allied-catalog-2013.pdf - 第18页
Mounting 18 (800) 675-1 1 18 (USA & Canada) (310) 635-2466 (Worldwide) QuickSet QuickCure Features: Cure time: 15-20 minutes 82 Shore D hardness Peak curing temperature: 60 °C/140 °F Mixed 2:1 (Powder…
Mounting
17
www.alliedhightech.com
Item Description
135-10007 Black, 25 lb. (11.5 kg)
135-10012 Green, 25 lb. (11.5 kg)
135-10017 Red, 25 lb. (11.5 kg)
135-10005-B Black, 250 lb. (113 kg)
135-10010-B Green, 250 lb. (113 kg)
135-10015-B Red, 250 lb. (113 kg)
135-10005 Black, 5 lb. (2.3 kg)
135-10010 Green, 5 lb. (2.3 kg)
135-10015 Red, 5 lb. (2.3 kg)
Phenolic
Black, green and red phenolic powders are used
for routine applications, when color coding for
material identification, or as backfill for more
expensive powders.
Black Glass-Filled Epoxy
150-10110 25 lb. (11.5 kg)
150-10105 5 lb. (2.3 kg)
Item Unit
This very hard epoxy mounting
powder with glass fiber filler
provides excellent chemical
resistance, specimen adhesion and
edge retention. Mold release is
recommended (see page 20).
155-20010 Graphite-Based, 1 lb. (0.45 kg)
155-20015 Graphite-Based, 5 lb. (2.3 kg)
155-10010 Copper-Based, 1 lb. (0.45 kg)
Item Description
Transparent Thermoplastic
Compression mounting is an economical method
of encapsulating samples that can withstand the
pressure and heat of the mounting process.
A variety of mounting powders and preforms are
available. All powders include a measuring scoop.
135-40005 Black, for 2" or 50 mm Mold (Pk/100)
135-30010 Green, for 1.5" or 40 mm Mold (Pk/500)
135-30015 Red, for 1.5" or 40 mm Mold (Pk/500)
135-20005 Black, for 1.25" or 30 mm Mold (Pk/500)
135-30005 Black, for 1.5" or 40 mm Mold (Pk/500)
135-20010 Green, for 1.25" (30 mm) Mold (Pk/500)
135-20015 Red, for 1.25" (30 mm) Mold (Pk/500)
Item Description
Phenolic Preforms
Conductive
Compression Mounting
Phenolic preforms require no
measuring, are cleaner than loose
powder and are easy to use.
160-10010 Mineral-Filled, 5 lb. (2.3 kg)
160-10005 Glass-Filled, 5 lb. (2.3 kg)
Item Description
Blue Diallyl Phthalate
This mounting powder is filled with
glass or mineral and provides
excellent edge retention and
chemical resistance.
These mounting powders are used
to make conductive samples for
scanning electron microscopy and
electrolytic polishing. The copper-
based powder provides very good
edge retention and should be
used for analyzing samples where
copper is not a primary constituent.
The graphite-based powder offers
a higher hardness and is
recommended for specimens
without carbon as a component.
This is a clear mounting powder that
allows easy sample observation.
165-10005 5 lb. (2.3 kg)
Item Unit
165-10025 25 lb. (11.5 kg)
Mounting
18
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
QuickSet
QuickCure
Features:
Cure time: 15-20 minutes
82 Shore D hardness
Peak curing temperature: 60 °C/140 °F
Mixed 2:1 (Powder:Liquid) by volume
Pressure chamber recommended
Features:
Cure time: 6-8 minutes
84 Shore D hardness
Excellent hole penetration on PCBs
Peak curing temperature: 60 °C/140 °F
Mixed 2:1 (Powder:Liquid) by volume
170-10005 5 lb. Powder (2.3 kg)
170-10026 2.5 gal. Liquid (9.5 L)
175-10005 Pressure Chamber
170-10020 2 lb. Powder (0.9 kg)
170-10025 32 oz. Liquid (950 mL)
Item Description
170-10000 QuickCure Kit
Includes: 5 lb. powder, two (2) 32 oz. liquid, 50 mixing
cups, 50 stir sticks and measuring scoop
185-10005 5 lb. Powder (2.3 kg)
185-10020 2 lb. Powder (0.9 kg)
185-10030 25 lb. Powder (11.5 kg)
185-10036 5 gal. Liquid (19 L)
185-10035 2.5 gal. Liquid (9.5 L)
185-10025 32 oz. Liquid (950 mL)
185-10010 64 oz. Liquid (1.9 L)
Item Description
185-10000 QuickSet Kit
Includes: 5 lb. powder, 64 oz. liquid, 50 mixing cups,
50 stir sticks and measuring scoop
Item Description
Pressure Chamber
170-10035 25 lb. Powder (11.5 kg)
185-10040 100 lb. Powder (45 kg)
Cold Mounting
QuickCure Acrylic
QuickSet Acrylic
The use of pressure with acrylics and epoxies prevents
the formation of small bubbles (outgassing) caused by
elevated exothermic temperatures during hardening. This
also produces clearer mounts with better edge retention,
improved adhesion and reduced shrinkage. Maximum
rating: 35 psi (2.4 bar)
QuickCure offers excellent
clarity, flow, bonding and
grinding characteristics for a
wide variety of materials.
