IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG.pdf - 第9页

Figure A7-7 Sn63Pb37 T est Coupon s5&6 ................... 53 Figure A7-8 Sn63Pb37 T est Coupon s7&8 ................... 53 Figure A7-9 Sn63Pb37 T est Coupon 18 .......................... 53 Figure A7-10 Sn63Pb37…

100%1 / 92
Figures
Figure 3-1 Uniform Plating .............................................. 5
Figure 3-2 Extraneous Plating or Nickel Foot ................. 5
Figure 3-3 Edge Pull Back .............................................. 5
Figure 3-4 Skip Plating .................................................... 5
Figure 3-5 Skip Plating of Gold Over Palladium ............. 6
Figure 3-6 Skip Plating of Gold Over a Palladium
Deposit ........................................................... 6
Figure 3-7 1000X SEM Image of a Normal ENEPIG
Surface ........................................................... 6
Figure 3-8 4000X SEM Image of a Normal ENEPIG
Surface ........................................................... 6
Figure 3-9 2500X FIB Image of a Normal ENEPIG
Deposit ........................................................... 6
Figure 3-10 100,000X FIB Image of a Normal ENEPIG
Deposit ........................................................... 6
Figure 3-11 TEM Image of a Normal ENEPIG Deposit .... 7
Figure 3-12 2500X Image of Nickel that is
Hyper-Corroded ............................................. 7
Figure 3-13 The Standard IPC Force Measurement
Coupon ........................................................... 9
Figure A3-1 Test Coupon Used for XRF Round Robin
Measurements ............................................. 16
Figure A3-2 Immersion Gold Thickness Readings in
Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 18
Figure A3-3 Electroless Palladium Thickness Readings
in Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 19
Figure A3-4 Electroless Nickel Thickness Readings
in Microinches for the Sixteen Test Pads
Where C Is the Reference XRF ................... 20
Figure A3-5 The Impact of Feature Size on Electroless
Palladium and Immersion Gold Deposition
Thickness Plated on the Same PB .............. 22
Figure A4-SS1 XRF Spectra of 1/2 oz Cu/Epoxy vs.
1 oz Cu/Epoxy ............................................. 28
Figure A4-SS2 XRF Spectra of ENEPIG Plated on Cu
(No Epoxy) vs. 1/2 oz Cu/Epoxy ................. 29
Figure A4-SS3 XRF Spectra of ENEPIG Plated on Cu
(No Epoxy) vs. ENEPIG Plated on 1 oz
Cu/Epoxy ...................................................... 30
Figure A4-SS4 XRF Spectrum of ENEPIG Plated on
1 oz Cu/Epoxy ............................................. 31
Figure A5-1 Example of the Wetting Balance Coupon
Used for the Testing of ENEPIG .................. 32
Figure A5-2
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.1 micron Electroless
Palladium ..................................................... 33
Figure A5-3
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.2 micron Electroless
Palladium ..................................................... 33
Figure A5-4
XRF Measurements of Gold and
Palladium Thicknesses Supplied
as Nominal 0.3 micron Electroless
Palladium ..................................................... 33
Figure A5-5
Metronelec ST88 Wetting Balance
Used for the Testing ..................................... 33
Figure A5-6 Example of the Wetting Performance for
a Nominal 4 µin Electroless Palladium
Tested with SnPb Solder .............................. 34
Figure A5-7 Example of the Wetting Performance for
a Nominal 8 µin Electroless Palladium
Tested with SnPb Solder .............................. 34
Figure A5-8 Example of the Wetting Performance for
a Nominal 20 µin Electroless Palladium
Tested with SnPb Solder .............................. 35
Figure A5-9 Example of the Wetting Performance for
a Nominal 4 µin Electroless Palladium
Tested with SAC305 Solder ......................... 35
Figure A5-10 Example of the Wetting Performance for
a Nominal 8 µin Electroless Palladium
Tested with SAC305 Solder ......................... 36
Figure A5-11 Example of the Wetting Performance for
a Nominal 12 µin Palladium Tested with
SAC305 Solder ............................................ 36
Figure A5-12 Example of a Nominal 4 µin Electroless
Palladium ENEPIG Post Temperature and
Humidity Stressing, Tested with SnPb -
Showing Excellent Robustness .................... 37
Figure A5-13 Example of a Nominal 4 µin Electroless
Palladium ENEPIG, with Very Thin
Immersion Gold after Temperature and
Humidity Stressing & Tested with SnPb ...... 38
Figure A5-14 Example of a Nominal 6 µin ENEPIG
Deposit Tested with SAC305 Post
Stressing – Showing Excellent
Robustness of Deposit ................................. 38
Figure A5-15 Performance of Sample Group 20 (with
thin gold) with SAC305 Post Stressing ........ 39
Figure A6-1 Layout of Test Board Used for Solder
Spread and Wetting Balance Testing .......... 41
Figure A6-2
Solder Spread Pattern and Paste Stencil .... 41
Figure A6-3 An Actual Solder Spread Result Showing
