, Broadcom Corporation
Donald Walsh, Uyemura International
Corp.
Karl Wengenroth, Enthone Inc. -
Cookson Electronics
Vicka White, Honeywell Inc. Air
Transport Systems
Andreas Wippel, AT&S Austria
Technologie & Systemtechnik AG
Wesley M. Wolverton, Raytheon
Systems Company
Chen Xu, Ph.D., Alcatel-Lucent
Yung-Herng Yau, Enthone Inc. -
Cookson Electronics
Joshua Young, Maxwell Technologies
Inc.
IPC-4556 January 2013
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