IPC-4556 印制板化学镍钯浸金（ENEPIG）规范ENG.pdf - 第71页

1 mil Gold Wire Bonding and Destructive Pull Testing Evaluation per MIL-STD-883 The 1 mil gold wire bond parameters developed for the ENEPIG plating ﬁnish test vehicles were based upon the same 1 mil gold wire bond appro…

The samples in the package marked ‘‘Hand Cut’’ were not

evaluated.

The individual wire bond coupons were immediately labeled

with the same designation used for the panel prior to removal

of the coupon from the panel and packaging (Table A8-I and

Figure A8-2). To ensure maximum traceability from coupon to

coupon and supplier to supplier, a standard label approach was

adopted for wire bonding to each test vehicle.

The identical wire bond locations on each coupon were used

for wire bonding for each of the 6 different ENEPIG suppliers

followed by destructive pull testing. For example, wire bond

pad location #1 in the X-direction per Figure A8-1 was the

same location used for all 21 panel groups. Wire bond loca-

tion #2 corresponded to location number 2 for all 21 panel

groups. Panel groups were composed of six (6) Suppliers, four

(4) different palladium thicknesses and two (2) levels of sur-

face roughness (Table A8-II).

Figure A8-2 Example of 6 inx8inPanel Containing 1 in x

1in ENEPIG Wire Bond Coupons

Table A8-II Destructive Wire Bond Pull Test Force (grams) Results for All 21 ENEPIG Test Groups

