IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG.pdf - 第7页

Table of Contents 1 SCOPE ...................................................................... 1 1.1 Statement of Scope .............................................. 1 1.2 Description .................................…

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Kuldip Johal, Atotech USA Inc.
William Johannes, Sandia National
Labs Albuquerque
Patrick A. Jones, Northrop Grumman
Corporation
James B. Kenny, Enthone Inc. -
Cookson Electronics
John Konrad, Endicott Interconnect
Technologies Inc.
Rajesh C. Kumar, Viasystems North
America, Inc.
Henry Lajoie, OMG Electronic
Chemicals Inc.
Joseph R. LaRoche, BAE Systems
Brigitte Lawrence, Brigitflex Inc.
Paul Lomax, Fischer Technology Inc.
Anne Lomonte, Draeger Medical
Systems, Inc.
Gary Long, Intel Corporation
Clifford R. Maddox, Boeing
Company
Brian D. Madsen, Ph.D., Continental
Automotive Systems
Chris Mahanna, Robisan Laboratory
Inc.
Guenther Mayr, AT&S Austria
Technologie & Systemtechnik AG
Martin McDaniel, NSWC Crane
Joe McGurran, Atotech USA Inc.
Coleen McKirryher, MacDermid, Inc.
Tim Mckliget, Holaday Circuits Inc.
Stephen Meeks, St. Jude Medical
Peter Menuez, L-3 Communications -
Cincinnati Electronics
Renee J. Michalkiewicz, Trace
Laboratories - Baltimore
William Miller, Panasonic
Automotive Systems Company
of America
James J. Monarchio, TTM
Technologies, Inc.
Alton Moore, Raytheon Company
Ted F. Myers, ECI Technology, Inc.
David Nelson, Adtran Inc.
Keith Newman, Hewlett-Packard
Company
Thi Nguyen, Lockheed Martin
Missile & Fire Control
Gary Nicholls, Metalor Technologies
USA
Mustafa Oezkoek, Atotech
Deutschland GmbH
Sean Oflaherty, Oxford Instruments
Patrick O’Keefe, Holaday Circuits
Inc.
Wim Ongenae, MEC Europe
Mario Orduz, Cookson Electronics
William A. Ortloff, Raytheon
Company
Michael W. Paddack, Boeing
Company
J. Lee Parker, Ph.D., JLP
Dan Parquet, Viasystems Group, Inc.
Michael Pavlov, ECI Technology, Inc.
Anders Pedersen, Harris Corporation,
GCSD
Marybeth Perrino, Endicott
Interconnect Technologies Inc.
Robert Peterson, Alternate Finishing
Inc.
Michah Pledger, Semblant Ltd.
Gnyaneshwar Ramakrishna, Cisco
Systems Inc.
Gustavo Ramos, Atotech Deutschland
GmbH
Randy R. Reed, Viasystems Group,
Inc.
Robert Reid, Technic Inc.
Henry J. Rekers, Schneider Electric
Jose A. Rios, Endicott Interconnect
Technologies Inc.
Hugh Roberts, Atotech USA Inc.
Gary C. Roper, Roper Resources, Inc.
Stan Sappington, S/G Electronics Inc.
Daryl Sato, Intel Corporation
Karl A. Sauter, Oracle America, Inc.
Thomas C. Saven, Ticer Technologies
Stefan Schmitz, Fraunhofer IZM
Branch Lab Microsystem
Engineering
Michael Schneider, ECI Technology,
Inc.
Randy Schueller, Ph.D., DfR
Solutions
Michael Schwaemmlein, Atotech
Deutschland GmbH
Martin Scionti, Raytheon Missile
Systems
Jeff Seekatz, Raytheon Company
Tom Selby, Optimum Design
Associates
Gordon Simmons, Superior
Processing
Atamjit Singh, Unitech Industries
Inc.
Polina Snugovsky, Ph.D., Celestica
David Sommervold, The Bergquist
Company, Prescott
Eric J. Stafstrom, Technic Inc.
William Starmann, Raytheon
Company
Donald Susan, Ph.D., Sandia
National Labs Albuquerque
John Swanson, MacDermid, Inc.
Jeff Taylor, IBM Corporation
Matthew Taylor, Fischer Technology
Inc.
Royce Taylor, Raytheon Company
Stephen L. Tisdale, Intel Corporation
Michael Toben, Dow Electronic
Materials
Lenora M. Toscano, MacDermid, Inc.
James Trainor, OMG Electronic
Chemicals Inc.
Kristen Troxel, Hewlett-Packard
Company
Paul Vianco, Ph.D., Sandia National
Labs Albuquerque
Joe Vo, Broadcom Corporation
Donald Walsh, Uyemura International
Corp.
Karl Wengenroth, Enthone Inc. -
Cookson Electronics
Vicka White, Honeywell Inc. Air
Transport Systems
Andreas Wippel, AT&S Austria
Technologie & Systemtechnik AG
Wesley M. Wolverton, Raytheon
Systems Company
Chen Xu, Ph.D., Alcatel-Lucent
Yung-Herng Yau, Enthone Inc. -
Cookson Electronics
Joshua Young, Maxwell Technologies
Inc.