the Deposits Counted for Each Line of
the Pattern ................................................... 42
Figure A6-4 Solder Spread Results Using an ROL1
Sn/Pb/Ag Solder Paste on ENEPIG
Deposits ....................................................... 43
Figure A6-5 Solder Spread Results Using an ROL0
Pb-free Solder Paste of the SAC 300
Family on ENEPIG Deposits ........................ 44
Figure A6-6 Solder Spread for Lowest Spread ENEPIG
Sample Showing Evidence of High Contact
Angle and Dewetting for Some Areas of
the Printed Board ......................................... 45
Figure A6-7 Solder Spread Results for Pb-free Solder
Paste as a Function of the EN Layer
Thickness in the ENEPIG Deposit ............... 46
Figure A7-1
Shear Test Coupon ...................................... 48
Figure A7-2
DAGE 5000 Shear Test System .................. 49
Figure A7-3
Solderball Shear Results ............................. 49
Figure A7-4
Sn63Pb37 Test Coupon 19 .......................... 52
Figure A7-5
Sn63Pb37 Test Coupons1&2 ................... 52
Figure A7-6
Sn63Pb37 Test Coupons3&4 ................... 52
IPC-4556 January 2013
vi
Figure A7-7 Sn63Pb37 Test Coupons5&6 ................... 53
Figure A7-8 Sn63Pb37 Test Coupons7&8 ................... 53
Figure A7-9 Sn63Pb37 Test Coupon 18 .......................... 53
Figure A7-10 Sn63Pb37 Test Coupon 19 .......................... 54
Figure A7-11 SAC305 Test Coupons1&2....................... 54
Figure A7-12 SAC305 Test Coupons3&4....................... 54
Figure A7-13 SAC305 Test Coupons5&6....................... 55
Figure A7-14 SAC305 Test Coupons 16 & 17 ................... 55
Figure A7-15 SAC305 Test Coupon 18 ............................. 55
Figure A7-16 SAC305 Test Coupon 19 ............................. 56
Figure A7-17 Solderball Shear Force as a Function of
Palladium Plating Thickness ........................ 56
Figure A8-1 Wire Bond Test Vehicle Showing pin #1,
quadrants 1, 2, 3 and 4 ............................... 58
Figure A8-2 Example of 6 inx8inPanel Containing
1 in x 1in ENEPIG Wire Bond Coupons ...... 60
Figure A8-3 Visual Evaluation of Wire Bonding
Showing Classical Crescents Resulting
in Neck Breaks ............................................. 61
Figure A8-4 (Top) Summary of 1 mil Gold Wire
ENEPIG Destructive Pull Test (DPT)
Results and (Lower) Comparison of
X-Y Directional DPT Values ......................... 62
Figure A11-1a Meniscometer ............................................... 70
Figure A11-1b
Wetting Balance ........................................... 70
Figure A11-2 ENEPIG with Thin and Thick Pd from
Vendors1&2 .............................................. 71
Figure A11-3 Wetting Rate as a Function of Battelle
Class 2 Aging ............................................... 72
Tables
Table 3-1 Requirements of Electroless Nickel Electroless
Palladium Immersion Gold (ENEPIG) Plating ... 4
Table 4-1
Suggested Fabricator Qualification Plan ......... 10
Table 4-2 C=0 Sampling Plan (Sample Size for Specific
Index Value
1
) .................................................... 11
Table A3-1 Comparison of the Accuracy of Measurements
Relative to the C Readings for All Three
Deposits ........................................................... 21
Table A4-1 Summary of XRF Configuration Solutions
Offered for Measurement of ENEPIG
Plating on PCB’s with Advantages and
Disadvantages ................................................. 27
Table A5-1 XRF Measurements of the Nominal
0.5 micron Electroless Palladium
Samples ........................................................... 32
Table A6-S1 Preconditioning and Solder Paste Matrix
Used for Solder Spread Testing for a
Given ENEPIG Chemistry and Electroless
Palladium Thickness ........................................ 40
Table A7-1 Test Coupon Serial Number and Palladium
Thickness ......................................................... 48
Table A7-2 Sn63Pb37 Solderball Shear Test Results
Coupon Set 1 (grams) ..................................... 50
Table A7-3 Sn63Pb37 Solderball Shear Test Results
Coupon Set 2 (grams) ..................................... 50
Table A7-4 SAC305 Solderball Shear Test Results
Coupon Set 1 (grams) ..................................... 51
Table A7-5 SAC305 Solderball Shear Test Results
Coupon Set 2 (grams) ..................................... 51
Table A8-I Twenty-one Panels Marked (a) Whole
Panel, (b) Array and (c) Hand Cut ................... 59
Table A8-II Destructive Wire Bond Pull Test Force
(grams) Results for All 21 ENEPIG
Test Groups ..................................................... 60
Table A8-III Summary of Plating Finish Thicknesses for
Samples Wire Bonded ..................................... 63
Table A9-1 XRF Detectors and Their Limitations at
Typical Count Rates ......................................... 64
Table A11-1 ‘‘Relative Wettability Guideline,’’ Using
Contact Angle (θ
C
) As ‘‘General’’ Metric .......... 70
January 2013 IPC-4556
vii
This Page Intentionally Left Blank
IPC-4556 January 2013
viii