QuickSet is used to
encapsulate a wide variety
of specimens, especially
printed circuit boards and
other electronic components.
Cold mounting is recommended when encapsulating
samples that cannot withstand the heat and pressure of
compression mounting, when better flow and penetration
of the mounting resin is needed, or when a large quantity
of samples must be encapsulated at once.
Acrylics: Typically used for their rapid cure times, or
when large volume sample throughput is needed.
Epoxies: Typically used for excellent flow and penetration,
or when better adhesion, chemical resistance, less
shrinkage and clarity are required.
Dims: 4.75" (120 mm) Diameter x 3.75" (95 mm) Depth
Mounting
19
www.alliedhightech.com
EpoxyMount
EpoxySet
Item Description
The VacuPrep
™
removes trapped air from uncured
epoxy, filling open pores and cavities in samples to provide
maximum bonding and support. This maintains sample
integrity during abrasive preparation, reducing the chance
of cracking or delamination.
EpoxyMount
VacuPrep
™
Impregnation System
Item Description
145-10005 EpoxyMount Kit
Includes: 120 oz. resin, 40 oz. hardener, 50 mixing cups,
50 stir sticks and dispensing pump
145-10010
145-10015 40 oz. Hardener (1.1 kg)
145-10025 48 oz. Resin (1.4 kg)
145-10030
175-30000 VacuPrep
™
120 oz. Resin (3.4 kg)
16 oz. Hardener (450 g)
EpoxySet
This fast-curing epoxy hardens in 2 hours at room
temperature while still maintaining quality characteristics
such as good adhesion, hardness and minimal shrinkage.
Features:
Cure time: 2 hours at room temperature for
1.25" diameter x 1" thick mounts (Heat [38 °C/100 °F]
accelerates cure time to 45 min.)
87 Shore D hardness
Peak curing temperature: 66 °C/150 °F
Mixed 10:3 (Resin:Hardener) by weight
With very low viscosity, EpoxySet offers excellent flow and
penetration. It is extremely hard, crystal clear and exhibits
firm adhesion with virtually no shrinkage. Low curing
temperature is ideal for heat sensitive samples.
Features:
Cure time: 8 hours at room temperature for
1.25" diameter x 1" thick mounts (Heat [38 °C/100 °F]
accelerates cure time to 45 min.)
89 Shore D hardness
Excellent adhesion, with virtually no shrinkage
Low viscosity, allowing penetration into small
crevices/holes
Peak curing temperature: 54 °C/130 °F
Mixed 100:12 (Resin:Hardener) by weight
Features:
Through-port for optional epoxy fill under vacuum
Cup holder for mixed epoxy
Clear top to allow sample viewing during process
Pull of up to 28 inHg vacuum
Large 10" diameter x 4.5" (254 x 114 mm) deep chamber;
capacity of up to (30) 1¼" (32 mm) cups
Stainless steel components that resist corrosive gases
Quiet, pump-free operation
80 psi (5.5 bar) compressed air operation
Dims: 13" W x 18" D x 6" H (330 x 457 x 152 mm)
Weight: 21 lb. (9.5 kg)
Two (2) year warranty
Designed & manufactured by Allied in the USA
145-20005
145-20010
145-20015
145-20020
128 oz. Resin (3.6 kg)
51 oz. Resin (1.5 kg)
16 oz. Hardener (450 g)
7 oz. Hardener (200 g)
Item Description
145-20000 EpoxySet Kit
Includes: 128 oz. resin, 16 oz. hardener, 50 mixing cups,
50 stir sticks and dispensing pump