IPC-4556 January 2013
iv
Table of Contents
1 SCOPE ...................................................................... 1
1.1 Statement of Scope .............................................. 1
1.2 Description ........................................................... 1
1.2.1 Electroless Nickel Reducing Agents -
Phosphorus Content ............................................. 1
1.2.2 Electroless Palladium Reducing Agents ............. 1
1.3
1.3.1
Objective .............................................................. 1
Order of Precedence ............................................ 1
1.3.1.1
Appendices ........................................................... 1
1.4
1.4.1
1.4.2
1.4.3
Performance Functions ........................................ 1
Solderability ......................................................... 1
Wire Bonding ....................................................... 2
Contact Surface .................................................... 2
1.4.3.1
Membrane Switches ............................................. 2
1.4.3.2
Metallic Dome Contacts ...................................... 2
1.4.4
EMI Shielding ...................................................... 2
1.4.5 Interface for Conductive and/or Anisotropic
Adhesives ............................................................. 2
1.4.6
Connectors ........................................................... 2
1.4.6.1
Press-Fit Applications .......................................... 2
1.4.6.2
Edge Tab Contact Applications ........................... 2
1.4.7
Limitations of ENEPIG ....................................... 2
1.4.7.1
Creep Corrosion/Chemical Resistance ................ 2
1.4.7.2
High Frequency Signal Loss ............................... 3
2 APPLICABLE DOCUMENTS AND TERMS AND
DEFINITIONS
............................................................ 3
2.1
IPC ....................................................................... 3
2.2 American Society for Testing and Materials
(ASTM International) .......................................... 3
2.3
2.4
2.5
JEDEC .................................................................. 3
Defense Standardization Program ....................... 3
Telcordia Technologies, Inc. ................................ 3
2.6 International Organization for Standardization
(ISO) ..................................................................... 3
2.7
Terms, Definitions and Acronyms ....................... 4
3 REQUIREMENTS ...................................................... 4
3.1
3.1.1
3.2
3.2.1
3.2.2
3.2.3
3.2.4
Visual ................................................................... 5
High Magnification Reference Images ............... 6
Finish Thickness .................................................. 7
Electroless Nickel Thickness ............................... 7
Electroless Palladium Thickness ......................... 7
Immersion Gold Thickness .................................. 7
XRF Calibration Standards ................................. 8
3.2.5 Use of Non-Statistical Thickness
Specification ......................................................... 8
3.2.6
3.3
3.4
3.5
Production Overruns and/or Inventory Items ..... 8
Porosity ................................................................ 8
Adhesion .............................................................. 8
Solderability ......................................................... 9
3.5.1 Force Measurement Testing (Wetting Balance
Testing) ................................................................. 9
3.6
3.7
Cleanliness ........................................................... 9
Electrolytic Corrosion .......................................... 9
4 QUALITY ASSURANCE PROVISIONS .................... 9
4.1
4.1.1
4.1.2
4.2
4.2.1
4.2.2
General Quality Assurance Provisions ................ 9
Qualification Recommendations .......................... 9
Sample Test Coupons ........................................ 10
Quality Conformance Testing ............................ 11
Thickness Measurements ................................... 11
Qualified Processes ............................................ 11
APPENDIX 1 Chemical Definitions and Process
Sequence
.......................................... 12
APPENDIX 2 Round Robin Test Summary ........... 14
APPENDIX 3 ENEPIG PWB Surface Finish XRF
Round Robin Testing
....................... 16
APPENDIX 4 Factors Affecting Measurement
Accuracy of ENEPIG Coatings
by XRF
............................................... 23
APPENDIX 5 ENEPIG PWB Surface Finish
Wetting Balance Testing
.................. 32
APPENDIX 6 Solder Spread Testing ..................... 40
APPENDIX 7 ENEPIG PWB Surface Finish
Shear Test Project
............................ 48
APPENDIX 8 Gold Wire Bonding .......................... 58
APPENDIX 9 XRF Thickness Measurements
of thin Au and Pd (ENEPIG):
Recommendations for
Instrumentation (Detectors)
and their Limitations
........................ 64
APPENDIX 10 Gage Capability. Gage R&R
Type 1 Study
..................................... 66
APPENDIX 11 Solderability Testing Helps Select
Surface Finishes
............................... 69
January 2013 IPC-4556
v
Figures
Figure 3-1 Uniform Plating .............................................. 5
Figure 3-2 Extraneous Plating or Nickel Foot ................. 5
Figure 3-3 Edge Pull Back .............................................. 5
Figure 3-4 Skip Plating .................................................... 5
Figure 3-5 Skip Plating of Gold Over Palladium ............. 6
Figure 3-6 Skip Plating of Gold Over a Palladium
Deposit ........................................................... 6
Figure 3-7 1000X SEM Image of a Normal ENEPIG
Surface ........................................................... 6
Figure 3-8 4000X SEM Image of a Normal ENEPIG
Surface ........................................................... 6
Figure 3-9 2500X FIB Image of a Normal ENEPIG
Deposit ........................................................... 6
Figure 3-10 100,000X FIB Image of a Normal ENEPIG
Deposit ........................................................... 6
Figure 3-11 TEM Image of a Normal ENEPIG Deposit .... 7
Figure 3-12 2500X Image of Nickel that is
Hyper-Corroded ............................................. 7
Figure 3-13 The Standard IPC Force Measurement
Coupon ........................................................... 9
Figure A3-1 Test Coupon Used for XRF Round Robin
Measurements ............................................. 16
Figure A3-2 Immersion Gold Thickness Readings in
Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 18
Figure A3-3 Electroless Palladium Thickness Readings
in Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 19
Figure A3-4 Electroless Nickel Thickness Readings
in Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 20
Figure A3-5 The Impact of Feature Size on Electroless
Palladium and Immersion Gold Deposition
Thickness Plated on the Same PB .............. 22
Figure A4-SS1 XRF Spectra of 1/2 oz Cu/Epoxy vs.