IPC-4556 January 2013

１

２

３

４

５

６

７

８

９

１０

Avg

Min

Max

１

Ｉ

３

１０．１

１０．８

１０．１

８．７５

８．６５

９．２

１０．９

７．７５

９．６６

７．７５

１０．９

３

８．２５

１０．８

１０．９

１１．２

１０．６

１１．５

１１．２

１１．９

１０．２

２

１０．８

８．２５

１１．９

II-SN13-3

X Y

３

９．８

１０．１

９．９

１０．６

８．３

８．８

１１．３

１０．９

１０．３

９．９

９．９８

８．３

１１．３

３

１１

１１．８

１２

１２．２

１１．１

１１．８

１１．６

１１．２

１１．８

３

１１．７

１１

１２．５

II-SN13-4

X Y

３

９．５

８．９

１１

９．７

１０．１

７．６５

９．４

１１．２

１０．６

１２．５

７．３５

３

１０．４

１１．９

９．５３

７．３５

１１．２

１１．５

１２

１２．２

１２．６

１２．３

１２．５

１０．９

１１．５

４

１１．７

１０．４

１２．６

III SN7-2

X Y

３

９．７５

９．５５

９．０５

９．６５

９．７

１０．９

９．５

９．６５

９．７５

９．９

３

１０．６

１１．１

１１．３

１１．５

９．７４

９．０５

１０．９

１１

１１．２

１１．５

１１．９

５

１１．２

１０．６

１１．９

II SN7-3

X Y

３

１０．１

１０．７

１０．４

９．１

９．９

１０．２

５．８

９．５

１０．４

９．６３

５．８

１０．７

３

１０．６

１０．９

７．８

９．８５

９．９

１０．７

１０．９

１０．６

１０．９

６

１０．２

７．８

１０．９

III SN7-4

X Y

３

９．６

９．４

１０．３

１０．１

９．７５

８．８５

９．４

７．９

８．８

３

９．４２

７．９

１０．３

１０．７

９．０５

９．１５

１０．９

１０．１

１１．４

９．３５

１０．５

９．２

１０．１

８．８５

１１．４

７

IVB

X Y

３

８．８５

８．９５

７．２５

８．２

８．２５

７．４５

８．１

８．７５

８．２５

８．５

３

１０．７

１０．３

１０．７

７．２５

８．９５

１１．５

１０

１０．８

１０．９

１１．１

１１．２

８

１０

１１．５

IXB

X Y

３

９．７５

３

１０．４

１０

９．２

９．９５

１０．４

１０．８

９．６５

１０．３

１０．２

９．５５

９．８

１０．９

９．９５

１１．３

８．２５

１２．１

８．２５

８．７

１１．７

１１．３

８．２５

１０．２

９

９．２

１２．１

XXB

X Y

３

９．４

３

１０．５

９

１０．３

９．６１０

９．７５

９．３５

８．８５

９．０５

９．５５

９．８５

１０．４

１０．２

１０．５

９．７５９．７

８．２

１０

９．７

８．２

９．７５１０．８

３

９．６

９．９

９．６

９．４５

８．６５

８．８

８．９５

９．１

１０．５

１０．８９．０５

９．９

８．２６

１０．８９．４２１０．７９．２５１０．３９．３６

３

１０．３

１０．４

１１．３

１０．３

１１．４

１１．２

１１．１

１１．６

１１．９

８．６５

１０．５

１１．２

１１

１０．３

１１．９

VIIA

３

９．７５

９．３

３

１１．８

１０．６

９．９１１．１

１０．７

１０．３

１１．６１０．５

８．８５

１０．４

１２

１１．１

９．７

１０．９

１１．８

１１．５

１０．１

８．８５

１１．１

９．８５

１２．１

１１．３

９．８５

１２

１２．１

VIIB

X Y

３

７．４５

８．１５

８．９５

９．３

１２

９．４５

９．３５

３

９．６５

９．４５

１０．８

９．９

８．９

９．３

１０．５

５．５５

９．２５

９．５５

１１．８

８．９５

１２．４

９．２２

５．５５

９．８４

７．４５

１０．８

１２．４

１

２

３

４

５

６

７

８

９

１０

Avg

Min

１３

Max

VIIIA

３

１０．１１０．５

８．８

９．１５

９．５５

９．９

９．１

９．４５

８．３５

９．９

１０．５

１０．２

９

１１．２

１１．３

７．３５

１２

１２．５

１０．６

１１．９

９．４４

７．３５

１０．５

１０．７

８．８

１２．５

１４

３

９．０５

８．７

８．６５

９．２５

９．９５

１０．１

９．９５

９．６５

１０．６

１２．４

９．４

８．９

１０．１

１０

９．９

９．８

８．９

９．９５

９．４

８．６５

１５

１０．１

８．９

１０１２．４

XIB

X Y

３

８．８

８．９５

９．８

９．４５

９．０５

３

８

９．５

１２．１

１０．１

１０．６

１１．１

１１．５

１１．４

１１．９

９．６

８．４５

１０．９

１０．１

１２．７

１０．９

８

９．４

８．４５

１０．９１２．７

１６

XIIA

X Y

３

９．８

９．３

１０．２

９．６

１０．１

３

１０．２

１０．４

１０．３

１０．３１０．３

８．９５

１０．２

９．５１０．２

１０．２

９．８５

１０．５

１０．２

９．８１０．２

１０．２

８．９５

１０．５

１７

１０．４

XXIB

３

９．８５

９．２５

７．３

８．５

９．７５

９．９

１１．３

１０．４

１０．２

８．９５

１０．４

９．９

９．８５

１０．３

１０．１

９．７

１０．５

１０

９．３５

９．８４

８．９５

１８

９．７

７．３

１０．５１１．３

XXII-2A

３

９．５５９．４

１０８．３５

１０．６

７．２５

９．１５

８．４５

８．７５

１０．２

８．４

８．８５

８．７

９．２５

１０．２

９．９

９．９５

１０．１

１０．１１０．４

９．０５

７．２５

９．６９

８．３５

１０．２１０．６

１９

XXIVA

３

９．９５

９．２

９．５５

１０．８

９．１５

８．９

３

９．２

８．３５

８．５

９．３５

９．９

８．４５

８．９

９．８

９．９

８．８５

１０．１

８．７５

９．３５

９．７５

９．２４

８．３５

１０．１

２０

９．４２

８．７５

１０．８

XXR

３３

８．９５

１０．６

９．０５９．１５

９．５５

１０

９．４

１０．３

１０．７

１０．１

１０．３

７．５

８．８８．８

１０．６

７．７５

９．９５

８．７

８．９１０．２

９．４２

７．５

１０．６

９．４９

２１

７．７５

１０．７

XXVA

３

９．１９．９

１０．２

１０．８

９．４５

１１．８

１０．６

１１．５

１０

１０．２

１０．３

１０

１０．２

１０．５

９．５５

１０．１

