allied-catalog-2013.pdf - 第23页

Grinding / Polishing 23 MetPrep 4 ™ Systems (Pages 24-26) MultiPrep ™ Systems (Pages 30-31) DualPrep 3 ™ Systems (Pages 24-26) T winPrep 5 ™ (Page 32) MetPrep 3 ™ Systems (Pages 24-26) M-Prep ™ Machines (Page 32) AD-5 ™ …

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Mounting
22
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
Specications:
Dimensions: 19" W x 19" D x 19" H (483 x 483 x 483 mm)
Weight: 72 lb. (33 kg)
Shown with door removed for visual clarity
EpoxyBond 110,
4 oz. Kit
TEM/FIB Sample Adhesives
Kits Include: Mixing cups, spring clips (large and small)
and mixing instructions.
30-8000 Mount Storage Cabinet
Mounting Wax
Item Description
71-10005 EpoxyBond 110, 4 oz. (120 mL) Kit
71-10000 EpoxyBond 110, 0.5 oz. (15 mL) Kit
Item Description
71-20000 M-Bond 610, 25 g Systems (Pk/4)
71-40045 LocTite
®
460
™
Liquid, 20 g Bottle
30-8010 Mount Divider, (100) 1.25" or 30 mm diameter
30-8005 Mount Divider, (144) 1" or 25 mm diameter
30-8020 Mount Divider, (36) 2" or 50 mm diameter
30-8015 Mount Divider, (61) 1.5" or 40 mm diameter
Accessories
71-10400 Sheet Wax, 4" Diameter Disc (Pk/50)
71-10040 Mounting Wax, Clear, 50 g Stick
71-10210 Sheet Wax Dissolver, 8 oz. (240 mL) Bottle
EpoxyBond 110
EpoxyBond 110 is a hard, fast-curing epoxy adhesive
commonly used to bond glass cover slips to small or
delicate samples (i.e., ICs), precoat samples prior to
encapsulation, fill small holes/cavities and for other
mounting applications. The two-part formula is mixed
10:1 and cures bubble-free in 5 minutes at 150 °C
(302 °F). The curing temperature can also be reduced to
prevent damage to heat sensitive samples. Once cured,
it is chemically resistant to etchants and will not outgas
under vacuum.
Clear wax provides a quick and strong bond between
samples and fixtures for cutting and/or polishing. It melts
at 49 °C (120 °F) and is soluble in acetone.
Sheet wax provides uniform distribution of wax to improve
registration accuracy of the sample to the fixture
(i.e., dicing applications). It flows at 100 °C (212 °F) and is
soluble in sheet wax dissolver.
Mount Storage Cabinet
The cabinet provides storage for polished mounts to
prevent corrosion and dust contamination. The 10
cloth-lined drawers absorb moisture and hold mount
dividers for easy organization. The locking door provides
a sealed environment. Rechargeable desiccant canister
is included. Dividers are sold separately.
M-Bond 610 is excellent for adhering multiple samples
for TEM dimpling and bonding of post-polished samples
to grids for TEM and FIB observation. It is chemically
resistant and provides a very thin glue line that ion mills
evenly.
LocTite
®
460
™
is a thin, fast-curing glue used as an
alternative to wax for adhering samples to Pyrex
®
for
TEM/FIB thinning and other applications, and is soluble
in acetone.
Item Description
Item Description
Grinding / Polishing
23
MetPrep 4
™
Systems
(Pages 24-26)
MultiPrep
™
Systems
(Pages 30-31)
DualPrep 3
™
Systems
(Pages 24-26)
TwinPrep 5
™
(Page 32)
MetPrep 3
™
Systems
(Pages 24-26)
M-Prep
™
Machines
(Page 32)
AD-5
™
Fluid
Dispenser
(Page 36)
New!
24
Grinding / Polishing
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
The MetPrep
™
and DualPrep
™
grinding and
polishing machines, with the PH
™
line of power
heads, are powerful systems for semiautomatic
operation, ideal for low to high volume sample
preparation requirements. A wide variety of
combinations provides ideal solutions that
accommodate any lab, application or material.
Intuitive menu navigation with user-friendly
touchpad interface and backlit LCD make them
easy to use and program. The microprocessor
based system allows up to 25 programmable steps,
including parameters for platen speed, comp/
contra rotation (sample holder/platen), cycle time,
fluid selection, sample force (LbF or N), sample
rotation speed, water rinse and force reduction
(on/off, %).
A “Procedure Development” mode allows in-process
adjustments to platen speed, sample force and
sample rotation speed to determine optimum
parameters. Jog mode enables convenient variable
speed platen rotation without activating the power
head to allow initial charging of cloths or manual
grinding/polishing.
Either standard or magnetic platens may be used
with any plain/adhesive backed or magnetic system
disc.
Standard/magnetic platens (see pages 34 & 35)
and consumables are sold separately.
Semiautomatic Grinding/Polishing Systems
MetPrep 4
™
/PH-4
™
System
Grinder/Polisher Features:
Programmable up to 25 grinding/polishing steps,
including parameters for force mode, platen speed,
comp/contra rotation (sample holder/platen), cycle
time, fluid selection, sample force (LbF or N), sample
rotation speed, water rinse and force reduction
(on/off, %)
Variable platen and jog speed in 10 RPM increments
(see RPM specifications in chart on page 26)
Variable cycle time: 0-120 minutes
(15 second increments)
Seamless integration with optional AD-5
™
Fluid
Dispenser for automatic operation
Powerful motors with constant high torque output
Electronic coolant control with adjustable flow
control valve(s)
Touchpad switches to control all functions
Sturdy RIM, aluminum and stainless steel
construction
Overflow diversion to protect internal components
Emergency shut-off switch
compliant for EU
Two (2) year warranty
Designed & manufactured by Allied in the USA
MetPrep 3
™
/PH-3
™
System with AD-5
™
Fluid Dispenser