1 oz Cu/Epoxy ............................................. 28
Figure A4-SS2 XRF Spectra of ENEPIG Plated on Cu
(No Epoxy) vs. 1/2 oz Cu/Epoxy ................. 29
Figure A4-SS3 XRF Spectra of ENEPIG Plated on Cu
(No Epoxy) vs. ENEPIG Plated on 1 oz
Cu/Epoxy ...................................................... 30
Figure A4-SS4 XRF Spectrum of ENEPIG Plated on
1 oz Cu/Epoxy ............................................. 31
Figure A5-1 Example of the Wetting Balance Coupon
Used for the Testing of ENEPIG .................. 32
Figure A5-2
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.1 micron Electroless
Palladium ..................................................... 33
Figure A5-3
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.2 micron Electroless
Palladium ..................................................... 33
Figure A5-4
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.3 micron Electroless
Palladium ..................................................... 33
Figure A5-5
Metronelec ST88 Wetting Balance
Used for the Testing ..................................... 33
Figure A5-6 Example of the Wetting Performance for
a Nominal 4 µin Electroless Palladium
Tested with SnPb Solder .............................. 34
Figure A5-7 Example of the Wetting Performance for
a Nominal 8 µin Electroless Palladium
Tested with SnPb Solder .............................. 34
Figure A5-8 Example of the Wetting Performance for
a Nominal 20 µin Electroless Palladium
Tested with SnPb Solder .............................. 35
Figure A5-9 Example of the Wetting Performance for
a Nominal 4 µin Electroless Palladium
Tested with SAC305 Solder ......................... 35
Figure A5-10 Example of the Wetting Performance for
a Nominal 8 µin Electroless Palladium
Tested with SAC305 Solder ......................... 36
Figure A5-11 Example of the Wetting Performance for
a Nominal 12 µin Palladium Tested with
SAC305 Solder ............................................ 36
Figure A5-12 Example of a Nominal 4 µin Electroless
Palladium ENEPIG Post Temperature and
Humidity Stressing, Tested with SnPb -
Showing Excellent Robustness .................... 37
Figure A5-13 Example of a Nominal 4 µin Electroless
Palladium ENEPIG, with Very Thin
Immersion Gold after Temperature and
Humidity Stressing & Tested with SnPb ...... 38
Figure A5-14 Example of a Nominal 6 µin ENEPIG
Deposit Tested with SAC305 Post
Stressing – Showing Excellent
Robustness of Deposit ................................. 38
Figure A5-15 Performance of Sample Group 20 (with
thin gold) with SAC305 Post Stressing ........ 39
Figure A6-1 Layout of Test Board Used for Solder
Spread and Wetting Balance Testing .......... 41
Figure A6-2
Solder Spread Pattern and Paste Stencil .... 41
Figure A6-3 An Actual Solder Spread Result Showing
the Deposits Counted for Each Line of
the Pattern ................................................... 42
Figure A6-4 Solder Spread Results Using an ROL1
Sn/Pb/Ag Solder Paste on ENEPIG
Deposits ....................................................... 43
Figure A6-5 Solder Spread Results Using an ROL0
Pb-free Solder Paste of the SAC 300
Family on ENEPIG Deposits ........................ 44
Figure A6-6 Solder Spread for Lowest Spread ENEPIG
Sample Showing Evidence of High Contact
Angle and Dewetting for Some Areas of
the Printed Board ......................................... 45
Figure A6-7 Solder Spread Results for Pb-free Solder
Paste as a Function of the EN Layer
Thickness in the ENEPIG Deposit ............... 46
Figure A7-1
Shear Test Coupon ...................................... 48
Figure A7-2
DAGE 5000 Shear Test System .................. 49
Figure A7-3
Solderball Shear Results ............................. 49
Figure A7-4
Sn63Pb37 Test Coupon 19 .......................... 52
Figure A7-5
Sn63Pb37 Test Coupons1&2 ................... 52
Figure A7-6
Sn63Pb37 Test Coupons3&4 ................... 52
IPC-4556 January 2013
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