１０．２

１０．１１０．２

９．９９

９．１

１０．５

１０．６

９．４５

１１．８

AVG

９．５７

９．６９

９．８４

１０．０１

９．９６

９．８０

９．９９

７．４５

８．１５

７．２５

８．２

８．２５

７．４５

１０．２４

５．８

１０．１４５．５５

１１．６

１０．１７

７．７５

７．３５

９．５７

Min

１０．２４｜８．２５

Max

１１．８

１１．９

１２

１２．２

１２．６

１２．３

１２．５

１１．９

１２．５

５．５５

１１．８０］

１２．５５

1 mil Gold Wire Bonding and Destructive Pull Testing Evaluation per MIL-STD-883 The 1 mil gold wire bond parameters

developed for the ENEPIG plating ﬁnish test vehicles were based upon the same 1 mil gold wire bond approach used in the

development of the wire bond parameters designed for production level substrates with gold plating ﬁnish.

Manufacturing processes and operations are inherently speciﬁc. While automatic wire bonders are similar, they may be dif-

ferent in speciﬁc aspects. Wire bond ﬁxtures and capillaries are critical and play a signiﬁcant role in a successful wire bond-

ing operation. The experience levels of the wire bond operator are also important.

Following removal of the coupons from the panel and marking of the coupons, the parts were baked in a nitrogen oven at

150 °C [302 °F] for 4 hours. The parts were then plasma cleaned and wire bonded. 120 wires were placed onto each con-

ditioned coupon. A minimum of 10 each 1 mil gold wires per coupon in the X-direction and 10 wires in the Y-direction were

bonded, followed by DPT (see Figure A8-1).

The 1 mil gold wire bonding parameters selected for bonding on substrates with an electrolytic gold plating ﬁnish were

modiﬁed for the bonding of ENEPIG coupons with the immersion gold ﬁnish, as follows:

Reduction in Power by 7%

Force was increased by 10%

Time was increased by 100%

Stage temperature at the substrate surface was 150 °C±5°C[302 °F ± 9 °F].

MIL-STD 883 destructive pull test requirements for all ENEPIG test vehicles were met (see Figures A8-3 and A8-4).

Figure A8-3 Visual Evaluation of Wire Bonding Showing Classical Crescents Resulting in Neck Breaks

(Left) Destructive Pull Test value of 12.5 grams / (Right) DPT is 5.5 grams

January 2013 IPC-4556

Vac-High PC-Std. 10 kV

50 m

4/5/2011 *000055 VarcHigh Pc Srd.oky

20 pm

４１５２０４１２００００５６

IPC-4556-a8-4

Figure A8-4 (Top) Summary of 1 mil Gold Wire ENEPIG Destructive Pull Test (DPT) Results and (Lower) Comparison of X-Y

Directional DPT Values

Destructive Pull Values (Grams)

Data S

Plating Methodology: Wilrebond Direction

et #1

Data Set #2

Data Set #3

Data Set #4

Data Set #5

Data Set #6

Data Set #7

Data Set #8

Data Set #9

Data Set #10

Data Set #11

Data Set #12

Data Set #13

Data Set #14

Data Set #15

Data Set #16

Data Set #17

Data Set #18

Data Set #19

Data Set #20

Data Set #21

Data Set #22

Data Set #23

Data Set #24

Data Set #25

Data Set #26

Data Set #27

Data Set #28

Data Set #29

Data Set #30

Data Set #31

Data Set #32

Data Set #33

Data Set #34

Data Set #35

Data Set #36

Data Set #37

Data Set #38

Data Set #39

Data S

et #40

Summary of NiPdAu Destructive Wire Bond Pull Tes

Data Set #41

Data Set #42

t for 1-MIL Gold Wire

I II-SN13-3 II-SN13-4 III-SN7-2 III-SN7-3 III-SN7-4

IVB IXB XXB

VA VIIA VIIIA XB

XIB

XIIA

XXIB XXII2-A XXIVA

Participants

Uyemura - Japan

Uyemura - US

XXR

XXVA

DOW

MacDermid

Cookson-Ethone

OMG

Atotech

Mil-STD 883 Requirement = 3 Grams

ENEPIG Plating Finish 1-mil Gold Wirebond Results X-Y Bond DPT Comparison

Min

Median

Max

IPC-4556 January 2013